公开(公告)号：US20130313013A1

公开(公告)日：2013-11-28

申请号：US13478465

申请日：2012-05-23

Applicant: DAVID SALA PORTA ,  David Soriano Fosas ,  Juan Luis López Rodriguez

Inventor： DAVID SALA PORTA ,  David Soriano Fosas ,  Juan Luis López Rodriguez

IPC: H05K1/02

CPC classification number: H05K1/0225 ,  H05K1/025 ,  H05K2201/09681

Abstract: A printed circuit board comprises at least one microstrip transmission line with a conductive solid reference plane and at least one conductive trace embedded in a dielectric substrate, and further comprises at least one conductive shielding layer having a lattice structure, wherein the conductive trace is arranged between the solid reference plane and the shielding layer.

Abstract translation: 印刷电路板包括至少一个具有导电固体参考平面的微带传输线和嵌入电介质衬底中的至少一个导电迹线，并且还包括具有晶格结构的至少一个导电屏蔽层，其中导电迹线被布置在 固体参考平面和屏蔽层。

公开(公告)号：US20130298252A1

公开(公告)日：2013-11-07

申请号：US13843331

申请日：2013-03-15

Applicant: Tecvan Informática Ltda.

Inventor： Jorge Ribeiro-Pereira

IPC: G06F21/55

CPC classification number: G06F21/554 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09681

Abstract: The present invention provides the mechanical positioning of electronic circuits, mounted on rigid printed circuit boards or flexible circuits, creating a protected region within a Safe Equipment, so that an action to attempt to invade or violate this area of the equipment will trigger an alarm that triggers the blocking of the equipment use, instantly erasing the safety keys of the safe equipment; to avoid this possibility, the invention provides a region completely surrounded by protection circuits and sensors surrounding the sensitive part of the device with alarm devices.

Abstract translation: 本发明提供了安装在刚性印刷电路板或柔性电路上的电子电路的机械定位，在安全设备内创建受保护的区域，使得试图侵入或违反设备的该区域的动作将触发警报， 触发设备使用的阻塞，立即擦除安全设备的安全钥匙; 为了避免这种可能性，本发明提供了一个由保护电路和传感器完全包围的区域，该区域围绕具有报警装置的设备的敏感部分。

公开(公告)号：US08525402B2

公开(公告)日：2013-09-03

申请号：US11756971

申请日：2007-06-01

Applicant: Ellen O. Aeling ,  John R. David ,  Michael A. Meis ,  Ronald S. Steelman

Inventor： Ellen O. Aeling ,  John R. David ,  Michael A. Meis ,  Ronald S. Steelman

IPC: H01R33/00 ,  F21S4/00 ,  F21V21/002

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21K9/60 ,  F21K9/68 ,  F21K9/90 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/60 ,  H05K1/0287 ,  H05K1/11 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/063 ,  Y10T156/10

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract translation: 本公开一般涉及照明装置及其制造方法。 该器件特别地包括第一导体层，第一绝缘体层，设置在第一导体层上并且具有通过第一绝缘体层限定在其中的至少一个第一孔;第二导体层，设置在第一绝缘体层上并具有 通过所述第二导体层限定的至少一个第二孔，并且定位成与所述至少一个第一孔对准，以及光操纵层，其设置在所述第二导体层上并且具有通过所述光操纵层限定在其中的至少一对孔，包括 第三孔和第四孔，其中所述第三孔被定位成与所述至少一个第二孔和第一孔对准。

公开(公告)号：US20130182397A1

公开(公告)日：2013-07-18

申请号：US13812141

申请日：2011-07-20

Applicant: Hiroyuki Abe ,  Mizuki Shibata

Inventor： Hiroyuki Abe ,  Mizuki Shibata

IPC: H05K13/00 ,  H05K1/03

CPC classification number: H05K13/00 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/4629 ,  H05K2201/068 ,  H05K2201/09681

Abstract: Provided is a highly reliable ceramic circuit board which can be manufactured at a low cost and is friendly to environment as a material from which lead is eliminated in forming the multilayered structure.A multi-layered ceramic circuit board includes: a sintered ceramic base body 2; a first circuit wiring pattern 3 which is formed on a surface of the ceramic base body and is formed of conductive paste made of conductive metal; an insulation layer 8 which is formed on a surface layer of the first circuit wiring pattern and is made of a dielectric; and a conductive pattern and a resistor 4 which are formed on a surface layer of the insulation layer, the conductive pattern having a second circuit wiring pattern and a land on which a circuit mounting part is mounted are formed, wherein the portions other than the land portion on which the circuit mounting part is mounted are covered with a protective film 5 by coating, and an electronic circuit part 7 is connected to the land by a conductive adhesive agent, wherein the dielectric is formed of a green sheet 11 of a low temperature co-fired ceramics circuit board which is prepared by mixing alumina powder and glass powder with a solvent (see FIG. 5).

Abstract translation: 提供了一种高可靠性的陶瓷电路板，其可以低成本制造，并且作为在形成多层结构中消除铅的材料对环境友好。 多层陶瓷电路板包括：烧结陶瓷基体2; 第一电路布线图案3，其形成在陶瓷基体的表面上并由导电金属制成的导电糊形成; 绝缘层8，其形成在第一电路布线图案的表面层上并由电介质构成; 以及形成在所述绝缘层的表面层上的导体图案和电阻体4，所述导电图案具有第二电路布线图案和其上安装有电路安装部的台面，其中除了所述焊盘之外的部分 电路安装部分安装在其上的部分通过涂覆被保护膜5覆盖，并且电子电路部分7通过导电粘合剂连接到焊盘上，其中电介质由低温的生片11形成 通过将氧化铝粉末和玻璃粉末与溶剂混合制备的共烧陶瓷电路板（参见图5）。

公开(公告)号：US20120318585A1

公开(公告)日：2012-12-20

申请号：US13223185

申请日：2011-08-31

Applicant: Jae Hun Kim ,  Seul Gi Kim ,  Sang Su Hong ,  Chung Mo Yang ,  In Hyung Lee ,  Woo Jin Lee ,  Young Woo Lee

Inventor： Jae Hun Kim ,  Seul Gi Kim ,  Sang Su Hong ,  Chung Mo Yang ,  In Hyung Lee ,  Woo Jin Lee ,  Young Woo Lee

IPC: G06F3/041 ,  H05K3/10

CPC classification number: H05K3/06 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2203/0315 ,  Y10T29/49155

Abstract: Disclosed herein are a touch panel and a method for manufacturing the same. The touch panel includes: a transparent substrate formed of silicon; and sensing electrodes each formed in a metal mesh pattern on one surface or both surfaces of the transparent substrate.Since the transparent substrate is formed of silicon having excellent adhesive property, the sensing electrode can be formed on a transparent substrate even without a separate adhesive material.

Abstract translation: 这里公开了触摸面板及其制造方法。 触摸面板包括：由硅形成的透明基板; 以及在透明基板的一个表面或两个表面上以金属网格图案形成的感测电极。 由于透明基板由具有优异粘合性的硅形成，所以即使没有单独的粘合材料，感测电极也可以形成在透明基板上。

公开(公告)号：US08332053B1

公开(公告)日：2012-12-11

申请号：US12431042

申请日：2009-04-28

Applicant: Pamela R. Patterson ,  Kevin S. Holabird ,  Christopher P. Henry

Inventor： Pamela R. Patterson ,  Kevin S. Holabird ,  Christopher P. Henry

IPC: A61N1/00

CPC classification number: H05K3/0014 ,  A61B2562/0247 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/164 ,  A61N1/0484 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/09681 ,  H01L2924/00

Abstract: In one implementation, a method of fabrication of stretchable electronic skin is provided. The method may include receiving an elastic material net. An elastic conductor mesh is formed on the elastic material net. A device is electrically bonded to the elastic conductor mesh. The implementation may further include forming a mold comprising a net pattern on a substrate and creating the elastic material net by coating the mold with an elastic material precursor, and then removing the elastic net from the substrate with the elastic conductor thereon. In one embodiment, a stretchable electronic skin including a net structure having a non-conducting elastic material with an elastic conductor mesh formed on the non-conducting elastic material, and a device electrically connected to the elastic conductor mesh.

Abstract translation: 在一个实施方案中，提供了一种制造可拉伸电子皮肤的方法。 该方法可以包括接收弹性材料网。 在弹性材料网上形成弹性导体网。 器件电连接到弹性导体网。 该实施方案还可以包括在基材上形成包括网状图案的模具，并通过用弹性材料前体涂覆模具来形成弹性材料网，然后用其上的弹性导体从基材上去除弹性网。 在一个实施例中，包括具有非导电弹性材料的网状结构的可拉伸电子表皮，其具有形成在非导电弹性材料上的弹性导体网，以及电连接到弹性导体网的装置。

公开(公告)号：US20120205141A1

公开(公告)日：2012-08-16

申请号：US13345974

申请日：2012-01-09

Applicant: Taiji OGAWA ,  Hirohito WATANABE ,  Masakazu SATO

Inventor： Taiji OGAWA ,  Hirohito WATANABE ,  Masakazu SATO

IPC: H05K1/02

CPC classification number: H05K1/024 ,  H01P3/081 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K2201/09236 ,  H05K2201/09681

Abstract: The printed wiring board has a conductor of signal line 41 and two conductive lines 42 on one face of the first insulating layer 10 covered by a second insulating layer 20, while having a ground layer of the ground 30 potential on the opposite face thereof, when the dielectric tangent A of the second insulating layer (insulating layer A) 20 is larger than the dielectric tangent B of the first insulating layer (insulating layer B) 10, Relational Expression 1: (relative permittivity B)·(width (W41) of signal line(s) 41)/(thickness (T10) of first insulating layer (insulating layer B) 10)>(relative permittivity A)·{(thickness (T41) of signal line(s) 41)/(distance (S1) between signal line(s) 41 and one conductive line 42a)+(thickness (T41) of signal line(s) 41)/(distance (S2) between signal line(s) 41 and other conductive line 42b)+(thickness (T41) of signal lines 41)/(distance (S3) between pair of signal lines (41a and 41b)·2} is satisfied.

Abstract translation: 印刷电路板具有由第二绝缘层20覆盖的第一绝缘层10的一面上的信号线41的导体和两条导线42，同时在其相对面上具有接地层30的电位的地层， 第二绝缘层（绝缘层A）20的介质切线A大于第一绝缘层（绝缘层B）10的介质切线B，关系式1（相对介电常数B）·（宽（W41） 信号线41）/（第一绝缘层（绝缘层B）的厚度（T10））10）>（相对介电常数A）·{（信号线的厚度（T41）41）/（距离（S1 信号线41和一根导线42a之间）+（信号线41的厚度（T41））/（信号线41与其他导线42b的距离（S2））+（厚度 信号线41的（T41）/（信号线对（41a，41b）·2之间的距离（S3））满足。

公开(公告)号：US20120204141A1

公开(公告)日：2012-08-09

申请号：US13449732

申请日：2012-04-18

Applicant: Jinwoo Choi ,  Sungjun Chun ,  Anand Haridass ,  Roger Weekly

Inventor： Jinwoo Choi ,  Sungjun Chun ,  Anand Haridass ,  Roger Weekly

IPC: G06F17/50

CPC classification number: G06F17/5068 ,  G06F17/5036 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0219 ,  H05K1/0224 ,  H05K3/4629 ,  H05K2201/09236 ,  H05K2201/09681 ,  H01L2924/00

Abstract: A method reduces coupling noise and controls impedance discontinuity in ceramic packages by: providing at least one reference mesh layer; providing a plurality of signal trace layers, with each signal layer having one or more signal lines and the reference mesh layer being adjacent to one or more of the signal layers; disposing a plurality of vias through the at least one reference mesh layer, with each via providing a voltage (Vdd) power connection or a ground (Gnd) connection; selectively placing via-connected coplanar-type shield (VCS) lines relative to the signal lines, with a first VCS line extended along a first side of a first signal line and a second VCS line extended along a second, opposing side of said first signal line. Each of the VCS lines interconnect with and extend past one or more vias located within a directional path along which the VCS lines extends.

Abstract translation: 一种方法通过以下方式减少耦合噪声并控制陶瓷封装中的阻抗不连续性：提供至少一个参考网格层; 提供多个信号迹线层，其中每个信号层具有一个或多个信号线，并且所述参考网格层与所述信号层中的一个或多个相邻; 通过所述至少一个参考网格层布置多个通孔，其中每个通孔提供电压（Vdd）电源连接或接地（Gnd）连接; 选择性地将通过连接的共面型屏蔽（VCS）线相对于信号线放置，其中第一VCS线沿着第一信号线的第一侧延伸，并且第二VCS线沿着所述第一信号的第二相对侧延伸 线。 VCS线路中的每一条与位于VCS线延伸的定向路径内的一个或多个通孔相互连接并延伸。

公开(公告)号：US08198142B1

公开(公告)日：2012-06-12

申请号：US12932141

申请日：2011-02-18

Applicant: David D. Eaton

Inventor： David D. Eaton

IPC: H01L21/82

CPC classification number: H01L23/576 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0275 ,  H05K2201/09681 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A general purpose BGA security cap includes a substrate, an integrated circuit die, and an array of bond balls. The substrate includes an anti-tamper security mesh of conductors. The bond balls include outer bond balls and inner bond balls that are fixed to the underside of the substrate. The integrated circuit drives and monitors the anti-tamper security mesh and communicates data using a serial physical interface through a subset of the inner bond balls. In one example, a user has circuitry to be protected. The user purchases the BGA security cap and fits it over the circuitry to be protected such that the integrated circuit of the security cap communicates tamper detect condition information via the serial interface to the underlying protected circuitry and causes sensitive information to be erased or a program to be halted in the event of a tamper condition.

Abstract translation: 通用BGA安全帽包括基板，集成电路管芯和粘结球阵列。 基板包括导体的防篡改安全网。 结合球包括固定到基底的下侧的外粘结球和内粘结球。 集成电路驱动和监视防篡改安全网，并使用串联物理接口通过内焊球的子集传送数据。 在一个示例中，用户具有要被保护的电路。 用户购买BGA安全帽并将其安装在要保护的电路上，使得安全帽的集成电路经由串行接口将篡改检测条件信息传送到底层保护电路，并导致敏感信息被擦除或程序 在篡改情况下停止。

公开(公告)号：US08154884B2

公开(公告)日：2012-04-10

申请号：US12423078

申请日：2009-04-14

Applicant: Chung-Chuan Lin

Inventor： Chung-Chuan Lin

IPC: H05K9/00

CPC classification number: H05K1/0215 ,  H05K1/0224 ,  H05K1/0259 ,  H05K1/0393 ,  H05K3/4084 ,  H05K2201/056 ,  H05K2201/09354 ,  H05K2201/09681 ,  Y10T29/5313

Abstract: An electronic device includes a circuit board and an electrostatic protection structure. The circuit board has a top surface and a bottom surface opposite to the top surface. The electrostatic protection structure is positioned on the top surface of the circuit board. The electrostatic protection includes an insulating layer and a conducting layer coating on the insulating layer. Four ground terminals are formed on the bottom surface of the circuit board. The insulating layer includes a main portion and four first connecting portions extending from the main portion. The conducting layer on the four first connecting portion are connected to the four first ground terminal.

Abstract translation: 电子设备包括电路板和静电保护结构。 电路板具有与顶表面相对的顶表面和底表面。 静电保护结构位于电路板的顶表面上。 静电保护包括在绝缘层上的绝缘层和导电层涂层。 四个接地端子形成在电路板的底面上。 绝缘层包括主要部分和从主要部分延伸的四个第一连接部分。 四个第一连接部分上的导电层连接到四个第一接地端子。