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公开(公告)号：US12125778B2
公开(公告)日：2024-10-22
申请号：US18440381
申请日：2024-02-13
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Edward Martin Godshalk , Charles J. Kinzel
IPC: H01L23/498 , H01L21/48 , H01L23/31
CPC classification number: H01L23/49838 , H01L23/3121 , H01L23/4985 , H01L23/49861 , H01L21/4846
Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
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公开(公告)号：US11955420B2
公开(公告)日：2024-04-09
申请号：US18114420
申请日：2023-02-27
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Edward Martin Godshalk , Charles J. Kinzel
IPC: H01L23/498 , H01L23/31 , H01L21/48
CPC classification number: H01L23/49838 , H01L23/3121 , H01L23/4985 , H01L23/49861 , H01L21/4846
Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
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公开(公告)号：US11688677B2
公开(公告)日：2023-06-27
申请号：US17303030
申请日：2021-05-18
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Jorge E. Carbo, Jr. , Trevor Antonio Rivera , Charles J. Kinzel , Michael Adventure Hopkins , Sai Srinivas Desabathina
CPC classification number: H01L23/49833 , H01L21/485 , H01L21/486 , H01L21/4857 , H01L21/56 , H01L23/3157 , H01L23/4985 , H01L23/49822 , H01L23/49838
Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
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公开(公告)号：US20220071014A1
公开(公告)日：2022-03-03
申请号：US17446598
申请日：2021-08-31
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Katherine M. Nelson , Charles J. Kinzel
Abstract: A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.
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公开(公告)号：US20210280482A1
公开(公告)日：2021-09-09
申请号：US17192725
申请日：2021-03-04
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Jorge E. Carbo, JR.
IPC: H01L23/31 , H01B1/16 , H05K1/09 , H01L23/498 , H05K3/40
Abstract: A circuit assembly may include a first layer arranged as a substrate, a second layer having a spiral pattern attached to the substrate, wherein the spiral pattern contains a deformable conductor. A circuit assembly may include a first portion of a deformable inductor fabricated on a first layer of the circuit assembly; and a second portion of the deformable inductor fabricated on a second layer of the circuit assembly and electrically connected to the first portion of the deformable inductor. A method may include sensing an interaction with a deformable inductor, wherein the deformable inductor may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor. An article of manufacture may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor.
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Patent Agency Ranking
公开(公告)号：US20240266275A1
公开(公告)日：2024-08-08
申请号：US18440381
申请日：2024-02-13
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Edward Martin Godshalk , Charles J. Kinzel
IPC: H01L23/498 , H01L21/48 , H01L23/31
CPC classification number: H01L23/49838 , H01L23/3121 , H01L23/4985 , H01L23/49861 , H01L21/4846
Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
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公开(公告)号：US20240047334A1
公开(公告)日：2024-02-08
申请号：US18316586
申请日：2023-05-12
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Jorge E. Carbo, JR. , Trevor Antonio Rivera , Charles J. Kinzel , Michael Adventure Hopkins , Sai Srinivas Desabathina
IPC: H01L23/498 , H01L21/48 , H01L21/56 , H01L23/31
CPC classification number: H01L23/49833 , H01L23/4985 , H01L23/49822 , H01L23/49838 , H01L21/486 , H01L21/56 , H01L21/485 , H01L21/4857 , H01L23/3157
Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
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公开(公告)号：US11882653B2
公开(公告)日：2024-01-23
申请号：US17663764
申请日：2022-05-17
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Jorge E. Carbo, Jr. , Trevor Antonio Rivera , Charles J. Kinzel , Michael Adventure Hopkins , Sai Srinivas Desabathina
Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
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公开(公告)号：US20230290717A1
公开(公告)日：2023-09-14
申请号：US18114420
申请日：2023-02-27
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Trevor Antonio Rivera , Michael Adventure Hopkins , Edward Martin Godshalk , Charles J. Kinzel
IPC: H01L23/498 , H01L23/31
CPC classification number: H01L23/49838 , H01L23/3121 , H01L23/4985 , H01L23/49861 , H01L21/4846
Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
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公开(公告)号：US11682615B2
公开(公告)日：2023-06-20
申请号：US16885854
申请日：2020-05-28
Applicant: Liquid Wire Inc.
Inventor： Mark William Ronay , Jorge E. Carbo, Jr. , Trevor Antonio Rivera , Charles J. Kinzel , Michael Adventure Hopkins , Sai Srinivas Desabathina
CPC classification number: H01L23/49833 , H01L21/485 , H01L21/486 , H01L21/4857 , H01L21/56 , H01L23/3157 , H01L23/4985 , H01L23/49822 , H01L23/49838
Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
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