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公开(公告)号：US10768398B2
公开(公告)日：2020-09-08
申请号：US14426242
申请日：2013-09-09
Applicant: CORNELL UNIVERSITY
Inventor： Amit Lal , Serhan Ardanuc
IPC: F24J2/00 , G02B19/00 , A01M21/04 , A01M3/00 , A01G11/00 , A01M17/00 , A01M19/00 , A01G9/24 , F24S20/00 , G02B26/08 , G02B27/00
Abstract: Methods, structures, devices and systems are disclosed for solarizing soil using a moveable optical focusing array. In one example, an apparatus to solarize soil from a moveable platform includes a vehicle, an array of mirrors located on the exterior of the vehicle, in which the mirrors are steerable to control the orientation of the mirrors to direct sunlight to a spot on soil that generates heat to a solarize the soil, and a sensor coupled to the vehicle to measure the temperature of the soil, in which the orientation of the mirrors is determined based at least in part on the measured temperature to control the temperature of the soil.
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12.发明申请公开(公告)号：US20200187344A1
公开(公告)日：2020-06-11
申请号：US16538563
申请日：2019-08-12
Applicant: Cornell University
Inventor： Amit Lal , Thomas Schenkel , Arun Persaud , Qing Ji , Peter Seidl , Will Waldron , Serhan Ardanuc , Vinaya Kumar Kadayra Basavarajappa
Abstract: A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.
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13.发明申请公开(公告)号：US20150219885A1
公开(公告)日：2015-08-06
申请号：US14426242
申请日：2013-09-09
Applicant: CORNELL UNIVERSITY
Inventor： Amit Lal , Serhan Ardanuc
Abstract: Methods, structures, devices and systems are disclosed for solarizing soil using a moveable optical focusing array. In one example, an apparatus to solarize soil from a moveable platform includes a vehicle, an array of mirrors located on the exterior of the vehicle, in which the mirrors are steerable to control the orientation of the mirrors to direct sunlight to a spot on soil that generates heat to a solarize the soil, and a sensor coupled to the vehicle to measure the temperature of the soil, in which the orientation of the mirrors is determined based at least in part on the measured temperature to control the temperature of the soil.
Abstract translation: 公开了使用可移动光学聚焦阵列使土壤日晒的方法，结构，装置和系统。 在一个示例中，从可移动平台使土壤日晒的装置包括车辆，位于车辆外部的反射镜阵列，其中反射镜可操纵以控制反射镜的定向以将阳光直射到土壤上的斑点 其产生热量以使土壤太阳化，以及耦合到车辆的传感器以测量土壤的温度，其中至少部分地基于所测量的温度来确定反射镜的取向以控制土壤的温度。
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Patent Agency Ranking
公开(公告)号：US20210117756A1
公开(公告)日：2021-04-22
申请号：US17114040
申请日：2020-12-07
Applicant: Cornell University
Inventor： Amit Lal , Serhan Ardanuc , Jason T. Hoople , Justin C. Kuo
Abstract: Techniques, systems, and devices are described for implementing for implementing computation devices and artificial neurons based on nanoelectromechanical (NEMS) systems. In one aspect, a nanoelectromechanical system (NEMS) based computing element includes: a substrate; two electrodes configured as a first beam structure and a second beam structure positioned in close proximity with each other without contact, wherein the first beam structure is fixed to the substrate and the second beam structure is attached to the substrate while being free to bend under electrostatic force. The first beam structure is kept at a constant voltage while the other voltage varies based on an input signal applied to the NEMS based computing element.
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公开(公告)号：US10912184B2
公开(公告)日：2021-02-02
申请号：US16538563
申请日：2019-08-12
Applicant: Cornell University
Inventor： Amit Lal , Thomas Schenkel , Arun Persaud , Qing Ji , Peter Seidl , Will Waldron , Serhan Ardanuc , Vinaya Kumar Kadayra Basavarajappa
Abstract: A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.
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公开(公告)号：US10383205B2
公开(公告)日：2019-08-13
申请号：US16098537
申请日：2017-05-04
Applicant: CORNELL UNIVERSITY
Inventor： Amit Lal , Thomas Schenkel , Arun Persaud , Qing Ji , Peter Seidl , Will Waldron , Serhan Ardanuc , Vinaya Kumar Kadayra Basavarajappa
Abstract: A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.
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公开(公告)号：US09867272B2
公开(公告)日：2018-01-09
申请号：US14436859
申请日：2013-10-17
Applicant: Cornell University
Inventor： Amit Lal , Yue Shi , Serhan Ardanuc , June-Ho Hwang , Farhan Rana
IPC: H05H7/04 , H05H9/04 , H01J37/06 , H01J37/147
CPC classification number: H05H9/045 , H01J37/06 , H01J37/1472 , H01J2237/063 , H01J2237/15 , H05H7/04 , H05H9/042 , H05H2007/043 , H05H2007/046
Abstract: A system that generates short charged particle packets or pulses (e.g., electron packets) without requiring a fast-switching-laser source is described. This system may include a charged particle source that produces a stream of continuous charged particles to propagate along a charged particle path. The system also includes a charged particle deflector positioned in the charged particle path to deflect the stream of continuous charged particles to a set of directions different from the charged particle path. The system additionally includes a series of beam blockers located downstream from the charged particle deflector and spaced from one another in a linear configuration as a beam-blocker grating. This beam-blocker grating can interact with the deflected stream of charged particles and divide the stream of the charged particles into a set of short particle packets. In one embodiment, the charged particles are electrons. The beam blockers can be conductors.
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公开(公告)号：US09842812B2
公开(公告)日：2017-12-12
申请号：US14660726
申请日：2015-03-17
Applicant: Honeywell International Inc. , Cornell University
Inventor： Steven Tin , Jeffrey James Kriz , Steven J. Eickhoff , Jeff A. Ridley , Amit Lal , Christopher Ober , Serhan Ardanuc , Ved Gund , Alex Ruyack , Katherine Camera
IPC: H01L23/00 , H01M8/2475 , B29C35/02 , B81B7/00 , B81C1/00 , C23C16/26 , C23C16/44 , H01L21/02 , H01L21/268 , H01L21/306 , H01L21/311 , H01L21/768 , H01L25/16 , H01L23/58 , B29L31/34
CPC classification number: H01L23/564 , B29C35/02 , B29L2031/34 , B81B7/0077 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00333 , B81C2201/013 , C23C16/26 , C23C16/44 , H01L21/02118 , H01L21/268 , H01L21/30604 , H01L21/31133 , H01L21/76837 , H01L21/76877 , H01L21/76898 , H01L23/57 , H01L23/573 , H01L23/576 , H01L23/58 , H01L25/16 , H01L2223/6677 , H01L2924/0002 , H01L2924/14 , H01M8/2475 , H01L2924/00
Abstract: Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.
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