公开(公告)号：US20230317314A1

公开(公告)日：2023-10-05

申请号：US18331637

申请日：2023-06-08

Applicant: Liquid Wire Inc.

Inventor： Jesse Michael Martinez ,  Michael Adventure Hopkins ,  Charles J. Kinzel ,  Trevor Antonio Rivera ,  Mark William Ronay ,  Edward Martin Godshalk

IPC: H01B5/02

CPC classification number: H01B5/02

Abstract: Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.

公开(公告)号：US20220377885A1

公开(公告)日：2022-11-24

申请号：US17663764

申请日：2022-05-17

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, JR. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/42

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20220068787A1

公开(公告)日：2022-03-03

申请号：US17395130

申请日：2021-08-05

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L23/31

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

公开(公告)号：US20240266275A1

公开(公告)日：2024-08-08

申请号：US18440381

申请日：2024-02-13

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/49861 ,  H01L21/4846

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

公开(公告)号：US20240047334A1

公开(公告)日：2024-02-08

申请号：US18316586

申请日：2023-05-12

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, JR. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49833 ,  H01L23/4985 ,  H01L23/49822 ,  H01L23/49838 ,  H01L21/486 ,  H01L21/56 ,  H01L21/485 ,  H01L21/4857 ,  H01L23/3157

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US11882653B2

公开(公告)日：2024-01-23

申请号：US17663764

申请日：2022-05-17

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, Jr. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H05K1/03 ,  H05K3/42 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/036 ,  H05K1/181 ,  H05K3/303 ,  H05K3/42

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20230290717A1

公开(公告)日：2023-09-14

申请号：US18114420

申请日：2023-02-27

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/49861 ,  H01L21/4846

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

公开(公告)号：US11682615B2

公开(公告)日：2023-06-20

申请号：US16885854

申请日：2020-05-28

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, Jr. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49833 ,  H01L21/485 ,  H01L21/486 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49822 ,  H01L23/49838

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US11088063B2

公开(公告)日：2021-08-10

申请号：US16548379

申请日：2019-08-22

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.