公开(公告)号：US09196797B2

公开(公告)日：2015-11-24

申请号：US13661272

申请日：2012-10-26

Applicant: GENESIS PHOTONICS INC.

Inventor： Yu-Yun Lo ,  Yi-Ru Huang ,  Chih-Ling Wu ,  Tzu-Yang Lin ,  Yun-Li Li

IPC: H01L33/44 ,  H01L33/40 ,  H01L33/46 ,  H01L33/42

CPC classification number: H01L33/42 ,  H01L33/38 ,  H01L33/405 ,  H01L33/46 ,  H01L2224/14 ,  H01L2933/0016

Abstract: The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly. Thereby, the reflection layer can have the effect of mirror reflection and the scattering phenomenon on the reflected light can be reduced as well.

Abstract translation: 本发明涉及发光二极管（LED）和倒装芯片封装的LED器件。 本发明提供一种LED装置。 LED装置被翻转并与封装基板电连接，从而形成倒装芯片封装的LED器件。 LED装置主要在第二种掺杂层和反射层之间具有欧姆接触层和平坦化缓冲层。 欧姆接触层改善了第二型掺杂层和反射层之间的欧姆接触特性，而不影响LED器件和倒装芯片封装的LED器件的发光效率。 设置在欧姆接触层和反射层之间的平坦化缓冲层id，用于使欧姆接触层平滑，从而使反射层平滑地粘附到平坦化缓冲层。 因此，反射层可以具有镜面反射的效果，并且也可以减小反射光上的散射现象。

公开(公告)号：US09165909B2

公开(公告)日：2015-10-20

申请号：US14248343

申请日：2014-04-09

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yun-Li Li ,  Po-Jen Su

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L24/14 ,  H01L27/156 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances.

Abstract translation: 提供了包括基板，多个第一发光二极管（LED）芯片和至少一个第二LED芯片的光源模块。 基板具有上表面。 多个第一LED芯片设置在上表面上并电连接到基板。 第二LED芯片设置在上表面上并电连接到基板。 第一距离在离开基板的上表面的每个第一LED芯片的顶表面和上表面之间，第二距离在距离基板的上表面的第二LED芯片的顶表面之间;第二距离在第二LED芯片的顶表面之间， 上表面和第二距离大于每个第一距离。

公开(公告)号：US09748209B2

公开(公告)日：2017-08-29

申请号：US14886110

申请日：2015-10-19

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yun-Li Li ,  Po-Jen Su

IPC: H01L25/07 ,  H01L33/62 ,  H01L25/075 ,  H01L23/00 ,  H01L27/15

CPC classification number: H01L25/0753 ,  H01L24/14 ,  H01L27/156 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.

公开(公告)号：US09123872B2

公开(公告)日：2015-09-01

申请号：US14510758

申请日：2014-10-09

Applicant: GENESIS PHOTONICS INC.

Inventor： Cheng-Yen Chen ,  Chun-Chieh Chin ,  Yun-Li Li

IPC: H01L33/52 ,  H01L33/50 ,  H01L33/00 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L31/0203 ,  H01L51/52 ,  F21K99/00

CPC classification number: H01L33/52 ,  F21K9/90 ,  H01L31/0203 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/483 ,  H01L33/50 ,  H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L51/5237 ,  H01L51/524 ,  H01L51/5253 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold.

Abstract translation: 公开了一种制造发光二极管（LED）封装元件的方法。 至少一个LED设置在光固化树脂内的基板上，其中LED被基板和光固化树脂完全覆盖。 LED被提供给LED以使LED发射多个光束，使得光固化树脂的一部分被光束固化以获得阳模。 执行分离处理以分离阳模和光固化树脂，LED和基底的另一部分。 执行翻转过程以通过阳模制造阴模，其中阴模具有至少一个具有与阳模相同形状的容纳空间。 进行成形工序以形成具有与阳模相同形状的包装部件。

公开(公告)号：US20150036129A1

公开(公告)日：2015-02-05

申请号：US14311364

申请日：2014-06-23

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Pin Chen ,  Yun-Li Li ,  Shou-Wen Hsu ,  Chih-Hung Tseng ,  Pei-Yi Huang ,  Ching-Cheng Sun ,  Tsung-Syun Huang ,  Yung-Tsung Lin ,  Ping-Tsung Tsai

IPC: G01N21/01 ,  G01N21/95

CPC classification number: G01N21/63 ,  G01N21/6489 ,  G01N21/8806 ,  G01N21/95 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2201/061 ,  G01N2201/0636

Abstract: An inspection apparatus is capable for inspecting at least one light-emitting device. The inspection apparatus includes a working machine and an inspection light source. The inspection light source is disposed on the working machine and located above the light-emitting device. A dominant wavelength of the inspection light source is smaller than a dominant wavelength of the light-emitting device so as to excite the light-emitting device and get an optical property of the light-emitting device.

Abstract translation: 检查装置能够检查至少一个发光装置。 检查装置包括作业机和检查光源。 检查光源设置在工作机上并位于发光装置的上方。 检查光源的主波长小于发光装置的主波长，从而激发发光装置并获得发光装置的光学特性。

公开(公告)号：US20150036128A1

公开(公告)日：2015-02-05

申请号：US14311362

申请日：2014-06-23

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Pin Chen ,  Gwo-Jiun Sheu ,  Yun-Li Li

IPC: G01N21/01 ,  G01N21/95

CPC classification number: G01N21/6489 ,  G01N21/8806 ,  G01N21/95 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2021/8819

Abstract: An inspection apparatus is capable of inspecting a light-emitting diode (LED). The inspection apparatus includes a reflecting cover, a base plate, a light-collecting unit and at least one inspection light source. An enclosed space is defined by the base plate and the reflecting cover having an opening. The LED is disposed on the base plate and located in the enclosed space. The light-collecting unit is disposed above the LED and in the enclosed space. A vertical distance from the light-collecting unit to the LED is H, a width of the opening of the reflecting cover is W, and H/W=0.05 to 10. The inspection light source is in the enclosed space. An inspection light emitted from the inspection light source is reflected by the reflecting cover and then emitted into the LED.A dominant wavelength of the inspection light source is smaller than that of the LED.

Abstract translation: 检查装置能够检查发光二极管（LED）。 检查装置包括反射盖，基板，聚光单元和至少一个检查光源。 封闭空间由基板和具有开口的反射盖限定。 LED设置在基板上并位于封闭空间中。 集光单元设置在LED的上方和封闭空间中。 从集光单元到LED的垂直距离为H，反射盖的开口宽度为W，H / W = 0.05〜10。检查光源位于封闭空间内。 从检查光源发出的检查光被反射罩反射，然后发射到LED中。 检测光源的主波长小于LED的主波长。

公开(公告)号：US20160153909A1

公开(公告)日：2016-06-02

申请号：US15016301

申请日：2016-02-05

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Pin Chen ,  Yun-Li Li ,  Shou-Wen Hsu ,  Chih-Hung Tseng ,  Pei-Yi Huang ,  Ching-Cheng Sun ,  Tsung-Syun Huang ,  Yung-Tsung Lin ,  Ping-Tsung Tsai

IPC: G01N21/63 ,  G01N21/88

CPC classification number: G01N21/63 ,  G01N21/6489 ,  G01N21/8806 ,  G01N21/95 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2201/061 ,  G01N2201/0636

Abstract: An inspection apparatus is capable for inspecting at least one light-emitting device. The inspection apparatus includes a working machine and an inspection light source. The inspection light source is disposed on the working machine and located above the light-emitting device. A dominant wavelength of the inspection light source is smaller than a dominant wavelength of the light-emitting device so as to excite the light-emitting device and get an optical property of the light-emitting device.

Abstract translation: 检查装置能够检查至少一个发光装置。 检查装置包括作业机和检查光源。 检查光源设置在工作机上并位于发光装置的上方。 检查光源的主波长小于发光装置的主波长，从而激发发光装置并获得发光装置的光学特性。

公开(公告)号：US20140306246A1

公开(公告)日：2014-10-16

申请号：US14248343

申请日：2014-04-09

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yun-Li Li ,  Po-Jen Su

IPC: H01L27/15

CPC classification number: H01L25/0753 ,  H01L24/14 ,  H01L27/156 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances.

Abstract translation: 提供了包括基板，多个第一发光二极管（LED）芯片和至少一个第二LED芯片的光源模块。 基板具有上表面。 多个第一LED芯片设置在上表面上并电连接到基板。 第二LED芯片设置在上表面上并电连接到基板。 第一距离在离开基板的上表面的每个第一LED芯片的顶表面和上表面之间，第二距离在距离基板的上表面的第二LED芯片的顶表面之间;第二距离在第二LED芯片的顶表面之间， 上表面和第二距离大于每个第一距离。

公开(公告)号：US08767198B2

公开(公告)日：2014-07-01

申请号：US13838824

申请日：2013-03-15

Applicant: Genesis Photonics Inc

Inventor： Tai-Cheng Tsai ,  Tai-Wei Wu ,  Gwo-Jiun Sheu ,  Shou-Wen Hsu ,  Yun-Li Li

IPC: G01J1/00 ,  G01J1/42 ,  G01J1/04

CPC classification number: G01J1/42 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0411 ,  G01J1/0422 ,  G01J1/0425 ,  G01J1/4257 ,  G01J2001/4247 ,  G01R31/2635 ,  G02B19/0066 ,  G02B19/0076

Abstract: A detection apparatus comprising a chuck, a probe device, a light-sensing device and a light-concentrating unit is disclosed. The chuck bears light-emitting diode chips. The probe device includes two probes and a power supply. The end point of the probes respectively electrically connects with one of the light-emitting diode chips and the power supply to make the light-emitting diode chip emits a plurality of light beams. The light-sensing device is disposed on one side of a light-emitting surface of the light-emitting diode chip so as to receive the light beams emitted by the light-emitting diode chip. The light-concentrating unit is disposed between the light-emitting diode chip and the light-sensing device to concentrate the light beams emitted by the light-emitting diode chip.

Abstract translation: 公开了一种包括卡盘，探针装置，感光装置和聚光装置的检测装置。 卡盘带有发光二极管芯片。 探头装置包括两个探针和一个电源。 探针的终点分别与发光二极管芯片和电源中的一个电连接，以使发光二极管芯片发射多个光束。 光感测装置设置在发光二极管芯片的发光面的一侧，以便接收由发光二极管芯片发射的光束。 光集中单元设置在发光二极管芯片和感光装置之间，以集中由发光二极管芯片发射的光束。