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    Quad flat pack integrated circuit package
    11.
    发明授权
    Quad flat pack integrated circuit package 有权
    四路扁平封装集成电路封装

    公开(公告)号：US5978224A

    公开(公告)日：1999-11-02

    申请号：US179125

    申请日：1998-10-26

    Applicant: Michael Barrow

    Inventor： Michael Barrow

    IPC: H01L23/495 ,  H01L25/10 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20

    CPC classification number: H05K1/181 ,  H01L23/49568 ,  H01L25/105 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10689 ,  Y02P70/611

    Abstract: A quad flat pack (QFP) integrated circuit package that is modified to include a tab that increases the thermal efficiency of the package. The package contains an integrated circuit that is mounted to a die paddle of a lead frame. A plurality of leads extend from a first side of the die paddle. Placing all of the leads on one side of the package minimizes the difference in signal length between the leads. The tab extends from a second side of the die paddle. Both the leads and the tab extend from a plastic housing which encapsulates the integrated circuit. The tab provides a large conductive area which increases the heat transfer rate from the integrated circuit to the ambient, or an external thermal element. The package may have a thermal element such as a clip or cover that is coupled to the tabs of adjacent integrated circuit packages.

    Abstract translation: 一种四平面封装（QFP）集成电路封装，经修改，包括一个提升封装热效率的接头。 该封装包含一个集成电路，该电路安装在引线框架的裸片上。 多个引线从芯片的第一侧延伸。 将封装的一侧放置所有引线可以最大限度地减少引线之间信号长度的差异。 突片从模片桨的第二侧延伸。 引线和突片均从封装集成电路的塑料外壳延伸。 该突片提供了大的导电区域，其增加了从集成电路到环境的热传递速率或外部热元件。 封装可以具有耦合到相邻集成电路封装的突片的热元件，例如夹子或盖。

    Thermal spreading enhancements for motherboards using PBGAs
    15.
    发明授权
    Thermal spreading enhancements for motherboards using PBGAs 失效
    使用PBGA的主板的热扩散增强

    公开(公告)号：US06521845B1

    公开(公告)日：2003-02-18

    申请号：US08873973

    申请日：1997-06-12

    Applicant: Michael Barrow

    Inventor： Michael Barrow

    IPC: H05K116

    CPC classification number: H05K1/0207 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/112 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2201/10969 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: A thermally efficient printed circuit board for a ball grid array (BGA) integrated circuit package. The printed circuit board includes a first outer conductive plane located on a top surface of a substrate. A portion of the first outer conductive plane is covered with a solder mask. The solder mask has an opening that exposes a portion of the first outer conductive plane. A solder ball of the BGA package is attached to the exposed portion of the conductive plane to mount the package to the printed circuit board. The outer conductive plane has a wide area that provides a relatively efficient thermal path to conduct heat that flows through the solder ball from the integrated circuit package. Additionally, the outer conductive plane is coupled to internal conductive planes by a plurality of vias. The internal conductive planes further dissipate the heat which flows from the package into the printed circuit board.

    Abstract translation: 一种用于球栅阵列（BGA）集成电路封装的热效率印刷电路板。 印刷电路板包括位于基板的顶表面上的第一外导电平面。 第一外导电平面的一部分用焊接掩模覆盖。 焊接掩模具有暴露第一外部导电平面的一部分的开口。 BGA封装的焊球附着到导电平面的暴露部分，以将封装安装到印刷电路板上。 外部导电平面具有广泛的面积，其提供相对有效的热路径以传导从集成电路封装件流过焊球的热量。 此外，外部导电平面通过多个通孔耦合到内部导电平面。 内部导电平面进一步消散从封装流入印刷电路板的热量。

    Corner heat sink which encloses an integrated circuit of a ball grid array integrated circuit package
    16.
    发明授权
    Corner heat sink which encloses an integrated circuit of a ball grid array integrated circuit package 失效
    封闭集成电路的球形阵列集成电路封装的散热片

    公开(公告)号：US5917702A

    公开(公告)日：1999-06-29

    申请号：US978915

    申请日：1997-11-26

    Applicant: Michael Barrow

    Inventor： Michael Barrow

    IPC: H01L23/367 ,  H05K7/20

    CPC classification number: H01L23/3672 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/3011

    Abstract: An integrated circuit package. The package includes a substrate which has a first surface, a second opposite surface and a plurality of corners. A plurality of solder balls may be soldered to the second surface of the substrate. The solder balls can be reflowed to a printed circuit board. An integrated circuit is mounted to the first surface of the substrate. Each corner has a conductive plane located on the first surface of the substrate. The package includes a metal lid that is thermally coupled to the integrated circuit and attached to the conductive plane at the corner of the substrate. The lid encloses the integrated circuit and provides a thermal path from the integrated circuit to the conductive planes at the corners of the substrate. The thermal path allows heat generated by the integrated circuit to flow through the lid and into the printed circuit board.

    Abstract translation: 集成电路封装。 该包装包括具有第一表面，第二相对表面和多个拐角的基底。 可以将多个焊球焊接到衬底的第二表面。 焊球可以回流到印刷电路板。 集成电路安装到基板的第一表面。 每个角部具有位于基板的第一表面上的导电平面。 该封装包括金属盖，该金属盖热耦合到集成电路并且附接到基板拐角处的导电平面。 盖子封装集成电路，并提供从集成电路到基板拐角处的导电平面的热路径。 热路径允许集成电路产生的热量流过盖子并进入印刷电路板。

    Custom corner attach heat sink design for a plastic ball grid array integrated circuit package
    17.
    发明授权
    Custom corner attach heat sink design for a plastic ball grid array integrated circuit package 失效
    定制角落安装散热器设计用于塑料球栅阵列集成电路封装

    公开(公告)号：US5898219A

    公开(公告)日：1999-04-27

    申请号：US832417

    申请日：1997-04-02

    Applicant: Michael Barrow

    Inventor： Michael Barrow

    IPC: H01L23/367 ,  H01L23/34 ,  H01L23/10 ,  H01L23/48

    CPC classification number: H01L23/3672 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011

    Abstract: An integrated circuit package. The package includes a substrate which has a first surface, a second opposite surface and four corners. Each corner has a conductive plane and at least one via. The vias connect the conductive planes of the first surface with corresponding conductive planes located on the second surface of the substrate. An integrated circuit is mounted to the first surface of the substrate and enclosed by plastic. Solder balls are attached to the conductive planes and a number of individual solder pads located on the second surface of the package. The contacts are connected to a printed circuit board. A lid is attached to the conductive planes at the four corners of the substrate. Some of the heat generated by the integrated circuit conducts through the substrate and into the printed circuit board. Some of the heat within the substrate conducts into the lid through the conductive planes located at the corners of the package. The present invention thus provides two thermal paths, the printed circuit board and the lid, from the substrate of a plastic integrated circuit package.

    Abstract translation: 集成电路封装。 该包装包括具有第一表面，第二相对表面和四个角的基底。 每个拐角都有一个导电平面和至少一个通孔。 通孔将第一表面的导电平面与位于基板的第二表面上的相应的导电平面连接。 集成电路安装到基板的第一表面并用塑料封装。 焊球附接到导电平面和位于封装的第二表面上的多个单独焊盘。 触点连接到印刷电路板。 在基板的四个角部处的导电平面上附接有盖。 由集成电路产生的一些热量通过衬底传导到印刷电路板中。 衬底内的一些热量通过位于封装角部的导电平面导入盖子。 因此，本发明从塑料集成电路封装的基板提供两个热路径，印刷电路板和盖。

    Integrated circuit package substrate with stepped solder mask openings
    19.
    发明授权
    Integrated circuit package substrate with stepped solder mask openings 失效
    集成电路封装基板，带有阶梯式焊接口

    公开(公告)号：US5889655A

    公开(公告)日：1999-03-30

    申请号：US978772

    申请日：1997-11-26

    Applicant: Michael Barrow

    Inventor： Michael Barrow

    IPC: H01L23/498 ,  H05K3/34 ,  H05K1/14

    CPC classification number: H01L23/49816 ,  H01L23/49827 ,  H05K3/3452 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2201/09845 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/0577 ,  H05K2203/0594 ,  H05K3/3478

    Abstract: A substrate for an integrated circuit package. Located on a bottom surface of the substrate are a plurality of contact pads. Solder balls are attached to the contact pads and then reflowed to mount the package to a printed circuit board. The bottom surface of the substrate has a first layer of solder mask. The first layer has a plurality of first openings which expose at least a portion of each contact pad. Adjacent to the first layer of solder mask is a second layer of solder mask which has a plurality of second openings that also expose the contact pads. The diameter of each second opening is larger than the diameter of each first opening. The openings may be created by etching the layers of solder mask. The etching process typically creates in annular lips in the solder mask openings. The larger second openings reduce the stress risers of the solder balls created by the inner lips of the solder mask.

    Abstract translation: 一种用于集成电路封装的衬底。 位于基板的底表面上的是多个接触垫。 焊球附接到接触焊盘，然后回流以将封装安装到印刷电路板上。 衬底的底表面具有第一层焊接掩模。 第一层具有暴露每个接触垫的至少一部分的多个第一开口。 与第一层焊料掩模相邻的是第二层焊料掩模，其具有也暴露接触焊盘的多个第二开口。 每个第二开口的直径大于每个第一开口的直径。 可以通过蚀刻焊接掩模层来形成开口。 蚀刻工艺通常在焊接掩模开口中以环形唇形成。 较大的第二开口减小由焊料掩模的内唇产生的焊球的应力上升。

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