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公开(公告)号：US11662263B2
公开(公告)日：2023-05-30
申请号：US17217254
申请日：2021-03-30
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Ulf J. Jonsson
CPC classification number: G01L9/0052 , G01L19/0038 , G01L19/06
Abstract: A pressure sensor includes a housing, an isolator positioned at a first end of the housing, and a first cavity formed between the first end of the housing and the isolator. The pressure sensor further includes a second cavity formed in the housing and a channel with a first end fluidly connected to the first cavity and a second end fluidly coupled to the second cavity. A pressure sensor chip is positioned in the second cavity and includes a first diaphragm positioned at a top side of the pressure sensor chip laterally outwards from the second end of the channel to prevent a fluid from jetting onto the first diaphragm.
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公开(公告)号：US10998113B2
公开(公告)日：2021-05-04
申请号：US16416541
申请日：2019-05-20
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek
IPC: H01C1/16
Abstract: Provided are embodiments for a resistor array. The resistor array includes a plurality of resistor elements, where the plurality of resistor elements includes a redundancy region for a most significant bit of an expected value. The resistor array also includes one or more switches coupled to the plurality of resistor elements, and a first terminal and a second terminal coupled to the plurality of resistor elements. Also provided are embodiments for trimming the resistor array where the resistor array includes a redundancy region for a most significant bit for an expected value.
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公开(公告)号：US20210024350A1
公开(公告)日：2021-01-28
申请号：US16517944
申请日：2019-07-22
Applicant: Rosemount Aerospace Inc.
Inventor： Dosi Dosev , David P. Potasek , Marcus Allen Childress
Abstract: A MEMS device includes a first layer, a second layer connected to the first layer, a first mooring portion, a second mooring portion, and a MEMS device body. The MEMS device body is connected to the first mooring portion and the second mooring portion. The MEMS device body further includes a first cantilever attached to the first mooring portion, a second cantilever attached to the second mooring portion, and a spring. The spring is in operable communication with the first cantilever and the second cantilever.
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公开(公告)号：US20200041371A1
公开(公告)日：2020-02-06
申请号：US16599470
申请日：2019-10-11
Applicant: Rosemount Aerospace Inc.
Inventor： Timothy Thomas Golly , David P. Potasek , Cuong Tho Huynh
Abstract: A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.
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公开(公告)号：US10101234B2
公开(公告)日：2018-10-16
申请号：US15041243
申请日：2016-02-11
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Charles Little , Weibin Zhang
Abstract: A pressure sensor comprising a housing, a diaphragm wafer, and an isolator configured to absorb lateral stress. The diaphragm wafer includes a fully exposed diaphragm, a fluid contact surface, a sensing element, and a support portion, where the support portion and the contact surface define a cavity. The isolator extends laterally from the support portion to the housing. The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.
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Patent Agency Ranking
公开(公告)号：US20240253974A1
公开(公告)日：2024-08-01
申请号：US18102070
申请日：2023-01-26
Applicant: Rosemount Aerospace Inc.
Inventor： Roger Backman , Sarah Frink , David P. Potasek
CPC classification number: B81B3/0021 , B81C3/001 , B81B2201/0264 , B81B2203/0109 , B81C2201/013
Abstract: A wafer die assembly includes a first wafer having at least a central cavity defined therein. The wafer die assembly includes a second wafer mounted to the first wafer. At least one of the first or second wafers includes an etched pattern. The etched pattern including at least one peripheral cavity, and a raised area raised relative to the peripheral cavity. A method of assembling a wafer die assembly includes etching a central cavity into a first wafer and etching a pattern into at least one of the first wafer or a second wafer. The first wafer and/or the second wafer includes a raised area raised relative to the peripheral cavity or the central cavity. The method includes bonding the second wafer to the first wafer.
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公开(公告)号：US11692895B2
公开(公告)日：2023-07-04
申请号：US17217234
申请日：2021-03-30
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Jun Zheng
CPC classification number: G01L13/026 , G01F1/36 , G01L9/0048 , G01L13/025 , G01L19/142 , G01L19/145 , G01L27/005
Abstract: A differential MEMS pressure sensor includes a topping wafer with a top side and a bottom side, a diaphragm wafer having a top side connected to the bottom side of the topping wafer and a bottom side, and a backing wafer having a top side connected to the bottom side of the diaphragm wafer and a bottom side. The topping wafer includes a first cavity formed in the bottom side of the topping wafer. The diaphragm wafer includes a diaphragm, a second cavity formed in the bottom side of the diaphragm wafer underneath the diaphragm, an outer portion surrounding the diaphragm, and a trench formed in the top side of the diaphragm wafer and positioned in the outer portion surrounding the diaphragm.
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公开(公告)号：US20220316973A1
公开(公告)日：2022-10-06
申请号：US17217234
申请日：2021-03-30
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Jun Zheng
Abstract: A differential MEMS pressure sensor includes a topping wafer with a top side and a bottom side, a diaphragm wafer having a top side connected to the bottom side of the topping wafer and a bottom side, and a backing wafer having a top side connected to the bottom side of the diaphragm wafer and a bottom side. The topping wafer includes a first cavity formed in the bottom side of the topping wafer. The diaphragm wafer includes a diaphragm, a second cavity formed in the bottom side of the diaphragm wafer underneath the diaphragm, an outer portion surrounding the diaphragm, and a trench formed in the top side of the diaphragm wafer and positioned in the outer portion surrounding the diaphragm.
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公开(公告)号：US20210041316A1
公开(公告)日：2021-02-11
申请号：US16536486
申请日：2019-08-09
Applicant: Rosemount Aerospace Inc.
Inventor： David P. Potasek , Roger Alan Backman
Abstract: A micromechanical pressure sensor for measuring a pressure differential includes a diaphragm having an inner region and two edge regions, one opposite the other with respect to the inner region. Two or more piezoresistive resistance devices are on the diaphragm, at least one in each of the inner and edge region, and are configured to be electrically connected in a bridge circuit. The micromechanical pressure sensor is configured so that an operating temperature of the one or more piezoresistive resistance devices in the inner region is substantially the same as an operating temperature of the one or more piezoresistive resistance devices in at least one of the edge regions throughout a full operating range such that an error of the micromechanical pressure sensor output resulting from self-heating is less than if the micromechanical pressure sensor were not configured to maintain the operating temperatures substantially the same.
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公开(公告)号：US10861665B1
公开(公告)日：2020-12-08
申请号：US16593714
申请日：2019-10-04
Applicant: Rosemount Aerospace Inc.
Inventor： Roger Alan Backman , David P. Potasek
IPC: H01H85/041 , H01H85/00 , H01H69/02 , H01H85/175
Abstract: A micro-fuse assembly includes a substrate, a number of thin-film micro-fuses on the substrate, and a topping wafer configured to sealingly engage to at least one of the substrate or the thin-film micro-fuses to define a cavity therebetween. The cavity is configured to encapsulate the thin-film micro-fuses within an inert environment sealed within the cavity. A method of encapsulating a micro-fuse assembly within an inert environment using a topping wafer is also disclosed.
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