公开(公告)号：US11738994B2

公开(公告)日：2023-08-29

申请号：US18080169

申请日：2022-12-13

Applicant: InvenSense, Inc.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01L19/04 ,  G01K1/20 ,  B81B7/00 ,  G01L9/00

CPC classification number: B81B7/0019 ,  B81B7/0087 ,  G01K1/20 ,  G01L9/0072 ,  G01L19/04 ,  B81B2201/0242

Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

公开(公告)号：US11268976B2

公开(公告)日：2022-03-08

申请号：US15586497

申请日：2017-05-04

Applicant: InvenSense, Inc.

Inventor： Alexander Castro ,  Matthew Thompson ,  Leonardo Baldasarre ,  Sarah Nitzan ,  Houri Johari-Galle

IPC: G01P15/125 ,  G01P15/08 ,  B81B3/00

Abstract: A MEMS sensor includes a proof mass that is suspended over a substrate. A sense electrode is located on a top surface of the substrate parallel to the proof mass, and forms a capacitor with the proof mass. The sense electrodes have a plurality of slots that provide improved performance for the MEMS sensor. A measured value sensed by the MEMS sensor is determined based on the movement of the proof mass relative to the slotted sense electrode.

公开(公告)号：US11073531B2

公开(公告)日：2021-07-27

申请号：US16547268

申请日：2019-08-21

Applicant: INVENSENSE, INC.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01P1/00 ,  G01P15/125

Abstract: A microelectromechanical (MEMS) accelerometer has a proof mass and a fixed electrode. The fixed electrode is located relative to the proof mass such that a capacitance formed by the fixed electrode and the proof mass changes in response to a linear acceleration along a sense axis of the accelerometer. The MEMS accelerometer is exposed to heat sources that produce a z-axis thermal gradient in MEMS accelerometer and an in-plane thermal gradient in the X-Y plane of the MEMS accelerometer. The z-axis thermal gradient is sensed with a plurality of thermistors located relative to anchoring regions of a CMOS layer of the MEMS accelerometer. The configuration of the thermistors within the CMOS layer measures the z-axis thermal gradient while rejecting other lateral thermal gradients. Compensation is performed at the accelerometer based on the z-axis thermal gradient.

公开(公告)号：US20210055321A1

公开(公告)日：2021-02-25

申请号：US16547268

申请日：2019-08-21

Applicant: INVENSENSE, INC.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01P1/00 ,  G01P15/125

Abstract: A microelectromechanical (MEMS) accelerometer has a proof mass and a fixed electrode. The fixed electrode is located relative to the proof mass such that a capacitance formed by the fixed electrode and the proof mass changes in response to a linear acceleration along a sense axis of the accelerometer. The MEMS accelerometer is exposed to heat sources that produce a z-axis thermal gradient in MEMS accelerometer and an in-plane thermal gradient in the X-Y plane of the MEMS accelerometer. The z-axis thermal gradient is sensed with a plurality of thermistors located relative to anchoring regions of a CMOS layer of the MEMS accelerometer. The configuration of the thermistors within the CMOS layer measures the z-axis thermal gradient while rejecting other lateral thermal gradients. Compensation is performed at the accelerometer based on the z-axis thermal gradient.

公开(公告)号：US10571268B2

公开(公告)日：2020-02-25

申请号：US15828323

申请日：2017-11-30

Applicant: InvenSense, Inc.

Inventor： Matthew Thompson ,  Houri Johari-Galle ,  Leonardo Baldasarre ,  Sarah Nitzan ,  Kirt Williams

IPC: G01P15/125 ,  G01C19/5783 ,  G01C19/5712 ,  B81B3/00

Abstract: A MEMS sensor includes a MEMS layer, a cap layer, and a substrate layer. The MEMS layer includes a suspended spring-mass system that moves in response to a sensed inertial force. The suspended spring-mass system is suspended from one or more anchors. The anchors are coupled to each of the cap layer and the substrate layer by anchoring components. The anchoring components are offset such that a force applied to the cap layer or the substrate layer causes a rotation of the anchor and such that the suspended spring-mass system substantially remains within the original MEMS layer.

公开(公告)号：US20190187172A1

公开(公告)日：2019-06-20

申请号：US16206882

申请日：2018-11-30

Applicant: INVENSENSE, INC.

Inventor： Matthew Julian Thompson ,  David deKoninck ,  Sarah Nitzan ,  Houri Johari-Galle

IPC: G01P21/00 ,  G01P15/125

CPC classification number: G01P21/00 ,  G01P15/125

Abstract: Facilitating self-calibration of a sensor device via modification of a sensitivity of the sensor device is presented herein. A sensor system can comprise a sensor component comprising a sensor that generates an output signal based on an external excitation of the sensor; a sensitivity modification component that modifies a sensitivity of the sensor by a defined amount; and a calibration component that measures a first output value of the output signal before a modification of the sensitivity by the defined amount, measures a second output value of the output signal after the modification of the sensitivity by the defined amount, and determines, based on a difference between the first output value and the second output value, an offset portion of the output signal. Further, the calibration component can modify, based on the offset portion, the output signal.

公开(公告)号：US20180238927A1

公开(公告)日：2018-08-23

申请号：US15586497

申请日：2017-05-04

Applicant: InvenSense, Inc.

Inventor： Alexander Castro ,  Matthew Thompson ,  Leonardo Baldasarre ,  Sarah Nitzan ,  Houri Johari-Galle

IPC: G01P15/125 ,  B81B3/00

CPC classification number: G01P15/125 ,  B81B3/0078 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01P15/0802

Abstract: A MEMS sensor includes a proof mass that is suspended over a substrate. A sense electrode is located on a top surface of the substrate parallel to the proof mass, and forms a capacitor with the proof mass. The sense electrodes have a plurality of slots that provide improved performance for the MEMS sensor. A measured value sensed by the MEMS sensor is determined based on the movement of the proof mass relative to the slotted sense electrode.