公开(公告)号：US09258903B2

公开(公告)日：2016-02-09

申请号：US13381198

申请日：2010-09-29

Applicant: Masaichi Inaba ,  Masayuki Iwase

Inventor： Masaichi Inaba ,  Masayuki Iwase

IPC: H05K1/11 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K3/244 ,  H01L2224/8384 ,  H01L2924/01079 ,  H05K3/3452 ,  H05K2201/099 ,  Y10T29/49155

Abstract: It is an object to form a conductive intermediate layer having a function of maximally preventing a solder leaching phenomenon with a low environment load and with good productivity.There are provided an insulative base material 2, a wiring circuit pattern 3 formed on at least one surface of the insulative base material 2, an electronic part mounting land 31 which is formed as part of the wiring circuit pattern 3 and on which an electronic part 7 is to be mounted, and a conductive intermediate layer 5 made of a sintered conductive ink film on the electronic part mounting land 31.

Abstract translation: 本发明的目的是形成具有在环境负荷低且生产率高的情况下最大限度地防止焊料浸出现象的导电中间层。 设置绝缘基材2，形成在绝缘基材2的至少一个表面上的布线电路图案3，形成为布线电路图案3的一部分的电子部件安装台面31，电子部件 在电子部件安装台面31上安装由烧结导电油墨膜构成的导电中间层5。

公开(公告)号：US5759417A

公开(公告)日：1998-06-02

申请号：US724080

申请日：1996-09-30

Applicant: Masaichi Inaba

Inventor： Masaichi Inaba

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/20 ,  H05K3/24 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H01B13/22

CPC classification number: H05K1/118 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K1/0393 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0376 ,  H05K2203/1572 ,  H05K3/20 ,  H05K3/423 ,  Y10T428/24917

Abstract: A desired circuit wiring pattern is formed by forming by plating means a conductive layer having excellent resistance at least to an etching solution on a metal layer which is removed in the post-process by etching means using a resist layer. A surface protective layer having a hole for exposing part of the circuit wiring pattern is formed on both sides of the circuit wiring pattern at a predetermined position as an external connection terminal portion. The circuit wiring pattern can be formed in multiple layers by coating the conductive layer with a circuit wiring layer of another conductive material and a bump is formed to fill the hole as required.

Abstract translation: 通过电镀装置形成至少对金属层上的蚀刻溶液具有优异电阻的导电层，形成期望的电路布线图案，该金属层在后处理中通过使用抗蚀剂层的蚀刻装置除去。 在作为外部连接端子部的预定位置处，在电路布线图案的两侧形成有用于露出电路布线图案的一部分的孔的表面保护层。 电路布线图案可以通过用另一种导电材料的电路布线层涂覆导电层而形成多层，并且形成凸块以根据需要填充孔。

公开(公告)号：US20120103678A1

公开(公告)日：2012-05-03

申请号：US13381198

申请日：2010-09-29

Applicant: Masaichi Inaba ,  Masayuki Iwase

Inventor： Masaichi Inaba ,  Masayuki Iwase

IPC: H05K1/11 ,  H05K3/12

CPC classification number: H05K3/244 ,  H01L2224/8384 ,  H01L2924/01079 ,  H05K3/3452 ,  H05K2201/099 ,  Y10T29/49155

Abstract: It is an object to form a conductive intermediate layer having a function of maximally preventing a solder leaching phenomenon with a low environment load and with good productivity.There are provided an insulative base material 2, a wiring circuit pattern 3 formed on at least one surface of the insulative base material 2, an electronic part mounting land 31 which is formed as part of the wiring circuit pattern 3 and on which an electronic part 7 is to be mounted, and a conductive intermediate layer 5 made of a sintered conductive ink film on the electronic part mounting land 31.

Abstract translation: 本发明的目的是形成具有在环境负荷低且生产率高的情况下最大限度地防止焊料浸出现象的导电中间层。 设置绝缘基材2，形成在绝缘基材2的至少一个表面上的布线电路图案3，形成为布线电路图案3的一部分的电子部件安装台面31，电子部件 在电子部件安装台面31上安装由烧结导电油墨膜构成的导电中间层5。

公开(公告)号：US5737837A

公开(公告)日：1998-04-14

申请号：US631464

申请日：1996-04-12

Applicant: Masaichi Inaba

Inventor： Masaichi Inaba

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/16 ,  G11B21/21 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H01R43/16 ,  G11B5/127 ,  H05K1/18

CPC classification number: G11B5/4846 ,  G11B5/4853 ,  H05K1/118 ,  H05K3/365 ,  H05K3/4007 ,  H05K1/05 ,  H05K1/056 ,  H05K2201/0311 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/052 ,  H05K2203/302 ,  H05K3/0058 ,  H05K3/28 ,  H05K3/325 ,  H05K3/361 ,  Y10S29/012 ,  Y10T29/49027 ,  Y10T29/49032 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/49222 ,  Y10T29/5193

Abstract: A method of manufacturing a magnetic head junction board wherein a laminated plate having a springy metal layer and a conductive layer is prepared. A circuit wiring pattern is formed on the conductive layer by photoetching and the springy metal layer is formed into a predetermined shape by etching. The circuit wiring pattern is provided with a surface protecting layer which leaves holes exposed at the ends of the circuit wiring pattern. Then, the holes are filled with conductive metal to form bump-shaped terminals such that the ends on one side jut out of the surface protecting layer. Lastly, the springy metal layer is bent into a predetermined shape so that the bump-shaped terminals face against each other. Alternative process are also disclosed.

Abstract translation: 一种制造磁头接合板的方法，其中制备了具有弹性金属层和导电层的层压板。 通过光刻在导电层上形成电路布线图案，并且通过蚀刻将弹性金属层形成为预定的形状。 电路布线图案设置有表面保护层，其留下在电路布线图案的端部露出的孔。 然后，用导电金属填充孔，以形成凸起状端子，使得一侧的端部突出出表面保护层。 最后，弹性金属层弯曲成预定的形状，使得凸起状端子彼此面对。 还公开了替代方法。

公开(公告)号：US5446245A

公开(公告)日：1995-08-29

申请号：US251388

申请日：1994-05-31

Applicant: Takeshi Iwayama ,  Atsushi Miyagawa ,  Masaichi Inaba

Inventor： Takeshi Iwayama ,  Atsushi Miyagawa ,  Masaichi Inaba

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/495 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02

CPC classification number: H01L24/86 ,  H01L23/5387 ,  H05K3/4092 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K3/281 ,  Y10T29/49155

Abstract: A flexible circuit wiring board having protruding, closely spaced leads, which are intended to be attached to a circuit device, is fabricated by forming a conductor pattern on a first surface of an insulating substrate, adhereing a protection layer to the conductor pattern and employing a laser to selectively etch away the substrate. The etching process leaves a reinforcing coating of the protective layer on the leads at least in the portions thereof which lie at the boundary of the area from which the substrate has been removed.

Abstract translation: 通过在绝缘基板的第一表面上形成导体图案，将保护层粘合到导体图案上并采用一种导电图案来制造具有用于附接到电路装置的具有突出的紧密间隔的引线的柔性电路布线板 激光器选择性地蚀刻掉衬底。 蚀刻工艺至少在其位于已经从基板去除的区域的边界的部分中在引线上留下保护层的增强涂层。

公开(公告)号：US5854724A

公开(公告)日：1998-12-29

申请号：US693463

申请日：1996-08-02

Applicant: Masaichi Inaba ,  Hirofumi Matsumoto ,  Yasuyuki Tanaka

Inventor： Masaichi Inaba ,  Hirofumi Matsumoto ,  Yasuyuki Tanaka

IPC: G11B5/49 ,  G11B5/48 ,  G11B5/60 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H05K3/44

CPC classification number: G11B5/486 ,  H05K3/28 ,  H05K3/44 ,  H05K1/056 ,  H05K2201/0187 ,  H05K2201/0919 ,  H05K2203/0554 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/0041 ,  Y10T29/49615

Abstract: A magnetic head suspension assembly, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension for supporting the magnetic head element. The suspension is equipped integrally with a circuit wiring pattern via a flexible insulating base material. The flexible insulating base material is made as wide as the circuit wiring pattern. The top surface of the circuit wiring pattern has a surface protecting layer which is wider than the circuit wiring pattern.

Abstract translation: 一种磁头悬挂组件，其中用于将磁头元件与读/写放大器电路板连接的布线构件与用于支撑磁头元件的悬架一体地形成。 悬架通过柔性绝缘基材与电路布线图形整体配合。 柔性绝缘基材制成与电路布线图形一样宽。 电路布线图案的顶表面具有比电路布线图形更宽的表面保护层。

公开(公告)号：US5844753A

公开(公告)日：1998-12-01

申请号：US878052

申请日：1997-06-18

Applicant: Masaichi Inaba

Inventor： Masaichi Inaba

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/16 ,  G11B21/21 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  G11B5/54

CPC classification number: G11B5/4846 ,  G11B5/4853 ,  H05K1/118 ,  H05K3/365 ,  H05K3/4007 ,  H05K1/05 ,  H05K1/056 ,  H05K2201/0311 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/052 ,  H05K2203/302 ,  H05K3/0058 ,  H05K3/28 ,  H05K3/325 ,  H05K3/361 ,  Y10S29/012 ,  Y10T29/49027 ,  Y10T29/49032 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/49222 ,  Y10T29/5193

Abstract: A flexible circuit board, an end of which is uniformly connected to the inside of a springy metal layer, which has been bent to a U shape, and the rest of which extends in a predetermined width away from the springy metal layer. The flexible circuit board is equipped with bump-shaped connecting terminals on the opposed bent sections, each connecting terminal having a first side connected to the ends of the circuit wiring pattern formed on the flexible circuit board and a second generally opposed side projecting outwardly from the flexible circuit board. The bump-shaped terminals are electrically connected to the terminal of the magnetic head suspension, which is made integral with circuit wiring, by the clamping force of the springy metal layer.

Abstract translation: 柔性电路板，其端部均匀地连接到已经弯曲成U形的弹性金属层的内部，其余部分以预定的宽度延伸离开弹性金属层。 柔性电路板在相对的弯曲部分上装有凸起形的连接端子，每个连接端子具有连接到形成在柔性电路板上的电路布线图案的端部的第一侧和从该柔性电路板向外突出的第二大致相对的侧面 柔性电路板。 凸起状端子通过弹性金属层的夹持力电连接到与电路布线成一体的磁头悬架的端子。

公开(公告)号：US5771569A

公开(公告)日：1998-06-30

申请号：US777355

申请日：1996-12-27

Applicant: Masaichi Inaba

Inventor： Masaichi Inaba

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/02 ,  G11B21/21 ,  H05K1/05 ,  H05K3/00 ,  H05K3/24 ,  H05K3/28 ,  H05K3/44 ,  G11B5/42

CPC classification number: G11B5/4853 ,  H05K3/44 ,  H05K1/056 ,  H05K2201/0187 ,  H05K2201/0919 ,  H05K2203/0554 ,  H05K3/0041 ,  H05K3/244 ,  H05K3/28 ,  Y10T29/49021 ,  Y10T29/49027

Abstract: A magnetic head suspension, wherein the interconnection wiring is integrated with a spring-like metal suspension member, is manufactured by first preparing a laminated plate comprised of a flexible insulating base sandwiched between a resilient metal layer and a layer of an electrical conductor. The electrical conductor layer and resilient metal layer are respectively formed into the desired circuit wiring pattern and a suspension member, unnecessary portions of the insulating base are removed, the wiring pattern is provided with a protective layer and the suspension member is mechanically formed into a desired final configuration.

Abstract translation: 通过首先制备由夹在弹性金属层和电导体层之间的柔性绝缘基底构成的层压板，制造互连配线与弹簧状金属悬挂构件一体化的磁头悬架。 电导体层和弹性金属层分别形成为期望的电路布线图案和悬挂构件，绝缘基底的不需要部分被去除，布线图案设置有保护层，并且悬挂构件机械地形成为期望的 最终配置。

公开(公告)号：US4508942A

公开(公告)日：1985-04-02

申请号：US555819

申请日：1983-11-28

Applicant: Masaichi Inaba

Inventor： Masaichi Inaba

IPC: H01H13/702 ,  H01H13/712 ,  H01H13/76

CPC classification number: H01H13/702 ,  H01H2213/002 ,  H01H2215/008

Abstract: A membrane keyboard with a circuit means having a plurality of snap action domes formed therein has a cover sheet thereon. A plurality of cavities formed between the cover sheet and the domed circuit layer has air passages connecting each cavity with the ambient environment. The structure of the present invention permits lower tensile force during actuation and results in improved snap action and tactile feel.

Abstract translation: 具有形成在其中的多个快动动圆顶的电路装置的薄膜键盘上具有盖板。 形成在覆盖片和圆顶电路层之间的多个空腔具有将每个空腔与周围环境连接的空气通道。 本发明的结构在致动期间允许较低的拉力，并且导致改进的快动和触感。

公开(公告)号：US5961334A

公开(公告)日：1999-10-05

申请号：US968529

申请日：1997-11-12

Applicant: Masaichi Inaba

Inventor： Masaichi Inaba

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H01R12/55 ,  H05K3/36 ,  H01R9/09

CPC classification number: G11B5/4846 ,  H01R12/61 ,  H01R12/62 ,  H05K3/365

Abstract: A connection structure of a suspension for a magnetic head suitable for assembly automation is provided. The connection structure of a suspension for a magnetic head comprises a suspension (1) for a magnetic head which includes a circuit wiring pattern (4) for connecting to the terminal side of a magnetic head and is clasped by and supported between an actuator arm (9) and a base plate (10), a relay board (7) for connecting the circuit wiring pattern to a read/write amplifier-board, and a connecting portion consisting of a pair of terminals (6) and (8) provided at portions of the suspension for a magnetic head and the relay board which are clasped by the actuator arm and the base plate, and wherein the connecting portion is formed by positioning the pair of terminals opposite one another and bringing them into mutual contact.

Abstract translation: 提供了一种用于适于组装自动化的磁头的悬架的连接结构。 用于磁头的悬架的连接结构包括用于磁头的悬架（1），其包括用于连接到磁头的端子侧的电路布线图案（4），并被紧固并支撑在致动臂（ 9）和基板（10），用于将电路布线图案连接到读/写放大器板的中继板（7），以及由设置在该板上的一对端子（6）和（8）组成的连接部分 由致动器臂和基板夹紧的用于磁头和继电器板的悬架的部分，并且其中通过将一对端子相对定位并使它们相互接触而形成连接部分。