公开(公告)号：US09980390B2

公开(公告)日：2018-05-22

申请号：US14605150

申请日：2015-01-26

Applicant: NITTO DENKO CORPORATION

Inventor： Naohiro Terada ,  Yoshito Fujimura ,  Tomoaki Okuno

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  G11B5/48 ,  H05K1/05

CPC classification number: H05K3/0097 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/05 ,  H05K2201/09027 ,  H05K2201/0909 ,  H05K2201/0969 ,  H05K2203/0169 ,  H05K2203/1545

Abstract: A suspension board with circuit assembly sheet includes an assembly provided region provided with a plurality of suspension boards with circuits at spaced intervals to each other along one direction and a margin region provided at least at one side in a crossing direction with respect to the one direction of the assembly provided region. In the assembly provided region, a first opening portion is provided between the suspension boards with circuits that are adjacent to each other and in the margin region, a fragile portion is provided.

公开(公告)号：US09974164B2

公开(公告)日：2018-05-15

申请号：US14904551

申请日：2014-07-24

Applicant: LG Display Co., Ltd.

Inventor： Ducksu Oh ,  Sung Soo Park ,  Minsoo Kang

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/02 ,  H05K7/00 ,  H05K1/14 ,  H01L27/32 ,  H05K3/36 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/028 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/049

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

公开(公告)号：US09955571B2

公开(公告)日：2018-04-24

申请号：US15700433

申请日：2017-09-11

Applicant: Honeywell Federal Manufacturing & Technologies, LLC

Inventor： Jonathan Douglas Hatch ,  Stephen McGarry Hatch

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/14 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/12 ,  H05K3/38 ,  H05K3/10

CPC classification number: H05K1/0306 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0023 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/048 ,  H05K3/103 ,  H05K3/125 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09009 ,  H05K2203/0152

Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

公开(公告)号：US09854677B2

公开(公告)日：2017-12-26

申请号：US15214611

申请日：2016-07-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru Tago ,  Hirofumi Shinagawa ,  Masaki Kawata ,  Yuki Ito

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/32 ,  H05K1/03

CPC classification number: H05K1/181 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/111 ,  H05K1/118 ,  H05K3/32 ,  H05K3/328 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0285 ,  Y02P70/611

Abstract: A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.

公开(公告)号：US09854675B2

公开(公告)日：2017-12-26

申请号：US14539035

申请日：2014-11-12

Applicant: ZODIAC AERO ELECfRIC

Inventor： Vianney Pouget ,  Antonio Simao

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/148 ,  H05K1/028 ,  H05K1/11 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/047 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: This electronic circuit, includes a set of electronic boards intended to support components and linked together by joining elements. The joining elements include curved flexible printed circuits linking two opposing ends of two electronic boards running side by side, the said curved flexible printed circuits being foldable for erecting the electronic circuit into a volume so that the electronic circuit comprises electronic boards placed opposite one another.

公开(公告)号：US09832863B2

公开(公告)日：2017-11-28

申请号：US14866614

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Adel Elsherbini ,  Aleksandar Aleksov ,  Shawna Liff

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/22 ,  H05K3/30 ,  H05K1/03

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/118 ,  H05K1/181 ,  H05K3/22 ,  H05K3/284 ,  H05K3/301 ,  H05K3/4691 ,  H05K2201/05 ,  H05K2201/057 ,  H05K2201/09263 ,  H05K2201/095 ,  H05K2203/1316

Abstract: Some forms relate to a stretchable computing device that includes a stretchable body; a first electronic component embedded within the stretchable body; a second electronic component embedded within the stretchable body; and wherein the first electronic component and the second electronic component are connected by stretchable electrical connectors that include vias. The stretchable electrical connectors are non-planar and/or may have a partial zig-zag shape and/or a partial coil shape. In some forms, the stretchable computing device further includes a textile attached to the stretchable body.

公开(公告)号：US09831573B2

公开(公告)日：2017-11-28

申请号：US14300855

申请日：2014-06-10

Applicant: Apple Inc.

Inventor： Emery A. Sanford ,  Tyson B. Manullang ,  David G. Havskjold ,  Tyler S. Bushnell ,  Eric S. Jol ,  Anthony S. Montevirgen ,  John Raff

IPC: H05K1/00 ,  H01R12/62 ,  H05K1/11 ,  H05K1/14 ,  H01R13/62 ,  H01R12/52

CPC classification number: H01R12/62 ,  H01R12/52 ,  H05K1/14 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/10325 ,  H05K2201/1034 ,  H05K2201/10681

Abstract: An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.

公开(公告)号：US20170339782A1

公开(公告)日：2017-11-23

申请号：US15273730

申请日：2016-09-23

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

Inventor： MING-JAAN HO ,  HSIAO-TING HSU

IPC: H05K1/02 ,  C08K3/28 ,  C08F112/32 ,  C09D125/18 ,  H01B1/22 ,  H05K1/11 ,  H05K1/09 ,  C09D5/24

CPC classification number: H05K1/0219 ,  C08F12/22 ,  C08F112/32 ,  C08K3/28 ,  C08K2201/001 ,  C09D5/24 ,  C09D125/18 ,  H01B1/22 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/0141 ,  H05K2201/0215 ,  H05K2201/0329 ,  H05K2201/05

Abstract: A method for making a conductive polymer for electromagnetic shielding purposes includes steps of mixing liquid crystal monomers, a silver complex, an initiator, and a catalytic agent in certain proportions by weight to form a mixture. A solvent is added into the mixture, the mixture and the solvent being in a ratio from 3:17 to 1:3 by weight. The mixture is heated to undergo an atom transfer radical polymerization.

公开(公告)号：US09807868B1

公开(公告)日：2017-10-31

申请号：US15273730

申请日：2016-09-23

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

Inventor： Ming-Jaan Ho ,  Hsiao-Ting Hsu

IPC: H01B1/22 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  C08K3/28 ,  C08F112/32 ,  C09D5/24 ,  C09D125/18

CPC classification number: H05K1/0219 ,  C08F12/22 ,  C08F112/32 ,  C08K3/28 ,  C08K2201/001 ,  C09D5/24 ,  C09D125/18 ,  H01B1/22 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/0141 ,  H05K2201/0215 ,  H05K2201/0329 ,  H05K2201/05

Abstract: A method for making a conductive polymer for electromagnetic shielding purposes includes steps of mixing liquid crystal monomers, a silver complex, an initiator, and a catalytic agent in certain proportions by weight to form a mixture. A solvent is added into the mixture, the mixture and the solvent being in a ratio from 3:17 to 1:3 by weight. The mixture is heated to undergo an atom transfer radical polymerization.

公开(公告)号：US09804457B2

公开(公告)日：2017-10-31

申请号：US14437826

申请日：2015-01-12

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Hongrui Cao

IPC: G02F1/1345 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: G02F1/1345 ,  G02F1/13452 ,  G02F1/13458 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/028 ,  H05K1/09 ,  H05K1/11 ,  H05K1/117 ,  H05K3/361 ,  H05K2201/05 ,  H05K2201/094 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/10136

Abstract: The disclosure is related to a flexible printed circuit board. The flexible printed circuit board comprises a connecting area and a plurality of gold fingers disposed inside the connecting area, wherein the widths of the gold fingers are different. By the above manner, the disclosure is able to increase the number of the gold fingers without changing the size of the flexible printed circuit board so as to solve the impedance matching problem of the gold fingers of the flexible printed circuit board.