公开(公告)号：US20230245911A1

公开(公告)日：2023-08-03

申请号：US18130543

申请日：2023-04-04

Applicant: ASM IP Holding B.V.

Inventor： Surojit Ganguli ,  Todd Robert Dunn ,  Ankit Kimtee

IPC: H01L21/68 ,  G01N21/03 ,  H01L29/06

CPC classification number: H01L21/681 ,  G01N21/0303 ,  H01L29/0665

Abstract: A laser alignment fixture for a reactor system may be used to align components of the reactor system to allow for a uniform deposition of a thin film onto a substrate. The laser alignment fixture may include: a lid assembly; and a plurality of laser and sensor assemblies. The laser alignment fixture may align at least: a flow control ring, a susceptor, and a side wall of the reactor system.

公开(公告)号：US20230217548A1

公开(公告)日：2023-07-06

申请号：US18089635

申请日：2022-12-28

Applicant: ASM IP Holding B.V.

Inventor： Ankit Kimtee

IPC: H05B1/02 ,  H05B3/20

CPC classification number: H05B1/0233 ,  H05B1/0244 ,  H05B3/20 ,  H05B2203/013 ,  H05B2203/016 ,  H05B2203/005 ,  H01L21/67248

Abstract: An apparatus may provide a component, such as a showerhead, a pipe, a valve manifold, or a vessel, having a printed heater affixed to an outer surface of the component. In addition, a printed temperature sensor may be affixed to the outer surface of the component. The apparatus may further provide a controller to control the power to the printed heater according to data output from the printed temperature sensor.

公开(公告)号：US20210340671A1

公开(公告)日：2021-11-04

申请号：US17239768

申请日：2021-04-26

Applicant: ASM IP Holding B.V.

Inventor： Jianqiu Huang ,  Ankit Kimtee ,  Sudhanshu Biyani ,  Jonathan Robert Bakke ,  Eric James Shero

IPC: C23C16/448 ,  C23C16/44 ,  C23C16/455 ,  C23C16/50

Abstract: The present disclosure is generally directed to a solid source precursor delivery system. More specifically, the present disclosure is directed to a solid source precursor vessel that can be utilized to vaporize a supply of solid precursor stored within the vessel. The disclosed source vessel utilizes a plurality of individual cavities or pockets within the interior of the vessel. Each individual pocket may be loaded with precursor. In an arrangement, the pockets may be loaded with pre-formed blocks of compressed precursor material that typically have a higher density than was previously achieved when packing solid precursor within a source vessel. The increased density of the solid precursor material increases a capacity of the source vessel resulting in longer intervals between replacement and/or refilling the source vessel.

公开(公告)号：US20240254629A1

公开(公告)日：2024-08-01

申请号：US18631858

申请日：2024-04-10

Applicant: ASM IP Holding B.V.

Inventor： Ankit Kimtee ,  Rohan Vijay Rane ,  Herbert Terhorst ,  Eric James Shero ,  Jereld Lee Winkler ,  Michael Schmotzer ,  Shuyang Zhang ,  Todd Robert Dunn ,  Shubham Garg

IPC: C23C16/458 ,  C23C16/46

CPC classification number: C23C16/4586 ,  C23C16/46

Abstract: A susceptor assembly includes a heater pedestal and a cap coupled to the heater pedestal. The cap can include one or mor through holes to facilitate purging and/or reduce dead volumes associated with the susceptor assemblies. Reactor systems including such assemblies are also disclosed.

公开(公告)号：US11972969B2

公开(公告)日：2024-04-30

申请号：US18130543

申请日：2023-04-04

Applicant: ASM IP Holding B.V.

Inventor： Surojit Ganguli ,  Todd Robert Dunn ,  Ankit Kimtee

IPC: H01L21/68 ,  G01N21/03 ,  H01L29/06

CPC classification number: H01L21/681 ,  G01N21/0303 ,  H01L29/0665

Abstract: A laser alignment fixture for a reactor system may be used to align components of the reactor system to allow for a uniform deposition of a thin film onto a substrate. The laser alignment fixture may include: a lid assembly; and a plurality of laser and sensor assemblies. The laser alignment fixture may align at least: a flow control ring, a susceptor, and a side wall of the reactor system.

公开(公告)号：US20230369073A1

公开(公告)日：2023-11-16

申请号：US18195422

申请日：2023-05-10

Applicant: ASM IP Holding B.V.

Inventor： Ankit Kimtee ,  Sudhanshu Biyani

IPC: H01L21/67

CPC classification number: H01L21/67017

Abstract: Cabinets used in semiconductor fabrication processes comprise a housing with an internal space having a storage vessel disposed therein that contains material used for semiconductor fabrication processing that is maintained at a set temperature. Thermal management systems and devices disclosed herein comprise a thermal insulating material that is disposed on the housing and that is positioned at one or more locations on the cabinet to reduce thermal transfer from an external thermal energy source external from and adjacent the cabinet to the internal space and the storage vessel. Use of the thermal insulating material functions to mitigate or eliminate the unwanted transfer of thermal energy from the external thermal energy source to the storage vessel inside of the cabinet to thereby not influence the set temperature of the storage vessel and its contents to thereby promote the effective and efficient use of the stored material during semiconductor fabrication.

公开(公告)号：US20230207377A1

公开(公告)日：2023-06-29

申请号：US18087871

申请日：2022-12-23

Applicant: ASM IP Holding B.V.

Inventor： Rohan Vijay Rane ,  Herbert Terhorst ,  Eric James Shero ,  Ankit Kimtee ,  Jereld Lee Winkler ,  Michael Schmotzer ,  Shuyang Zhang ,  Todd Robert Dunn ,  Shubham Garg

IPC: H01L21/687 ,  C23C16/44

CPC classification number: H01L21/68735 ,  C23C16/4408 ,  H01L21/68785

Abstract: A semiconductor processing device comprises a susceptor assembly comprising a wafer support configured to support a wafer. The wafer support comprises a wafer support body configured to support the wafer, a purge channel extending laterally from an inner portion of the wafer support body to an outer portion of the wafer support body, a first plenum channel disposed at the outer portion of the wafer support and in fluid communication with the purge channel, and an outlet to deliver purge gas to an edge of the wafer, the outlet in fluid communication with the first plenum channel, a purge gas supply hole on a surface opposite to the wafer support body. The purge gas supply hole is in fluid communication with the purge channel, and a plurality of first purge holes fluidly communicated with the first plenum channel and the purge channel.

公开(公告)号：US20220384063A1

公开(公告)日：2022-12-01

申请号：US17825460

申请日：2022-05-26

Applicant: ASM IP Holding B.V.

Inventor： Ankit Kimtee

IPC: G21C19/303

Abstract: A contaminant trap system of a reactor system may comprise a baffle plate stack comprising at least one baffle plate comprising an aperture spanning through a baffle plate body of the baffle plate, and a body portion; and at least one complementary baffle plate comprising a complementary aperture spanning through a complementary baffle plate body of the complementary baffle plate, and a complementary body portion. The at least one baffle plate and the at least one complementary baffle plate may be disposed in a baffle plate order between a first end and a second end of the baffle plate stack in which the baffle plates alternate with the complementary baffle plates, such that no two baffle plates or no two complementary baffle plates are adjacent in the baffle plate order. The at least one baffle plate may comprise a sintered material.

公开(公告)号：US20210230744A1

公开(公告)日：2021-07-29

申请号：US17159488

申请日：2021-01-27

Applicant: ASM IP Holding B.V.

Inventor： Ankit Kimtee ,  Rohan Rane

IPC: C23C16/44 ,  B01D46/00 ,  B01D46/10

Abstract: A contaminant trap system of a reactor system may comprise a baffle plate stack comprising at least one baffle plate comprising an aperture spanning through a baffle plate body of the baffle plate, and a solid body portion; and at least one complementary baffle plate comprising a complementary aperture spanning through a complementary baffle plate body of the complementary baffle plate, and a complementary solid body portion. The at least one baffle plate and the at least one complementary baffle plate may be disposed in a baffle plate order between a first end and a second end of the baffle plate stack in which the baffle plates alternate with the complementary baffle plates, such that no two baffle plates or no two complementary baffle plates are adjacent in the baffle plate order.

公开(公告)号：US20210214846A1

公开(公告)日：2021-07-15

申请号：US17149023

申请日：2021-01-14

Applicant: ASM IP HOLDING B.V.

Inventor： Dinkar Nandwana ,  Carl Louis White ,  Eric James Shero ,  William George Petro ,  Herbert Terhorst ,  Gnyanesh Trivedi ,  Mark Olstad ,  Ankit Kimtee ,  Kyle Fondurulia ,  Michael Schmotzer ,  Jereld Lee Winkler

IPC: C23C16/455 ,  C23C16/458

Abstract: The present disclosure pertains to embodiments of a showerhead assembly which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The showerhead assembly has a showerhead which has an increased thickness which advantageously decreases reactor chamber size and decreases cycling time. Decreased cycling time can improve throughput and decrease costs.