Abstract:
An inertial sensor has an interior filled with a relatively low viscosity fill gas. To that end, the inertial sensor has a housing forming the noted interior, and a movable component within the interior. The inertial sensor also has the noted fill gas within the interior. The fill gas has a viscosity that is less than the viscosity of nitrogen under like conditions. For example, when subjected to the same temperatures and pressures, the fill gas has a viscosity that is less than the viscosity of nitrogen.
Abstract:
A plane vibrator of an angular velocity sensor and a movable member of an acceleration sensor are provided in a spaced floating state on the same substrate. A lid is formed so as to cover and be spaced from the upper side of the plane vibrator and the movable member. A space defined by the substrate and the lid is sectioned into a angular velocity sensor space and an acceleration sensor space by use of a sectioning wall. The angular velocity sensor space is hermetically sealed to be in the vacuum state. The acceleration sensor space is hermetically sealed to be under atmospheric pressure. The plane vibrator is vibrated at a high frequency and a large amplitude so that the angular velocity detection sensitivity is enhanced. The movable member, even if vibration of the plane vibrator is transmitted thereto, is prevented from vibrating at a high frequency and a large amplitude, due to the damping effect of air. Thus, the acceleration detection sensitivity is enhanced.
Abstract:
An acceleration sensor includes a base portion shaped into the form of a frame, a weight portion located inside the base portion and disposed away from the base portion, a flexible beam portion disposed over an upper portion of the base portion and an upper portion of the weight portion and a stopper portion disposed above the base portion and disposed over the weight portion away from the weight portion, wherein the stopper portion restricts an amount of displacement of the weight portion in the direction of the stopper portion.
Abstract:
The present invention provides a micro inertia sensor and a method of manufacturing the same, the micro inertia sensor includes a lower glass substrate; a lower silicon including a first border, a first fixed point and a side movement sensing structure; an upper silicon including a second border, a second fixed point being connected to a via hole, in which a metal wiring is formed, on an upper side, and an sensing electrode, which correspond to the first border, the first fixed point and the side movement sensing structure; a bonded layer by a eutectic bonding between the upper silicon and the lower silicon; and a upper glass substrate, being positioned on an upper portion of the upper silicon, for providing the via hole on which an electric conduction wiring is formed, thereby aiming at the miniaturization of the product and the simplification of the process.
Abstract:
A method of manufacturing an external force detection sensor in which a sensor element is formed by through-hole dry etching of an element substrate, and an electrically conductive material is used as an etching stop layer during the dry etching.
Abstract:
A method is described for producing surface micromechanical structures having a high aspect ratio, a sacrificial layer (20) being provided between a substrate (30) and a function layer (10), trenches (60, 61) being provided by a plasma etching process in the function layer (10), at least some of these trenches exposing surface regions (21, 22) of the sacrificial layer (20). To increase the aspect ratio of the trenches, an additional layer (70) is deposited on the side walls of the trenches in at least some sections, but not on the exposed surface regions (21, 22) of the sacrificial layer (20). In addition, a sensor is described, in particular an acceleration sensor or a rotational rate sensor.
Abstract:
An electronic component includes a composite semiconductor substrate (110, 810) having a first side (111) opposite a second side (112), a semiconductor device (160, 170) at the first side of the composite semiconductor substrate, and a transducer (400, 600, 900) at the second side of the composite semiconductor substrate.
Abstract:
A micromechanical component is described, in particular an acceleration sensor or a rotational speed sensor having functional components which are movably suspended over a substrate, opposite surfaces of the functional components being movable toward one another. The opposite surfaces of the functional components are at least partially coated with a conductive film.
Abstract:
A method for coating a micro-electromechanical system (MEMS) device is provided. A coating material, such as a ceramic slurry, may be utilized to form a gas permeable enclosure or shell around the device after the coating material hardens. A vacuum may be applied near the device to exert an attractive force on the coating material to aid in homogenously distributing the coating material over the device. In addition, a vibration may be applied to the device to aid in distributing the coating material. If the device is attached to a substrate, a hole may be formed through the substrate with one opening near the device and a second opening located elsewhere. The vacuum may then be applied to the second opening to draw the coating material over the device and towards the first opening.
Abstract:
A method and system for making a gas permeable shell in a micro electromechanical systems (MEMS) device is disclosed. The MEMS device is created with an internal sacrificial layer. The device is then coated with a slurry composition which, after drying, is later exposed to a solvent. As a result, the sacrificial layer is removed to produce interconnected voids.