公开(公告)号：US11781033B2

公开(公告)日：2023-10-10

申请号：US17575811

申请日：2022-01-14

Applicant: LINTEC Corporation

Inventor： Masanori Yamagishi ,  Akinori Sato

IPC: C09D133/04 ,  C09J163/00 ,  C09J7/20 ,  C09J7/30 ,  C09J4/06 ,  C09J7/25 ,  C09J7/38 ,  C08L63/00 ,  H01L23/00 ,  C09J133/00 ,  C08L33/00

CPC classification number: C09D133/04 ,  C08L63/00 ,  C09J4/06 ,  C09J7/20 ,  C09J7/25 ,  C09J7/30 ,  C09J7/38 ,  C09J163/00 ,  H01L24/26 ,  C08L33/00 ,  C08L2203/16 ,  C08L2203/20 ,  C09J133/00 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L2224/11 ,  H01L2224/11515 ,  C09D133/04 ,  C08L63/00

Abstract: A curable resin film of the present invention forms a first protective film (1a) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 μm, an average diameter of 60 to 500 μm, and an average pitch of 100 to 800 μm, heating the attached curable resin film at 100° C. to 200° C. for 0.5 to 3 hours, and curing the heated curable resin film, and when longitudinal sections thereof are observed by a scanning electron microscope, a ratio (h3/h1) of an average thickness (h3) of the first protective film (1a) at a center position between the bumps (51) to an average peak height (h1) of the bumps (51), and a ratio (h2/h1) of an average thickness (h2) of the first protective film (1a) at a position being in contact with the plurality of bumps (51) to the average peak height (h1) satisfy a relationship represented by the following expression of [{(h2/h1)−(h3/h1)}≤0.1].

公开(公告)号：US11760854B2

公开(公告)日：2023-09-19

申请号：US15316034

申请日：2015-06-02

Applicant: LINTEC CORPORATION

Inventor： Toshifumi Mimura ,  Yuuta Suzuki ,  Satoshi Naganawa

IPC: C08J7/048 ,  C23C14/08 ,  B05D1/00 ,  C08J7/04 ,  C08J7/043 ,  B05D5/00 ,  B05D7/04 ,  B05D7/00 ,  C23C14/00

CPC classification number: C08J7/048 ,  B05D1/60 ,  B05D1/62 ,  B05D5/00 ,  B05D7/04 ,  B05D7/51 ,  C08J7/043 ,  C08J7/0427 ,  C23C14/0036 ,  C23C14/086 ,  C08J2383/16

Abstract: The present invention is a gas barrier laminate comprising a base unit that comprises a base and a modification-promoting layer, and a gas barrier layer that is formed on a side of the modification-promoting layer with respect to the base unit,



the modification-promoting layer having a modulus of elasticity at 23° C. of less than 30 GPa,
the base unit having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 1.0 g/(m2·day) or less, and
the gas barrier layer being a layer formed by applying a modification treatment to a surface of a layer that comprises a polysilazane-based compound and is formed on the side of the modification-promoting layer with respect to the base unit, and
a method for producing the gas barrier laminat, and
an electronic device member comprising the gas barrier laminate, and
an electronic device comprising the electronic device member.

公开(公告)号：US20230272247A1

公开(公告)日：2023-08-31

申请号：US17910119

申请日：2020-12-02

Applicant: LINTEC CORPORATION

Inventor： Yoichi TAKAHASHI ,  Sho KOSABA ,  Yuka FUJII

IPC: C09J7/38 ,  C09J7/10 ,  C09J11/06

CPC classification number: C09J7/385 ,  C09J7/10 ,  C09J11/06 ,  C09J2203/354 ,  C09J2301/312 ,  C09J2301/416

Abstract: An adhesive sheet (1) comprising an adhesive layer (11) composed of an adhesive having active energy ray curability and ultraviolet ray absorbability, wherein when one surface of the adhesive layer (11) is irradiated with ultraviolet rays having a light amount of 2000 mJ/cm2 to cure the adhesive layer (11) and an infrared absorption spectrum is then measured by a total reflection measurement method for each of an irradiated surface and a non-irradiated surface, the maximum value of the absolute value of absorbance is 0.0001 to 0.012 within a wavenumber range of 700 to 1000 cm−1 in a difference spectrum obtained by subtracting the infrared absorption spectrum of the non-irradiated surface from the infrared absorption spectrum of the irradiated surface, and when the adhesive layer (11) is irradiated with ultraviolet rays having a light amount of 2000 mJ/cm2 to cure the adhesive layer (11), the difference in a gel fraction of the adhesive constituting the adhesive layer (11) before and after the irradiation is 5 points or more and 50 points or less. According to such an adhesive sheet (1), both the light resistance and the blister resistance can be achieved satisfactorily.

公开(公告)号：US20230266510A1

公开(公告)日：2023-08-24

申请号：US18111171

申请日：2023-02-17

Applicant: LINTEC CORPORATION

Inventor： Hiroki FUKUSHIMA ,  Tatsuki KURAMOTO ,  Baku KATAGIRI ,  Kentaro KUSAMA

IPC: G02B5/02 ,  G02B5/00

CPC classification number: G02B5/0236 ,  G02B5/003 ,  B32B7/12 ,  B32B2250/40

Abstract: A laminate used under an environment irradiated with external light includes a light diffusion control film having an internal structure in the film. The internal structure includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The laminate further includes an ultraviolet absorbing layer located further on the external light incident side than the light diffusion control film. The light diffusion control film contains a weakly basic hindered amine-based compound having a carbonate skeleton.

公开(公告)号：US20230250316A1

公开(公告)日：2023-08-10

申请号：US18012755

申请日：2021-06-25

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J9/02

CPC classification number: C09J7/35 ,  C09J9/02 ,  C09J2301/304 ,  C09J2301/408 ,  C09J2423/10 ,  C09J2423/04

Abstract: An adhesive agent for high-frequency dielectric heating at least contains a thermoplastic resin and a dielectric filler that generates heat upon application of a high-frequency electric field. The thermoplastic resin at least contains a first thermoplastic resin and a second thermoplastic resin. The thermoplastic resin is a silane-modified thermoplastic resin. The second thermoplastic resin is a thermoplastic resin that is not silane-modified.

公开(公告)号：US11723181B2

公开(公告)日：2023-08-08

申请号：US17434978

申请日：2020-02-06

Applicant: LINTEC Corporation

Inventor： Taiga Matsushita

IPC: H01Q17/00 ,  H05K9/00

CPC classification number: H05K9/00 ,  H01Q17/007 ,  H01Q17/008

Abstract: An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment.
An electromagnetic wave absorption film 10 has: a planar base 20; a first electromagnetic wave absorption pattern 1 formed on the base 20; a second electromagnetic wave absorption pattern 2 formed on the base 20; and a third electromagnetic wave absorption pattern 3 formed on the base 20, wherein when A [GHz] is defined as a frequency at which an absorption amount of an electromagnetic wave absorbed by the first electromagnetic wave absorption pattern 1 exhibits its local maximum value in a range from 20 to 110 GHz, B [GHz] satisfies Expression (1), B [GHz] being the value of a frequency at which an absorption amount of an electromagnetic wave absorbed by the second electromagnetic wave absorption pattern 2 exhibits its local maximum value, and C [GHz] satisfies Expression (2), C [GHz] being the value of a frequency at which an absorption amount of an electromagnetic wave absorbed by the third electromagnetic wave absorption pattern 3 exhibits its local maximum value,

1.037×A≤B≤1.30×A  Expression (1)

0.60×A≤C≤0.963×A  Expression (2).

公开(公告)号：US11673340B2

公开(公告)日：2023-06-13

申请号：US16345155

申请日：2017-10-18

Applicant: LINTEC CORPORATION

Inventor： Masakazu Ishikawa

IPC: B29C65/04 ,  B29C65/42 ,  B29C65/50 ,  C09J167/00 ,  C09J177/00 ,  B29C65/40 ,  C08K3/14 ,  C08K3/22 ,  C09J11/04 ,  C09J123/26 ,  C09J129/14 ,  C09J131/04 ,  H05B6/46 ,  C09J123/00 ,  C09J125/04 ,  H05B6/64 ,  C09J7/00 ,  C09J201/00 ,  C09J123/10 ,  C09J7/35 ,  C09J5/06 ,  C09J9/00 ,  H01B3/44 ,  H01B17/56 ,  H05B6/50

CPC classification number: B29C65/04 ,  B29C65/40 ,  B29C65/425 ,  B29C65/50 ,  C08K3/22 ,  C09J5/06 ,  C09J7/00 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J123/00 ,  C09J123/10 ,  C09J123/26 ,  C09J125/04 ,  C09J129/14 ,  C09J131/04 ,  C09J167/00 ,  C09J177/00 ,  C09J201/00 ,  H01B3/441 ,  H01B17/56 ,  H05B6/46 ,  H05B6/50 ,  H05B6/64 ,  C08K3/14 ,  C08K2003/2296 ,  C08K2201/005 ,  C09J2203/326 ,  C09J2301/408 ,  C09J2301/416 ,  C09J2423/10

Abstract: A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

公开(公告)号：US20230141072A1

公开(公告)日：2023-05-11

申请号：US17915062

申请日：2021-03-26

Applicant: LINTEC CORPORATION

Inventor： Yuichi MORI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J123/12 ,  C09J11/04

CPC classification number: C09J7/35 ,  C09J11/04 ,  C09J123/12 ,  C09J2301/304 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/1242

Abstract: A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ/ε’r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tanδ denotes a dielectric dissipation factor at 23° C. and a frequency of 40.68 MHz and ε‘r denotes a relative permittivity at 23° C. and the frequency of 40.68 MHz.

公开(公告)号：US20230119700A1

公开(公告)日：2023-04-20

申请号：US17914473

申请日：2020-12-02

Applicant: LINTEC CORPORATION

Inventor： Minami NAKANISHI ,  Yutaka NANASHIMA

IPC: C09J7/38 ,  C09J7/10 ,  C09J133/14 ,  B32B7/12

Abstract: An adhesive sheet comprising at least a pressure sensitive adhesive layer, wherein the adhesive sheet has an adhesive strength to soda-lime glass of larger than 1 N/25 mm and 100 N/25 mm or less, a pressure sensitive adhesive that constitutes the pressure sensitive adhesive layer is formed of a pressure sensitive adhesive composition that contains a (meth)acrylic ester polymer (A), and the (meth)acrylic ester polymer (A) contains, as a monomer unit that constitutes the polymer, an ethylene carbonate-containing monomer having an ethylene carbonate structure represented by Formula (1) below.

公开(公告)号：US20230115263A1

公开(公告)日：2023-04-13

申请号：US17801743

申请日：2021-02-25

Applicant: LINTEC CORPORATION

Inventor： Masaharu ITO ,  Takashi MORIOKA

IPC: H05B3/22

Abstract: A sheet-shaped heat generator includes a pseudo sheet structure including a plurality of metal wires arranged at an interval, the metal wires each including a core including a first metal and a metal film provided on an exterior of the core, the metal film including a second metal different from the first metal, in which a volume resistivity of the first metal is in a range from 1.0×10−5 [Ω·cm] to 5.0×10−4 [Ω·cm], and a standard electrode potential of the second metal is +0.34 V or more.