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    MICROELECTRONIC SUBSTRATE ELECTRO PROCESSING SYSTEM
    11.
    发明申请
    MICROELECTRONIC SUBSTRATE ELECTRO PROCESSING SYSTEM 有权
    微电子基板电加工系统

    公开(公告)号：US20140318977A1

    公开(公告)日：2014-10-30

    申请号：US14259492

    申请日：2014-04-23

    Applicant: APPLIED Materials, Inc.

    Inventor： Robert B. Moore ,  David Silvetti ,  Paul Wirth ,  Randy Harris

    IPC: C25D17/06 ,  C25D7/12

    CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/005 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/76879

    Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

    Abstract translation: 在用于电镀半导体晶片和类似衬底的处理系统中，电镀处理器的接触环从处理器的转子移除，并被先前去绝缘的接触环替代。 这允许接触环在系统的环形服务模块中脱落，同时处理器继续工作。 晶圆生产量提高。 接触环可以附接到卡盘，用于使处理器和环形服务模块之间的接触环移动，卡盘可快速地附接和释放到转子上。

    MASS FLOW CONTROL BASED ON MICRO-ELECTROMECHANICAL DEVICES
    12.
    发明申请
    MASS FLOW CONTROL BASED ON MICRO-ELECTROMECHANICAL DEVICES 有权

    公开(公告)号：US20220083081A1

    公开(公告)日：2022-03-17

    申请号：US17475294

    申请日：2021-09-14

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Nir Merry ,  Paul Wirth ,  Ming Xu ,  Sushant Koshti ,  Raechel Chu-Hui Tan

    IPC: G05D7/06 ,  G01F1/86 ,  G01F1/72 ,  G01F1/684

    Abstract: Disclosed herein are embodiments of a mass flow control apparatus, systems incorporating the same, and methods using the same. In one embodiment, a mass flow control apparatus comprises a flow modulating valve configured to modulate gas flow in a gas flow channel, a sensor device, such as a micro-electromechanical (MEMS) device, configured to generate a signal responsive to a condition of the gas flow, and a processing device operatively coupled to the flow modulating valve and the sensor device to control the flow modulating valve based on a signal received from the sensor device.

    Anneal module for semiconductor wafers
    13.
    发明授权
    Anneal module for semiconductor wafers 有权
    用于半导体晶片的退火模块

    公开(公告)号：US09245767B2

    公开(公告)日：2016-01-26

    申请号：US14025678

    申请日：2013-09-12

    Applicant: APPLIED Materials, Inc.

    Inventor： Vincent Steffan Francischetti ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Paul Wirth ,  Robert B. Moore

    IPC: H05B3/68 ,  F26B19/00 ,  H01L21/324 ,  H01L21/67 ,  H01L21/677

    CPC classification number: H01L21/324 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/677 ,  H01L21/67748

    Abstract: An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.

    Abstract translation: 用于退火半导体材料晶片和类似衬底的退火模块减少了颗粒污染和氧气进入，同时提供包括500℃工艺的均匀加热。 退火模块可以包括形成在具有内部冷却线的金属体中的处理室。 热板具有支撑在身体上的热扼流圈上的基座。 热板上的盖子中的气体分布器将气体均匀地流过晶片。 传送机构移动环以在热板和冷板之间移动晶片。

    Servo-control system
    14.
    发明授权
    Servo-control system 有权

    公开(公告)号：US12278134B2

    公开(公告)日：2025-04-15

    申请号：US18492488

    申请日：2023-10-23

    Applicant: Applied Materials, Inc.

    Inventor： Paul Wirth ,  Behzad Taheri

    IPC: H01L21/687 ,  F15B9/03 ,  F15B9/14 ,  F15B11/076

    Abstract: A lift apparatus includes a lift assembly and a servo-control system. The lift assembly includes at least one pneumatic actuator including a movable member to provide a load to transfer a substrate between a support and a transfer plane. The lift assembly further includes at least one proportional pneumatic valve to control fluid flow between the actuator and a pressurized fluid supply or a vent, a plurality of pressure sensors each to measure pressure in a respective supply line to the actuator, and at least one position sensor to measure a position of the movable member. The servo-control system includes a controller to determine an output force based on a commanded force and an estimated force, generate a control signal based on the output force, and apply the control signal to the proportional valve to move the movable member.

    Servo-control system
    16.
    发明授权
    Servo-control system 有权

    公开(公告)号：US11830760B2

    公开(公告)日：2023-11-28

    申请号：US17954227

    申请日：2022-09-27

    Applicant: Applied Materials, Inc.

    Inventor： Paul Wirth ,  Behzad Taheri

    IPC: H01L21/687 ,  F15B9/03 ,  F15B11/076 ,  F15B9/14

    CPC classification number: H01L21/68742 ,  F15B9/03 ,  F15B9/14 ,  F15B11/076

    Abstract: Disclosed herein are embodiments of a servo-control system comprising at least one pneumatic actuator comprising a movable member, at least one proportional pneumatic valve configured to control fluid flow between the at least one pneumatic actuator and a pressurized fluid supply or a vent, a plurality of pressure sensors each configured to independently measure pressure in a respective supply line to the at least one pneumatic actuator, at least one position sensor configured to measure a position of the moveable member, and a controller. The controller is configured to determine a control signal based at least in part on pressure measurements of the plurality of pressure sensors and a position measurement of the at least one position sensor, and apply the control signal to at least one proportional pneumatic valve to move the movable member to a target position.

    Walking beam chamber
    18.
    发明授权
    Walking beam chamber 有权

    公开(公告)号：US10923374B1

    公开(公告)日：2021-02-16

    申请号：US16519535

    申请日：2019-07-23

    Applicant: Applied Materials, Inc.

    Inventor： Paul Wirth

    IPC: H01L21/677 ,  H01L21/687 ,  B65G25/02

    Abstract: Disclosed is a device fabrication system comprising a wafer input loadlock, a wafer output loadlock, one or more wafer processing regions, and one or more walking beams for transporting one or more wafers from the wafer input loadlock through the wafer processing regions, and onto the wafer output loadlock. Also disclosed are methods for transporting one or more wafers through the device fabrication system described herein.

    ANNEAL MODULE FOR SEMICONDUCTOR WAFERS
    20.
    发明申请
    ANNEAL MODULE FOR SEMICONDUCTOR WAFERS 有权
    用于半导体波形的天线模块

    公开(公告)号：US20150069043A1

    公开(公告)日：2015-03-12

    申请号：US14025678

    申请日：2013-09-12

    Applicant: APPLIED Materials, Inc.

    Inventor： Vincent Steffan Francischetti ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Paul Wirth ,  Robert B. Moore

    IPC: H01L21/324 ,  H01L21/677 ,  H01L21/67

    CPC classification number: H01L21/324 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/677 ,  H01L21/67748

    Abstract: An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.

    Abstract translation: 用于退火半导体材料晶片和类似衬底的退火模块减少了颗粒污染和氧气进入，同时提供包括500℃工艺的均匀加热。 退火模块可以包括形成在具有内部冷却线的金属体中的处理室。 热板具有支撑在身体上的热扼流圈上的基座。 热板上的盖子中的气体分布器将气体均匀地流过晶片。 传送机构移动环以在热板和冷板之间移动晶片。

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