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公开(公告)号：US20120196440A1
公开(公告)日：2012-08-02
申请号：US13017015
申请日：2011-01-30
Applicant: Aurelien Philippe Jean Maclou Botman , Steven Randolph , Milos Toth
Inventor： Aurelien Philippe Jean Maclou Botman , Steven Randolph , Milos Toth
IPC: H01L21/285
CPC classification number: C23C16/0263 , C23C16/10 , C23C16/14 , C23C16/4488 , C23C16/48 , C23C16/486 , C23C16/52
Abstract: Material is deposited in a desired pattern by spontaneous deposition of precursor gas at regions of a surface that are prepared using a beam to provide conditions to support the initiation of the spontaneous reaction. One the reaction is initiated, it continues in the absence of the beam at the regions of the surface at which the reaction was initiated.
Abstract translation: 通过在使用光束制备的表面的区域处自发沉积前体气体以提供支持自发反应开始的条件，将材料沉积成所需的图案。 一个反应开始，它在反应开始的表面区域没有光束的情况下继续。
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公开(公告)号：US08168961B2
公开(公告)日：2012-05-01
申请号：US12324296
申请日：2008-11-26
Applicant: Marcus Straw , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
Inventor： Marcus Straw , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
IPC: G21G5/00
CPC classification number: G21G5/00 , B23K26/0624 , B23K26/0661 , B23K26/18 , B23K2101/40 , B23K2101/42 , G03F7/70383 , H01J37/228 , H01J2237/31749
Abstract: An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Abstract translation: 一种改进的衬底微加工方法。 本发明的优选实施例提供了利用带电粒子束掩蔽和激光烧蚀的改进方法。 使用带电粒子束掩模制造和超短脉冲激光烧蚀的优点的组合来显着地减少基板处理时间，并且提高通过激光烧蚀加工的特征的横向分辨率和纵横比，优选小于加工激光器的衍射极限。
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公开(公告)号：US20090242758A1
公开(公告)日：2009-10-01
申请号：US12059850
申请日：2008-03-31
Applicant: MAREK UNCOVSKY , MILOS TOTH , WILLIAM RALPH KNOWLES
Inventor： MAREK UNCOVSKY , MILOS TOTH , WILLIAM RALPH KNOWLES
CPC classification number: H01J37/244 , H01J37/28 , H01J47/06 , H01J2237/24445 , H01J2237/2448 , H01J2237/2605
Abstract: A novel detector for a charged particle beam system which includes multiple gas amplification stages. The stages are typically defined by conductors to which voltage are applied relative to the sample or to a previous stage. By creating cascades of secondary electrons in multiple stages, the gain can be increased without causing dielectric breakdown of the gas.
Abstract translation: 一种用于带电粒子束系统的新型检测器，其包括多个气体放大级。 这些级通常由相对于样品施加电压的导体或前一级定义。 通过在多级中产生二级电子级联，可以增加增益，而不会导致气体的介质击穿。
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公开(公告)号：US09255339B2
公开(公告)日：2016-02-09
申请号：US13236587
申请日：2011-09-19
Applicant: Aurelien Philippe Jean Maclou Botman , Milos Toth , Steven Randolph , David H. Narum
Inventor： Aurelien Philippe Jean Maclou Botman , Milos Toth , Steven Randolph , David H. Narum
CPC classification number: H01J37/20 , C25D5/003 , C25D5/02 , C25D5/026 , C25D5/04 , C25D17/005 , C25D17/10 , C25D17/12 , C25D21/04 , C25D21/12 , H01J37/18 , H01J37/222 , H01J37/28 , H01J2237/182 , H01J2237/2003 , H01J2237/202 , H01J2237/2801
Abstract: A charge transfer mechanism is used to locally deposit or remove material for a small structure. A local electrochemical cell is created without having to immerse the entire work piece in a bath. The charge transfer mechanism can be used together with a charged particle beam or laser system to modify small structures, such as integrated circuits or microelectromechanical system. The charge transfer process can be performed in air or, in some embodiments, in a vacuum chamber.
Abstract translation: 电荷转移机构用于局部沉积或去除小结构的材料。 产生局部电化学电池，而不必将整个工件浸入浴中。 电荷转移机构可以与带电粒子束或激光系统一起使用以修改诸如集成电路或微机电系统的小结构。 电荷转移过程可以在空气中或在一些实施方案中在真空室中进行。
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公开(公告)号：US08921811B2
公开(公告)日：2014-12-30
申请号：US12525908
申请日：2008-02-06
Applicant: Milos Toth , Rae Knowles
Inventor： Milos Toth , William Ralph Knowles
IPC: G01N23/00 , H01J37/305 , H01J37/301
CPC classification number: H01J37/3056 , H01J37/301 , H01J2237/006 , H01J2237/188 , H01J2237/2003 , H01J2237/2605 , H01J2237/31732 , H01J2237/3174
Abstract: The current invention includes methods and apparatuses for processing, that is, altering and imaging, a sample in a high pressure charged particle beam system. Embodiments of the invention include a cell in which the sample is positioned during high pressure charged particle beam processing. The cell reduces the amount of gas required for processing, thereby allowing rapid introduction, exhaustion, and switching between gases and between processing and imaging modes. Maintaining the processes gases within the cell protects the sample chamber and column from contact with the gases. In some embodiments, the temperature of the cell walls and the sample can be controlled.
Abstract translation: 本发明包括用于处理的方法和装置，即改变和成像高压带电粒子束系统中的样品。 本发明的实施例包括其中样品在高压带电粒子束处理期间被定位的单元。 电池减少处理所需的气体量，从而允许气体之间以及处理和成像模式之间的快速引入，耗尽和切换。 维持过程中的气体保护样品室和色谱柱不与气体接触。 在一些实施方案中，可以控制细胞壁和样品的温度。
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Patent Agency Ranking
公开(公告)号：US08853078B2
公开(公告)日：2014-10-07
申请号：US13017015
申请日：2011-01-30
Applicant: Aurelien Philippe Jean Maclou Botman , Steven Randolph , Milos Toth
Inventor： Aurelien Philippe Jean Maclou Botman , Steven Randolph , Milos Toth
CPC classification number: C23C16/0263 , C23C16/10 , C23C16/14 , C23C16/4488 , C23C16/48 , C23C16/486 , C23C16/52
Abstract: Material is deposited in a desired pattern by spontaneous deposition of precursor gas at regions of a surface that are prepared using a beam to provide conditions to support the initiation of the spontaneous reaction. Once the reaction is initiated, it continues in the absence of the beam at the regions of the surface at which the reaction was initiated.
Abstract translation: 通过在使用光束制备的表面的区域处自发沉积前体气体以提供支持自发反应开始的条件，将材料沉积成所需的图案。 一旦反应开始，它在反应开始的表面的区域没有光束的情况下继续进行。
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公开(公告)号：US08629416B2
公开(公告)日：2014-01-14
申请号：US13449773
申请日：2012-04-18
Applicant: Marcus Straw , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
Inventor： Marcus Straw , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
IPC: G21G5/00
CPC classification number: G21G5/00 , B23K26/0624 , B23K26/0661 , B23K26/18 , B23K2101/40 , B23K2101/42 , G03F7/70383 , H01J37/228 , H01J2237/31749
Abstract: An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Abstract translation: 一种改进的衬底微加工方法。 本发明的优选实施例提供了利用带电粒子束掩蔽和激光烧蚀的改进方法。 使用带电粒子束掩模制造和超短脉冲激光烧蚀的优点的组合来显着地减少基板处理时间，并且提高通过激光烧蚀加工的特征的横向分辨率和纵横比，优选小于加工激光器的衍射极限。
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公开(公告)号：US20110115129A1
公开(公告)日：2011-05-19
申请号：US13003450
申请日：2009-07-09
Applicant: Marcus Straw , Amin Samsavar , Milos Toth , Mark Utlaut
Inventor： Marcus Straw , Amin Samsavar , Milos Toth , Mark Utlaut
CPC classification number: B23K26/03 , B23K26/0622 , B23K26/0853 , B23K26/14 , B23K26/1423 , B23K26/348 , H01J2237/2813
Abstract: A charged particle beam and a laser beam are used together to micromachine a substrate. A first beam alters the state of a region of the work piece, and the second beam removes material whose state was altered. In one embodiment, an ion beam can create photon absorbing defects to lower the local ablation threshold, allowing the laser beam to remove material in a region defined by the ion beam. The combination of laser beam and charged particle beam allows the creation of features similar in size to the charged particle beam spot size, at milling rates greater than charged particle processing because of the increased energy provided by the laser beam.
Abstract translation: 带电粒子束和激光束一起用于微机械衬底。 第一光束改变工件的区域的状态，第二光束去除状态被改变的材料。 在一个实施例中，离子束可以产生光子吸收缺陷以降低局部消融阈值，允许激光束去除由离子束限定的区域中的材料。 激光束和带电粒子束的组合允许在大小与带电粒子束点尺寸相似的特征的情况下产生大于带电粒子处理的铣削速率，因为激光束提供的能量增加。
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公开(公告)号：US20110031655A1
公开(公告)日：2011-02-10
申请号：US12828243
申请日：2010-06-30
Applicant: Milos Toth , Marcus Straw
Inventor： Milos Toth , Marcus Straw
IPC: B29C35/08
CPC classification number: B29C35/08 , B23K26/0624 , B23K26/12 , B23K26/126 , B23K26/127 , B23K26/16 , B23K26/36 , B41M5/24
Abstract: An improved method for laser processing that prevents material redeposition during laser ablation but allows material to be removed at a high rate. In a preferred embodiment, laser ablation is performed in a chamber filled with high pressure precursor (etchant) gas so that sample particles ejected during laser ablation will react with the precursor gas in the gas atmosphere of the sample chamber. When the ejected particles collide with precursor gas particles, the precursor is dissociated, forming a reactive component that binds the ablated material. In turn, the reaction between the reactive dissociation by-product and the ablated material forms a new, volatile compound that can be pumped away in a gaseous state rather than redepositing onto the sample.
Abstract translation: 一种改进的激光加工方法，可防止激光烧蚀过程中的材料再沉积，但可以高速率去除材料。 在优选实施例中，在填充有高压前体（蚀刻剂）气体的室中进行激光烧蚀，使得在激光烧蚀期间喷射的样品颗粒将与样品室的气体气氛中的前体气体反应。 当喷射的颗粒与前体气体颗粒碰撞时，前体解离，形成结合烧蚀材料的反应性组分。 反过来，反应性离解副产物与消融材料之间的反应形成一种新的挥发性化合物，其可以以气态泵送而不是重新沉积在样品上。
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公开(公告)号：US20100127190A1
公开(公告)日：2010-05-27
申请号：US12324296
申请日：2008-11-26
Applicant: MARCUS STRAW , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
Inventor： MARCUS STRAW , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
CPC classification number: G21G5/00 , B23K26/0624 , B23K26/0661 , B23K26/18 , B23K2101/40 , B23K2101/42 , G03F7/70383 , H01J37/228 , H01J2237/31749
Abstract: An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Abstract translation: 一种改进的衬底微加工方法。 本发明的优选实施例提供了利用带电粒子束掩蔽和激光烧蚀的改进方法。 使用带电粒子束掩模制造和超短脉冲激光烧蚀的优点的组合来显着地减少基板处理时间，并且提高通过激光烧蚀加工的特征的横向分辨率和纵横比，优选小于加工激光器的衍射极限。
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