公开(公告)号：US10946612B2

公开(公告)日：2021-03-16

申请号：US16113335

申请日：2018-08-27

Applicant: TactoTek Oy

Inventor： Vinski Bräysy ,  Anne Isohätälä ,  Jarmo Sääski ,  Tomi Simula

IPC: G06F3/045 ,  B32B3/30 ,  B32B27/08 ,  G06F3/044 ,  B29C45/16 ,  B29L31/34

Abstract: An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.

公开(公告)号：US10485094B1

公开(公告)日：2019-11-19

申请号：US16113198

申请日：2018-08-27

Applicant: TactoTek Oy

Inventor： Anne Isohätälä ,  Hasse Sinivaara ,  Heikki Tuovinen ,  Ville Wallenius ,  Vinski Bräysy ,  Tomi Simula ,  Mikko Heikkinen ,  Minna Pirkonen ,  Tuukka Junkkari ,  Jarmo Sääski ,  Janne Asikkala ,  Antti Keränen

IPC: G01R27/26 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K1/16 ,  G06F3/044

Abstract: Integrated multilayer structure suitable for use in sensing applications is disclosed including at least one plastic layer, at least one film layer provided on both sides of the plastic layer. A film layer on a first side of the plastic layer includes electronics incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. The sensing electronics include an electrode and a connection element for connecting the electrode to control circuitry. A film layer on a second side of the plastic layer includes features including one conductive feature that is configured to shape an electromagnetic field to adapt a sensitivity or directionality the sensing response of the sensing electronics on the first side of the plastic layer.

公开(公告)号：US10225932B1

公开(公告)日：2019-03-05

申请号：US16113555

申请日：2018-08-27

Applicant: TactoTek Oy

Inventor： Tomi Simula ,  Vinski Bräysy ,  Mikko Heikkinen ,  Juha-Matti Hintikka ,  Minna Pirkonen ,  Pasi Raappana ,  Tuomas Heikkilä ,  Jarmo Sääski ,  Juhani Harvela

IPC: H05K5/00 ,  H05K7/00 ,  H05K1/14 ,  H05K1/11 ,  H01R12/71 ,  H05K1/02 ,  H05K1/18

Abstract: Interface arrangement comprising an electrical node type component for providing electrical or electromagnetic connection between an external system and a host structure of the interface arrangement. The interface arrangement comprising a first substrate film defining a cavity. A first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element at least partly arranged into the cavity. The at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between the external system and electronics of the host structure. A first connection element arranged at least partly into the cavity and configured for connecting to the external system. The first connection element is further at least functionally connected to the converter element. Related multilayer structures and methods of manufacture are presented.

公开(公告)号：US10194526B1

公开(公告)日：2019-01-29

申请号：US16113467

申请日：2018-08-27

Applicant: TactoTek Oy

Inventor： Tomi Simula ,  Vinski Bräysy ,  Mikko Heikkinen ,  Juha-Matti Hintikka ,  Juhani Harvela ,  Minna Pirkonen ,  Pasi Raappana ,  Tuomas Heikkilä ,  Jarmo Sääski

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H05K3/32 ,  H05K3/46 ,  H05K3/00 ,  H05K3/40

Abstract: An electrical node, a method, an electrical assembly such as a node strip or sheet, a related multilayer structure, and a method of manufacture are presented. The electrical node comprises a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element arranged into the cavity.

公开(公告)号：US12159965B2

公开(公告)日：2024-12-03

申请号：US18476676

申请日：2023-09-28

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Sami Torvinen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/00 ,  H01L33/46 ,  H01L33/62

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

公开(公告)号：US12004299B1

公开(公告)日：2024-06-04

申请号：US18104479

申请日：2023-02-01

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Ilpo Hänninen ,  Antti Keränen ,  Tomi Simula ,  Vinski Bräysy ,  Pälvi Apilo ,  Pasi Korhonen ,  Topi Wuori

IPC: H05K1/02 ,  B29C51/14 ,  G01P1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/14 ,  H05K3/30 ,  B29L31/34

CPC classification number: H05K1/185 ,  B29C51/14 ,  G01P1/02 ,  H05K3/0014 ,  H05K3/306 ,  B29L2031/3425 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2203/1327 ,  H05K2203/166

Abstract: An interface assembly includes a functional multilayer structure that includes a first substrate, a molded material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, wherein the sensor arrangement is arranged at least partly embedded into the molded material layer. The assembly further includes a movable member being movable relative to the functional multilayer structure, wherein the movable member includes at least one detection portion, and the sensor arrangement and the at least one detection portion are mutually arranged so that a position or a change of position of the movable member is detectable by the sensor arrangement based on a position or a change of position of the at least one detection portion relative to the sensor arrangement.

公开(公告)号：US11703627B1

公开(公告)日：2023-07-18

申请号：US17945247

申请日：2022-09-15

Applicant: TactoTek Oy

Inventor： Antti Keränen ,  Tero Heikkinen ,  Pasi Korhonen ,  Pälvi Apilo ,  Mikko Heikkinen ,  Jarmo Sääski ,  Paavo Niskala ,  Ville Wallenius ,  Heikki Tuovinen ,  Janne Asikkala ,  Taneli Salmi ,  Suvi Kela ,  Outi Rusanen ,  Johanna Juvani ,  Mikko Sippari ,  Tomi Simula ,  Tapio Rautio ,  Samuli Yrjänä ,  Tero Rajaniemi ,  Simo Koivikko ,  Juha-Matti Hintikka ,  Hasse Sinivaara ,  Vinski Bräysy ,  Olimpia Migliore ,  Juha Sepponen

IPC: F21V8/00 ,  G02B5/08

CPC classification number: G02B6/0031 ,  G02B6/004 ,  G02B6/0021 ,  G02B6/0036 ,  G02B6/0041 ,  G02B6/0043 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0061 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B5/0883

Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source; the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

公开(公告)号：US11528802B2

公开(公告)日：2022-12-13

申请号：US16724631

申请日：2019-12-23

Applicant: TACTOTEK OY

Inventor： Tapio Rautio ,  Tomi Simula ,  Minna Pirkonen ,  Jarkko Torvinen ,  Tuukka Junkkari ,  Janne Asikkala ,  Hasse Sinivaara

IPC: H05K1/02

Abstract: A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.

公开(公告)号：US11175014B1

公开(公告)日：2021-11-16

申请号：US17321692

申请日：2021-05-17

Applicant: TactoTek Oy

Inventor： Juha-Matti Hintikka ,  Miikka Kärnä ,  Heikki Tuovinen ,  Tuomas Nieminen ,  Johannes Soutukorva ,  Ville Wallenius ,  Tero Rajaniemi ,  Tomi Simula ,  Jari Lihavainen ,  Mikko Heikkinen ,  Jarmo Sääski ,  Hasse Sinivaara ,  Antti Keränen ,  Ilpo Hänninen

IPC: H05K1/02 ,  F21V11/08 ,  G02B5/00 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00 ,  H05K3/30

Abstract: An optoelectronically functional multilayer structure as well as related methods of manufacturing an optoelectronically functional multilayer structure are described herein.

公开(公告)号：US11166380B1

公开(公告)日：2021-11-02

申请号：US17072474

申请日：2020-10-16

Applicant: TactoTek Oy

Inventor： Tomi Simula ,  Mika Paani ,  Miikka Kärnä ,  Outi Rusanen ,  Johanna Juvani ,  Tapio Rautio ,  Marko Suo-Anttila ,  Mikko Heikkinen

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/08 ,  H05K3/12 ,  H05K3/28 ,  H05K3/32 ,  H05K3/44 ,  H01L21/00 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/77 ,  H01L21/78 ,  H01L23/00 ,  H01L23/12 ,  H01L23/16 ,  H01L23/18 ,  H01L23/24 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L23/552 ,  H01L23/538 ,  H05K5/03 ,  B29C45/14 ,  H05K5/06 ,  B29K101/12 ,  B29L31/34

Abstract: A structure includes a first substrate film and a functional electronics assembly. The first substrate film comprises a recess defining a volume. The functional electronics assembly comprises at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion. The functional electronics assembly is connected to the first substrate film via the at least one connection portion. The at least one electronics component is arranged at least partly into the volume. At least part of the at least one electronics component is embedded into a first material arranged into the recess.