公开(公告)号：US5857257A

公开(公告)日：1999-01-12

申请号：US858461

申请日：1997-05-19

Applicant: Masaichi Inaba

Inventor： Masaichi Inaba

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H05K3/44

CPC classification number: G11B5/486 ,  H05K3/44 ,  H05K1/056 ,  H05K2201/0919 ,  H05K2203/054 ,  H05K2203/0554 ,  H05K3/0041 ,  H05K3/28 ,  Y10T29/49027

Abstract: A method of manufacturing a magnetic head suspension having a circuit wiring pattern member such that a circuit wiring pattern is formed integral with a suspension via a flexible insulating base member, comprising the steps of: preparing a laminated plate composed of a flexible insulating base member (2), a conductive layer (6 or 3) formed on one surface thereof, and an elastic metal layer (5 or 1) formed on the other surface thereof; forming a desired circuit wiring pattern (3) in the conductive layer (6) of the laminated plate and an elastic suspension (1) in the elastic metal layer (5) thereof simultaneously, in accordance with photo-fabrication method including both-side simultaneous exposure method; forming a bonding metal layer (10) on the circuit wiring pattern (3) by plating; forming a cover coat layer (11) so as to cover the bonding metal layer; further forming a metal mask (13 or 13A) by forming a surface metal layer (12) on the cover coat layer and by etching the surface metal layer (12) or else by forming a mask (14) on the cover coat layer (11) by thin film forming method; removing the cover coat layer (11) and the flexible insulating base member (2) by etching using the metal mask (13 or 13A); removing the metal mask by etching; and bending the elastic metal layer to a desired shape to form the magnetic head suspension.

Abstract translation: 一种制造具有电路布线图案构件的磁头悬架的方法，使得电路布线图案通过柔性绝缘基底构件与悬架形成一体，包括以下步骤：制备由柔性绝缘基底构件 2），在其一个表面上形成的导电层（6或3）和形成在其另一个表面上的弹性金属层（5或1）; 在层叠板的导电层（6）中形成期望的电路布线图案（3）和弹性金属层（5）中的弹性悬浮液（1），同时根据包括两面同时的光制造方法 曝光方法 通过电镀在所述电路布线图案（3）上形成接合金属层（10）; 形成覆盖层（11）以覆盖所述接合金属层; 通过在覆盖层上形成表面金属层（12）并且通过蚀刻表面金属层（12）或者通过在覆盖层（11）上形成掩模（14）来进一步形成金属掩模（13或13A） ）通过薄膜形成方法; 通过使用金属掩模（13或13A）的蚀刻去除覆盖层（11）和柔性绝缘基底构件（2）; 通过蚀刻去除金属掩模; 并将弹性金属层弯曲成所需的形状以形成磁头悬挂液。

公开(公告)号：US5666717A

公开(公告)日：1997-09-16

申请号：US465756

申请日：1995-06-06

Applicant: Hirofumi Matsumoto ,  Mitsunobu Shoumura ,  Norimasa Fujita ,  Masaichi Inaba ,  Yasuyuki Tanaka

Inventor： Hirofumi Matsumoto ,  Mitsunobu Shoumura ,  Norimasa Fujita ,  Masaichi Inaba ,  Yasuyuki Tanaka

IPC: G11B5/60 ,  G11B5/31 ,  G11B5/48 ,  G11B21/21 ,  G11B5/127

CPC classification number: G11B5/3103 ,  G11B5/484 ,  Y10T29/49041 ,  Y10T29/4906

Abstract: A method of manufacturing a magnetic head suspension assembly, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension which includes the steps of (1) forming a flexible insulating base material on one surface of a springy metal layer by using a non-photosensitive polyimide resin layer or a photosensitive insulating resin layer; (2) producing a circuit wiring pattern on the top of the flexible insulating base material by plating and by using an electrically conductive metal thin film; (3) for forming a surface protecting layer on the surface of the circuit wiring pattern; (4) the springy metal layer; and (5) bending the springy metal layer to form a desired suspension.

Abstract translation: 一种制造磁头悬挂组件的方法，其中用于将磁头元件与读/写放大器电路板连接的布线构件与悬架一体地形成，该悬架包括以下步骤：（1）在一个上形成柔性绝缘基底材料 通过使用非感光性聚酰亚胺树脂层或感光性绝缘树脂层的弹性金属层的表面; （2）通过电镀和使用导电金属薄膜在柔性绝缘基材的顶部上产生电路布线图案; （3），用于在电路布线图案的表面上形成表面保护层; （4）弹性金属层; 和（5）弯曲弹性金属层以形成所需的悬浮液。

公开(公告)号：US5408052A

公开(公告)日：1995-04-18

申请号：US117150

申请日：1993-09-13

Applicant: Masaichi Inaba ,  Atsushi Miyagawa ,  Takeshi Iwayama

Inventor： Masaichi Inaba ,  Atsushi Miyagawa ,  Takeshi Iwayama

IPC: H01L21/60 ,  H01L23/14 ,  H01L23/495 ,  H01L23/50 ,  H01L23/538 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46 ,  H05R1/02

CPC classification number: H05K3/4092 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0391 ,  H05K2201/09754 ,  H05K3/281

Abstract: A flexible multi-layer circuit wiring board which is capable of constituting finger lead-like terminals that are little liable to be deformed even when the circuit conductors protruding like finger leads are finely formed and is capable of maintaining good flexibility at a bent portion. Circuit conductors 2 composed of an electrically conducting metal having a large Young's modulus are disposed at the ends of one surface of a flexible insulating base member 1 to form finger lead-like terminals 3, required circuit wiring conductors 4 composed of an electrically conducting metal rich in flexibility are disposed on the other surface of the flexible insulating base member 1 inclusive of a bent portion A of the circuit wiring board, and through-hole connection portions 5 are formed to electrically connect required portions of the circuit conductors 2 and the circuit wiring conductors 4.

Abstract translation: PCT No.PCT / JP93 / 00029 Sec。 371日期1993年9月13日 102（e）1993年9月13日PCT 1993年1月12日PCT PCT。 第WO93 / 15520BC号公报 日期：1993年8月5日。一种柔性多层电路布线板，其能够构成指状引线状端子，即使在电线导体如指状突起突出的情况下也很难变形，并且能够保持良好 弯曲部分的柔韧性。 具有大杨氏模量的导电金属构成的电路导体2设置在柔性绝缘基底构件1的一个表面的端部，以形成指状引线端子3，所需的电路布线导体4由导电金属富集 在柔性绝缘基底构件1的另一个表面（包括电路布线板的弯曲部分A）上设置柔性，并且形成通孔连接部分5以将电路导体2的所需部分和电路布线 导体4。

公开(公告)号：US4471176A

公开(公告)日：1984-09-11

申请号：US489774

申请日：1983-04-29

Applicant: Masaichi Inaba

Inventor： Masaichi Inaba

IPC: G06F3/02 ,  H01H13/702 ,  H01H13/70

CPC classification number: H01H13/702 ,  H01H2209/006 ,  H01H2215/008 ,  H01H2215/02

Abstract: A snap action keyboard switch mechanism is presented wherein protrusions located on the switch sheet between adjoining snap action elements act to support the switch sheet and avoid inadvertent input. If a key is actuated off center, the support protrusions will prevent erroneous actuation of an adjoining key. The protrusion height varies depending upon the desired optimum tactility.

Abstract translation: 提出了一种快速动作键盘切换机构，其中位于相邻快动元件之间的开关片上的突起用于支撑开关片并避免无意的输入。 如果钥匙从中心驱动，则支撑突起将防止相邻钥匙的错误致动。 突起高度根据所需的最佳触感而变化。

公开(公告)号：US5914179A

公开(公告)日：1999-06-22

申请号：US994858

申请日：1997-12-19

Applicant: Masaichi Inaba

Inventor： Masaichi Inaba

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/20 ,  H05K3/24 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  B44C1/22

CPC classification number: H05K1/118 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K1/0393 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0376 ,  H05K2203/1572 ,  H05K3/20 ,  H05K3/423 ,  Y10T428/24917

Abstract: A desired circuit wiring pattern is formed by plating a conductive layer having excellent resistance at least to an etching solution on a metal layer which is removed in the post-process by etching. A surface protective layer having a hole for exposing part of the circuit wiring pattern is formed on both sides of the circuit wiring pattern at a predetermined position as an external connection terminal portion. The circuit wiring pattern can be formed in multiple layers by coating the conductive layer with a circuit wiring layer of another conductive material and a bump is formed to fill the hole as required.

Abstract translation: 通过在蚀刻后处理中除去的金属层上至少对蚀刻溶液镀上具有优异电阻的导电层来形成所需的电路布线图案。 在作为外部连接端子部的预定位置处，在电路布线图案的两侧形成有用于露出电路布线图案的一部分的孔的表面保护层。 电路布线图案可以通过用另一种导电材料的电路布线层涂覆导电层而形成多层，并且形成凸块以根据需要填充孔。

公开(公告)号：US5809634A

公开(公告)日：1998-09-22

申请号：US848831

申请日：1997-05-05

Applicant: Masaichi Inaba

Inventor： Masaichi Inaba

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/02 ,  G11B21/21 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H05K3/44 ,  G11B5/42

CPC classification number: G11B5/4853 ,  G11B5/48 ,  H05K3/44 ,  H05K1/056 ,  H05K2201/0919 ,  H05K2203/0554 ,  H05K2203/1476 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/0041 ,  H05K3/28 ,  Y10T29/49027

Abstract: A method of manufacturing a magnetic head suspension having a circuit wiring pattern member, comprises the steps of: preparing a laminated plate composed of a flat flexible insulating base member (2), a conductive layer (9 or 3) formed on one surface thereof, and an elastic metal layer (8 or 1) formed on the other surface thereof; photo-etching the conductive layer of the laminated plate, to form a metal mask (9) of a desired flexible insulating base member shape; removing the exposed flexible insulating base member (2) to such a thickness that the elastic metal layer (8 or 1) is at least not exposed; photo-etching the formed metal mask (9), to form a desired circuit wiring pattern (3); further etching the flexible insulating base member (2), to remove a part of the flexible insulating base member (2) still remaining on the surface of the elastic metal layer (8 or 1) in the preceding step, by using the formed circuit wiring pattern (3) as a mask; forming a surface protecting layer (4) on the surface of the formed circuit wiring pattern (3) and photo-etching the elastic metal layer (8) and bending the photo-etched elastic metal layer (8) to a desired shape, to form a suspension (1) of a desired shape.

Abstract translation: 一种制造具有电路布线图案构件的磁头悬架的方法，包括以下步骤：制备由平面柔性绝缘基底构件（2），形成在其一个表面上的导电层（9或3）构成的层压板， 和形成在其另一个表面上的弹性金属层（8或1）; 对层压板的导电层进行光蚀刻，以形成所需柔性绝缘基底构件形状的金属掩模（9）; 将暴露的柔性绝缘基底构件（2）去除至使弹性金属层（8或1）至少不暴露的厚度; 对所形成的金属掩模（9）进行光蚀刻以形成期望的电路布线图案（3）; 进一步蚀刻柔性绝缘基底构件（2），以通过使用所形成的电路布线来去除在前一步骤中仍保留在弹性金属层（8或1）的表面上的柔性绝缘基底构件（2）的一部分 图案（3）作为掩模; 在所形成的电路布线图案（3）的表面上形成表面保护层（4），并且对所述弹性金属层（8）进行光蚀刻并将所述光蚀刻的弹性金属层（8）弯曲成所需的形状，以形成 具有所需形状的悬架（1）。

公开(公告)号：US5444188A

公开(公告)日：1995-08-22

申请号：US117010

申请日：1993-09-08

Applicant: Takeshi Iwayama ,  Atsushi Miyagawa ,  Masaichi Inaba

Inventor： Takeshi Iwayama ,  Atsushi Miyagawa ,  Masaichi Inaba

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/495 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01L24/86 ,  H01L23/5387 ,  H05K3/4092 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K3/281 ,  Y10T29/49155

Abstract: A flexible circuit wiring board having protruding, closely spaced leads, which are intended to be attached to a circuit device, is fabricated by forming a conductor pattern on a first surface of an insulating substrate, adhereing a protection layer to the conductor pattern and employing a laser to selectively etch away the substrate. The etching process leaves a reinforcing coating of the protective layer on the leads at least in the portions thereof which lie at the boundary of the area from which the substrate has been removed.

Abstract translation: PCT No.PCT / JP93 / 00028 Sec。 371日期：1993年9月8日 102（e）1993年9月8日PCT 1993年1月12日PCT PCT。 公开号WO93 / 14516 PCT 日期：1993年7月22日。通过在绝缘基板的第一表面上形成导体图案来制造具有突出的紧密排列的引线，用于附接到电路器件的柔性电路布线板， 并且使用激光来选择性地蚀刻掉衬底。 蚀刻工艺至少在其位于已经从基板去除的区域的边界的部分中在引线上留下保护层的增强涂层。

公开(公告)号：US5369881A

公开(公告)日：1994-12-06

申请号：US124268

申请日：1993-09-20

Applicant: Masaichi Inaba ,  Norimasa Fujita

Inventor： Masaichi Inaba ,  Norimasa Fujita

IPC: H05K3/02 ,  H05K3/00 ,  H05K3/04 ,  H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/22 ,  H05K3/24 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/045 ,  H05K3/108 ,  H05K3/205 ,  H05K3/28 ,  H05K2201/0347 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09881 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0376 ,  H05K2203/0554 ,  H05K2203/0726 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/064 ,  H05K3/107 ,  H05K3/388 ,  Y10T29/49155

Abstract: This invention provides a method of forming a circuit wiring pattern which cannot be formed by a prior art method such as etching or plating. This method comprises a step of forming trenches for forming a circuit wiring pattern at predetermined positions on at least one of the surface of an insulating base material and then filling a conductive material into the trenches, a step of removing conductor layers in such a manner that the conductor layers formed by the step described above exist only in the trenches formed in the insulating base material and gap portions of the circuit wiring pattern comprising the conductor layers formed in the trenches of the insulating base material are exposed, and a step of forming an insulating surface protection layer.

Abstract translation: 本发明提供一种形成电路布线图案的方法，该方法不能用诸如蚀刻或电镀的现有技术方法形成。 该方法包括以下步骤：在绝缘基材的至少一个表面上的预定位置处形成用于形成电路布线图案的沟槽，然后将导电材料填充到沟槽中，以如下方式除去导体层的步骤： 由上述步骤形成的导体层仅存在于形成在绝缘基材中的沟槽中，并且包含形成在绝缘基材的沟槽中的导体层的电路布线图案的间隙部分露出， 绝缘表面保护层。