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    ELECTRICAL INTERCONNECT IC DEVICE SOCKET
    16.
    发明申请
    ELECTRICAL INTERCONNECT IC DEVICE SOCKET 有权
    电气互连IC器件插座

    公开(公告)号：US20130206468A1

    公开(公告)日：2013-08-15

    申请号：US13880461

    申请日：2011-12-05

    Applicant: James Rathburn

    Inventor： James Rathburn

    IPC: H05K1/02 ,  H05K3/40

    CPC classification number: H05K1/0228 ,  H01R43/0256 ,  H05K1/0296 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/40 ,  H05K3/4046 ,  H05K2201/10378 ,  H05K2203/041 ,  Y10T29/49147

    Abstract: A surface mount electrical interconnect is disclosed that provides an interface between a PCB and solder balls of a BGA device. The electrical interconnect includes a socket substrate and a plurality of electrically conductive contact members. The socket substrate has a first layer with a plurality of openings configured to receive solder balls of the BGA device and has a second layer with a plurality of slots defined therethrough that correspond to the plurality of openings. The contact members may be disposed in the openings in the first layer and through the plurality of slots of the second layer of the socket substrate. The contact members can be configured to engage a top portion, a center diameter, and a lower portion of the solder ball of the BGA device. Each contact member electrically couples a solder ball on the BGA device to the PCB.

    Abstract translation: 公开了一种表面贴装电互连，其提供了PCB与BGA器件的焊球之间的界面。 电互连包括插座衬底和多个导电接触构件。 插座衬底具有第一层，其具有多个开口，其被配置为接收BGA器件的焊球，并且具有第二层，其中限定了多个槽，其对应于多个开口。 接触构件可以设置在第一层中的开口中并且穿过插座衬底的第二层的多个槽中。 接触构件可以构造成接合BGA装置的焊球的顶部，中心直径和下部。 每个接触构件将BGA器件上的焊球电耦合到PCB。

    SEMICONDUCTOR SOCKET
    17.
    发明申请
    SEMICONDUCTOR SOCKET 有权
    半导体插座

    公开(公告)号：US20120051016A1

    公开(公告)日：2012-03-01

    申请号：US13319158

    申请日：2010-06-15

    Applicant: James Rathburn

    Inventor： James Rathburn

    IPC: H05K7/00 ,  H01R9/00 ,  H05K1/11

    CPC classification number: H05K1/141 ,  H01R12/52 ,  H01R12/57 ,  H05K3/3436 ,  H05K2201/0311 ,  H05K2201/049 ,  H05K2201/10295 ,  H05K2201/10719 ,  Y10T29/49139 ,  Y10T29/49147

    Abstract: A semiconductor socket including a substrate with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete contact members are located in the plurality of the through holes. The plurality of contact members each include a proximal end accessible from the second surface, and a distal end extending above the first surface. At least one dielectric layer is bonded to the second surface of the substrate with recesses corresponding to target circuit geometry. A conductive material deposited in at least a portion of the recesses to form conductive traces redistributing terminal pitch of the proximal ends of the contact members.

    Abstract translation: 一种半导体插座，包括具有从第一表面延伸到第二表面的多个通孔的基板。 多个离散接触构件位于多个通孔中。 多个接触构件各自包括可从第二表面接近的近端和在第一表面上方延伸的远端。 至少一个电介质层与基板的第二表面结合，其凹部对应于目标电路几何形状。 沉积在至少一部分凹陷中的导电材料以形成重新分布接触构件的近端的端子间距的导电迹线。

    COMPLIANT PRINTED CIRCUIT PERIPHERAL LEAD SEMICONDUCTOR TEST SOCKET
    18.
    发明申请
    COMPLIANT PRINTED CIRCUIT PERIPHERAL LEAD SEMICONDUCTOR TEST SOCKET 有权
    合格打印电路外围引线半导体测试插座

    公开(公告)号：US20120049877A1

    公开(公告)日：2012-03-01

    申请号：US13318171

    申请日：2010-05-27

    Applicant: James Rathburn

    Inventor： James Rathburn

    IPC: G01R31/00 ,  H05K3/00

    CPC classification number: G01R1/0483 ,  G01R1/0466 ,  H05K7/1061

    Abstract: A test socket that provides a temporary interconnect between terminals on an integrated circuit (IC) device and contact pads on a test printed circuit board (PCB). The test socket includes a compliant printed circuit and a socket housing. The compliant printed circuit includes at least one compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located along a second major surface, and a plurality of conductive traces electrically coupling the first and second contact members. The compliant layer is positioned to bias the first contact members against the terminals on the IC device and the second contact members against contact pads on the test PCB. The socket housing is coupled to the compliant printed circuit so the first contact members are positioned in a recess of the socket housing sized to receive the IC device.

    Abstract translation: 一个测试插座，用于在集成电路（IC）器件的端子和测试印刷电路板（PCB）上的接触焊盘之间提供临时互连。 测试插座包括兼容印刷电路和插座外壳。 柔性印刷电路包括至少一个柔性层，沿着第一主表面定位的多个第一接触构件，沿着第二主表面定位的多个第二接触构件，以及多个导电迹线，电耦合第一和第二接触 会员 柔性层被定位成将第一接触构件抵靠在IC器件上的端子上，并且第二接触构件抵抗测试PCB上的接触焊盘。 插座壳体耦合到柔性印刷电路，使得第一接触构件位于插座壳体的凹部中，其尺寸设置成接收IC器件。

    RESILIENT CONDUCTIVE ELECTRICAL INTERCONNECT
    19.
    发明申请
    RESILIENT CONDUCTIVE ELECTRICAL INTERCONNECT 有权
    灵活导电电气互连

    公开(公告)号：US20120043130A1

    公开(公告)日：2012-02-23

    申请号：US13318382

    申请日：2010-05-27

    Applicant: James Rathburn

    Inventor： James Rathburn

    IPC: H05K1/11 ,  H05K3/30

    CPC classification number: H01R13/2414 ,  H01R13/2485 ,  Y10T29/49139

    Abstract: An interconnect assembly including a resilient material with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete, free-flowing conductive particles is located in the through holes. The conductive particles are preferably substantially free of non-conductive materials. A plurality of first contact tips are located in the through holes adjacent the first surface and a plurality of second contact tips are located in the through holes adjacent the second surface. The resilient material provides the required resilience, while the conductive particles provide a conductive path substantially free of non-conductive materials.

    Abstract translation: 一种互连组件，包括具有从第一表面延伸到第二表面的多个通孔的弹性材料。 多个离散的，自由流动的导电颗粒位于通孔中。 导电颗粒优选基本上不含非导电材料。 多个第一接触尖端位于邻近第一表面的通孔中，并且多个第二接触末端位于与第二表面相邻的通孔中。 弹性材料提供所需的弹性，而导电颗粒提供基本上不含非导电材料的导电路径。

    COMPOSITE POLYMER-METAL ELECTRICAL CONTACTS
    20.
    发明申请
    COMPOSITE POLYMER-METAL ELECTRICAL CONTACTS 有权
    复合聚合物金属电气联系

    公开(公告)号：US20120043119A1

    公开(公告)日：2012-02-23

    申请号：US13318369

    申请日：2010-05-27

    Applicant: James Rathburn

    Inventor： James Rathburn

    IPC: H05K1/03 ,  H05K1/02 ,  H01R43/00 ,  H05K1/09

    CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01R12/52 ,  H05K2201/0133 ,  H05K2201/0311 ,  Y10T29/49224 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    Abstract: An array of composite polymer-metal contact members adapted to form solder free electrical connections with a first circuit member. The contact members include a resilient polymeric base layer and an array of metalized traces printed on selected portions of the base layer. Conductive plating is applied to the metalized layer to create an array of conductive paths. The resilient polymeric base layer, the metalized layer, and the conductive plating have an aggregate spring constant sufficient to maintain distal portions of the contact members in a cantilevered configuration and to form a stable electrical connection between the distal portions and the first circuit member solely by compressive engagement.

    Abstract translation: 一组复合聚合物 - 金属接触构件，适于与第一电路构件形成无焊料电连接。 接触构件包括弹性聚合物基底层和印刷在基底层的选定部分上的金属化迹线阵列。 将导电电镀施加到金属化层以形成导电路径阵列。 弹性聚合物基层，金属化层和导电镀层具有足够的聚集弹簧常数，以使接触构件的远侧部分保持悬臂结构，并且仅在远侧部分和第一电路部件之间形成稳定的电连接 压缩接合。

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