公开(公告)号：US07531895B2

公开(公告)日：2009-05-12

申请号：US11552803

申请日：2006-10-25

Applicant: Bernhard Lange ,  William David Boyd

Inventor： Bernhard Lange ,  William David Boyd

IPC: H01L23/49 ,  H01L23/495

CPC classification number: H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.

Abstract translation: 一种包括引线框架的集成电路（IC）封装。 引线框架具有欠压部分和引线。 凹陷部分具有被配置为远离安装板的外表面和被配置为面向安装板的内表面。 引线从外表面弯曲，并且每个引线具有联接到IC的第一端和被配置为穿过延伸穿过安装板的多个安装孔中的一个的第二端。 IC耦合到内表面。

公开(公告)号：US20090097211A1

公开(公告)日：2009-04-16

申请号：US12035524

申请日：2008-02-22

Applicant: Tsu-Cheng Chen ,  Chih-Hung Chiang ,  Kai-Hung Huang ,  Yi-Hwa Hsieh

Inventor： Tsu-Cheng Chen ,  Chih-Hung Chiang ,  Kai-Hung Huang ,  Yi-Hwa Hsieh

IPC: H05K1/14

CPC classification number: H05K9/00 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10871

Abstract: A circuit module to be mounted on a system board having multiple through holes is disclosed. The circuit module includes a circuit board, multiple SIP connectors and multiple sheathing elements. Each of the SIP connectors includes a connecting part disposed at a first end thereof and fixed on the circuit board and an insertion part disposed at a second end thereof. Each of the sheathing elements includes a plurality of clamping arms and a receiving portion. The receiving portion is defined by the clamping arms for receiving the insertion part of a corresponding SIP connector. The insertion part is clamped by the clamping arms such that the sheathing element is fixed on the SIP connector. The sheathing element is sustained against a surface of the system board after the insertion part is inserted into a corresponding through hole of the system board, so that the support area between the SIP connector and the system board is increased.

Abstract translation: 公开了一种要安装在具有多个通孔的系统板上的电路模块。 电路模块包括电路板，多个SIP连接器和多个护套元件。 每个SIP连接器包括设置在其第一端并固定在电路板上的连接部分和设置在其第二端的插入部分。 每个护套元件包括多个夹持臂和接收部分。 接收部分由用于接收相应SIP连接器的插入部分的夹持臂限定。 插入部被夹持臂夹紧，使得护套元件固定在SIP连接器上。 在将插入部插入系统板的相应通孔中之后，护套元件被支撑在系统板的表面上，从而增加了SIP连接器与系统板之间的支撑区域。

公开(公告)号：US07222776B2

公开(公告)日：2007-05-29

申请号：US10927413

申请日：2004-08-26

Applicant: Naoto Ishida ,  Kouji Asano

Inventor： Naoto Ishida ,  Kouji Asano

IPC: B23K31/02 ,  B23K35/12 ,  H01L23/52

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 接合销通过使用在加热温度下未熔化的材料来制造，该材料将接合销接合到相对方垫81.接合销由具有比通孔的开口直径更大的直径的接合头部11构成。 接合销形成用于接合和连接到对方垫的接合部分。 连接销具有直径比通孔小的腿部12。 腿部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。代替接合销，可以将大致具有球形的接合球接合到通孔 孔由导电材料制成。

公开(公告)号：US07025604B2

公开(公告)日：2006-04-11

申请号：US10404877

申请日：2003-03-31

Applicant: Karl T. Fronk

Inventor： Karl T. Fronk

IPC: H01R12/00

CPC classification number: H01R12/523 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1432 ,  H05K2201/10303 ,  H05K2201/10871

Abstract: The present invention provides a terminal pin for connecting a DC—DC power converter module or the like to a PCB. The pin has improved current carrying capabilities by having a diameter over most of its length that is larger than the ends that are connected to either the module or PCB. The larger diameter also provides for improved heat flow from the power converter module to the PCB. A smaller diameter portion near the PCB board provides for improved flow of solder between the pin and the PCB. A stand-off member is also provided to maintain the module and PCB at a predetermined stand-off distance.

Abstract translation: 本发明提供一种用于将DC-DC电力转换器模块等连接到PCB的端子引脚。 该引脚通过具有大于其大部分长度的直径大于连接到模块或PCB的端部而具有改善的载流能力。 较大的直径还提供了从功率转换器模块到PCB的改进的热流。 PCB板附近的较小直径的部分提供了在引脚和PCB之间改善的焊料流动。 还提供了一个支撑构件以将模块和PCB保持在预定的间隔距离。

公开(公告)号：US20050023034A1

公开(公告)日：2005-02-03

申请号：US10927413

申请日：2004-08-26

Applicant: Naoto Ishida ,  Kouji Asano

Inventor： Naoto Ishida ,  Kouji Asano

IPC: H05K1/11 ,  H01L23/12 ,  H01L23/498 ,  H01R12/00 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46 ,  H01R12/04

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 接合销通过使用在加热温度下未熔化的材料来制造，该材料将接合销接合到相对方垫81.接合销由具有比通孔的开口直径更大的直径的接合头部11构成。 接合销形成用于接合和连接到对方垫的接合部分。 连接销具有直径比通孔小的腿部12。 腿部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。代替接合销，可以将大致具有球形的接合球接合到通孔 孔由导电材料制成。

公开(公告)号：US06790056B2

公开(公告)日：2004-09-14

申请号：US10393434

申请日：2003-03-20

Applicant: Charles J. Buondelmonte ,  Joseph P. Mendelsohn ,  Richard William Brown ,  Min Li ,  Richard Franklin Schwartz ,  Sanjay S. Upasani

Inventor： Charles J. Buondelmonte ,  Joseph P. Mendelsohn ,  Richard William Brown ,  Min Li ,  Richard Franklin Schwartz ,  Sanjay S. Upasani

IPC: H01R1200

CPC classification number: H05K3/368 ,  B23K2101/42 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K2203/0415 ,  Y10T29/53174

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole. Upon heating to a solder reflow temperature, a ring of solder, around the periphery of the head portion of the pin and the shoulder portion of the socket, flows under the head of the pin and the shoulder of the socket, thereby forming a soldered electrical connection between the pin and the first board, and the socket and the second board. By aligning the pin with the socket and inserting the tail portion of the pin into the cavity of the socket, a separable reliable mechanical and electrical interconnection is formed between the first board and the second board.

Abstract translation: 一种用于在两个电路板之间提供机械/电气互连的方法以及因此需要的互连部件包括每个具有尾部，肩部和头部的销和插座。 销的尾部的尺寸设计成适合于第一板的电镀通孔中，头部的尺寸被设计成允许自动装置捕获头部并且搁置在电镀通孔的顶部上，当 插入其中，并且肩部的尺寸相对于电镀通孔的尺寸，以便放置在电镀通孔内，并允许预定量的焊料在头部下方流动并进入电镀通孔，而不是如 远离尾部，从而有助于将销定位在通孔中。 在加热到回流焊温度时，围绕销的头部周边和插座的肩部的焊料环在插头的头部和插座的肩部下方流动，从而形成焊接的电气 引脚与第一板，插座和第二板之间的连接。 通过将销与插座对准并将销的尾部插入插座的空腔中，在第一板和第二板之间形成可分离的可靠的机械和电气互连。

公开(公告)号：US06784374B2

公开(公告)日：2004-08-31

申请号：US10195865

申请日：2002-07-15

Applicant: Naoto Ishida ,  Kouji Asano

Inventor： Naoto Ishida ,  Kouji Asano

IPC: H05K116

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Abstract translation: 印刷电路板具有电路基板6，电路基板6具有导体电路5和通孔60，并且还具有插入到通孔中的接合销1。 通过使用在加热温度下未熔合的材料制造接合销，该材料将接合销接合到对方垫81.接合销由具有比通孔的开口直径更大的直径的接合头部11构成。 接合销形成用于接合和连接到对方垫的接合部分。 连接销具有直径比通孔小的腿部12。 腿部插入到通孔中，并且通过诸如焊接材料20等的导电材料接合到通孔。代替接合销，可以将大致具有球形的接合球接合到通孔 孔由导电材料制成。

公开(公告)号：US20030145460A1

公开(公告)日：2003-08-07

申请号：US10067244

申请日：2002-02-07

Inventor： Rebecca A. Jessep ,  David W. Boggs ,  Carolyn McCormick ,  John H. Dungan ,  Daryl A. Sato

IPC: H01L023/52 ,  H05K003/30

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/1319 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/145 ,  H05K3/303 ,  H05K3/308 ,  H05K2201/09809 ,  H05K2201/10022 ,  H05K2201/10303 ,  H05K2201/1053 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Standoff arrangements to control distance and provide electrical function.

Abstract translation: 隔离布置来控制距离并提供电气功能

公开(公告)号：US06541762B2

公开(公告)日：2003-04-01

申请号：US09984283

申请日：2001-10-29

Applicant: Dong-Hoon Kang ,  Joon-Ki Paik

Inventor： Dong-Hoon Kang ,  Joon-Ki Paik

IPC: H01J4014

CPC classification number: G06F3/0317 ,  H05K1/0274 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/09072 ,  H05K2201/10303 ,  H05K2201/10477 ,  H05K2201/10871

Abstract: A sub chip on board for an optical mouse is disclosed. The chip on board has a sub PCB having both a plurality of input/output pads and a plurality of pin holes. A sensor die has an optical sensor wire-bonded to said input/output pads for sensing received light, and is attached to a bottom surface of the sub PCB. A transparent resin covers the sensor die at the bottom surface of the sub PCB. A cap is attached to the bottom surface of the sub PCB such that the cap covers the transparent resin, and has a hole for guiding the received light to said optical sensor. A main PCB has both a hole for guiding the received light to the optical sensor and a plurality of pin holes corresponding to the pin holes of the sub PCB. A plurality of pins are commonly inserted into the pin holes of both the main PCB and the sub PCB.

Abstract translation: 公开了一种用于光电鼠标的子芯片。 板上的芯片具有具有多个输入/输出焊盘和多个销孔的子PCB。 传感器管芯具有导线接合到所述输入/输出焊盘的光学传感器，用于感测接收到的光，并且附接到子PCB的底表面。 透明树脂覆盖子PCB底面的传感器芯片。 盖子附接到副PCB的底表面，使得帽覆盖透明树脂，并且具有用于将接收的光引导到所述光学传感器的孔。 主PCB具有用于将接收的光引导到光学传感器的孔和与子PCB的针孔对应的多个针孔。 多个引脚通常插入主PCB和副PCB的引脚孔中。

公开(公告)号：US20020016096A1

公开(公告)日：2002-02-07

申请号：US09972697

申请日：2001-10-04

Inventor： James Keith Custer ,  James Hiram Roberson ,  William Kerr Veitschegger

IPC: H05K001/00

CPC classification number: H01R12/7082 ,  H01R12/523 ,  H01R12/58 ,  H05K3/1216 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/10303 ,  H05K2201/10871 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49163

Abstract: A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins are inserted in a circuit board from the top (component side). Provided the heads of the pins are thin enough to lie beneath a solder stencil, the pins may be pre-installed on the circuit board and solder applied to the pins at the same time solder is applied to other regions of the board. Thus, known surface mount techniques may be employed to form solder connections between the pins and conductive traces on the circuit board, which facilitates the automation of the previously manual operation of soldering the printed circuit pins separately.

Abstract translation: 提供了允许在电路板之间廉价自动构建互连的方法。 根据本发明，印刷电路引脚从顶部（部件侧）插入到电路板中。 如果引脚的头部足够薄以便位于焊料模板之下，则引脚可以预先安装在电路板上，并且将焊料施加到引脚上，同时将焊料施加到板的其它区域。 因此，可以采用已知的表面贴装技术来形成引脚和电路板上的导电迹线之间的焊接连接，这有助于分别对印刷电路引脚进行以前的手动操作的自动化。