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    Fixation device for electronic display
    162.
    发明授权
    Fixation device for electronic display 失效
    电子显示器固定装置

    公开(公告)号：US4813642A

    公开(公告)日：1989-03-21

    申请号：US857346

    申请日：1986-04-30

    Applicant: Kazuhiro Matsui

    Inventor： Kazuhiro Matsui

    IPC: G09F9/00 ,  H05K3/30 ,  H05K3/34 ,  H05K7/12 ,  F16L3/08

    CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K2201/10568 ,  H05K2201/10606 ,  H05K2203/167 ,  H05K3/3447

    Abstract: An electronic display fixation device fixation device which comprises a flat platelike rest (1) on which an electronic display (2) is set, holding members (4, 5) extending from each one of the opposed longitudinal edges of the rest (1) for retaining the longitudinal end of the electronic display (2), fixing members (26, 27, 28) extending from the back surface of the platelike rest (1) for fixing the platelike rest on the circuit board, a pair of attachment members which are composed of projections (E) respectively formed on at least one of the holding members (4, 5) and on the rest and insertion holes (F) to which the abovementioned projections (E) are inserted, and engaging members (H, 41, 43) for attaching the holding members (4, 5) to the platelike rest (1) so as to be pivotaly movable and for engaging the holding members (4, 5) at the position where the electronic display (2) is retained.

    Abstract translation: 一种电子显示固定装置固定装置，其特征在于，具有设置有电子显示器（2）的平板状搁板（1），从其余部分（1）的相对的纵向边缘中的每一个延伸的保持构件（4,5） 保持电子显示器（2）的纵向端部，从板状搁板（1）的后表面延伸的固定构件（26,27,28），用于将板状搁板固定在电路板上，一对附接构件 由分别形成在至少一个保持构件（4,5）上的突起（E）和插入有上述突起（E）的其余部分和插入孔（F）构成，以及接合构件（H，41， 43），用于将保持构件（4,5）附接到平板状搁架（1），以便可枢转地移动，并且用于在保持电子显示器（2）的位置处与保持构件（4,5）接合。

    Inlet type noise filter directly mounted to a PC board
    163.
    发明授权
    Inlet type noise filter directly mounted to a PC board 失效
    进口型噪音滤波器直接安装在PC板上

    公开(公告)号：US4795991A

    公开(公告)日：1989-01-03

    申请号：US002483

    申请日：1987-01-12

    Applicant: Yasuaki Saito ,  Tooru Harada

    Inventor： Yasuaki Saito ,  Tooru Harada

    IPC: H01R12/50 ,  H05K1/02 ,  H05K3/30 ,  H05K7/10 ,  H01R4/54 ,  H03H7/00

    CPC classification number: H05K3/306 ,  H01R23/6873 ,  H05K1/0243 ,  H05K2201/1006 ,  H05K2201/10446 ,  H05K2201/10568 ,  H05K2201/10598 ,  H05K2201/10969

    Abstract: An inlet type noise filter which can be directly mounted to a substrate or the like includes a casing, a pair of output terminals, a ground terminal projecting from a surface of the casing and a retaining portion projecting from the same surface of the casing that the terminals project from. The retaining portion extends through bores in the substrate and engage the substrate to secure the noise filter to the substrate. The terminals can then be operatively electrically connected by soldering or the like to conductive patterns on the substrate.

    Abstract translation: 可以直接安装到基板等的入口型噪声滤波器包括壳体，一对输出端子，从壳体的表面突出的接地端子和从壳体的相同表面突出的保持部分， 终端项目。 保持部分延伸穿过衬底中的孔并且接合衬底以将噪声滤波器固定到衬底。 然后，端子可以通过焊接等与基板上的导电图案可操作地电连接。

    Chip carrier mounting arrangement
    164.
    发明授权
    Chip carrier mounting arrangement 失效
    芯片载体安装布置

    公开(公告)号：US4581680A

    公开(公告)日：1986-04-08

    申请号：US688104

    申请日：1984-12-31

    Applicant: Robin E. Garner

    Inventor： Robin E. Garner

    IPC: H05K3/34 ,  H05K1/18

    CPC classification number: H05K3/3436 ,  H01L2924/0002 ,  H05K2201/09036 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/10568 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: A leadless ceramic chip carrier for surface mounting on an epoxy printed circuit board is shown featuring an arrangement for relieving the thermally induced stress by progressively lengthening the attaching solder pillars as the distance from the center line of the ceramic chip increases to avoid exceeding the elastic limits of the solder.

    Abstract translation: 用于表面安装在环氧树脂印刷电路板上的无引线陶瓷芯片载体被示出具有一种用于通过逐渐地延长连接焊料柱来缓解热诱导应力的布置，因为距离陶瓷芯片的中心线的距离增加以避免超过弹性极限 的焊料。

    Package for rugged electronics
    165.
    发明授权
    Package for rugged electronics 失效
    用于坚固电子产品的包装

    公开(公告)号：US4513064A

    公开(公告)日：1985-04-23

    申请号：US450617

    申请日：1982-12-17

    Applicant: Ira R. Marcus

    Inventor： Ira R. Marcus

    IPC: H01R12/04 ,  H05K3/36 ,  H05K7/02 ,  H05K7/14 ,  H01R9/09

    CPC classification number: H05K7/14 ,  H05K3/366 ,  H05K7/023 ,  H05K2201/047 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10568 ,  H05K2201/10598 ,  Y10T428/12264 ,  Y10T428/12375

    Abstract: A substrate which serves as an element for building an electronic module for ordnance applications comprising a body portion, for receiving electronic components, and a plurality of tab means extending therefrom for interlocking with complementary tab means on another similar substrate. The tab means may extend from the top, bottom, and/or sides of the substrate, and serve to mechanically and electrically interconnect with complementary tab means or apertures on adjacent substrates to form an electronic module of high mechanical strength and reliability. Such an electronic module may be assembled from at least three substrates. Each substrate has at least two tab means on each side edge thereof.

    Abstract translation: 用作构建用于军事应用的电子模块的元件的基板，包括用于接收电子部件的主体部分和从其延伸的多个突出部件，用于与另一相似基板上的互补突片装置互锁。 突片装置可以从基板的顶部，底部和/或侧面延伸，并且用于与相邻基板上的互补的接片装置或孔机械地和电气地互连，以形成具有高机械强度和可靠性的电子模块。 这样的电子模块可以由至少三个基板组装。 每个基板在其每个侧边缘上具有至少两个拉片装置。

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