公开(公告)号：US20170372827A1

公开(公告)日：2017-12-28

申请号：US15628950

申请日：2017-06-21

Applicant: TDK CORPORATION

Inventor： Katsumi KOBAYASHI

IPC: H01F17/04 ,  H01F5/04 ,  H01Q1/20 ,  H01Q1/32

CPC classification number: H01F17/04 ,  H01F5/02 ,  H01F5/04 ,  H01F27/022 ,  H01F27/266 ,  H01Q1/20 ,  H01Q1/3208 ,  H01Q1/405 ,  H01Q7/08

Abstract: A coil device includes a core member, a bobbin, a coil portion, an outer case, and a potting resin. The core member extends in a longitudinal direction. The bobbin is provided with a longitudinal concave portion communicating with a side surface opening portion open to outside and housing the core member. The coil portion is provided with a wire wound around the bobbin. The outer case is provided with a housing concave portion configured to house the bobbin housing the core member and have the coil portion. The potting resin is filled in the housing concave portion and surrounds the bobbin with the coil portion. An opening port of the housing concave portion and the side surface opening portion are open in the same direction.

公开(公告)号：US20230010668A1

公开(公告)日：2023-01-12

申请号：US17847717

申请日：2022-06-23

Applicant: TDK CORPORATION

Inventor： Akihiro MASUDA ,  Shinya ITO ,  Norihisa ANDO ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI

IPC: H01G4/224

Abstract: An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.

公开(公告)号：US20210225589A1

公开(公告)日：2021-07-22

申请号：US17133102

申请日：2020-12-23

Applicant: TDK CORPORATION

Inventor： Akihiro MASUDA ,  Shinya ITO ,  Norihisa ANDO ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI ,  Koji UTSUI ,  Koji KANEKO

IPC: H01G2/06 ,  H01G4/224 ,  H01G4/228

Abstract: An electronic device includes a chip component, a conductive terminal, a case, and a fixation part. The chip component includes a terminal electrode on an end surface of the chip component. The conductive terminal is connected to the terminal electrode. The case includes an accommodation recess for accommodating the chip component. The fixation part fixes the case to an installation portion.

公开(公告)号：US20180211784A1

公开(公告)日：2018-07-26

申请号：US15819804

申请日：2017-11-21

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Katsumi KOBAYASHI ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/248 ,  H01G4/38 ,  H01G4/30 ,  H01G4/232

Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.

公开(公告)号：US20140118882A1

公开(公告)日：2014-05-01

申请号：US14024398

申请日：2013-09-11

Applicant: TDK Corporation

Inventor： Sunao MASUDA ,  Katsumi KOBAYASHI ,  Takashi KOMATSU ,  Akitoshi YOSHII ,  Kazuyuki HASEBE ,  Kayou KUSANO ,  Norihisa ANDO

IPC: H01G4/228 ,  H01G4/12

CPC classification number: H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.

Abstract translation: 一种具有金属端子的陶瓷电子部件，包括在两端形成有端子电极的芯片部件，以及一对金属端子，包括具有平板部分的平板部分，所述平板部分面对面设置成使其面对所述芯片部件的端面， 通过接合部分连接到所述端子电极，以及安装部分，其连接到所述平板部分的一个端部并且大致垂直于所述平板部分延伸，其中所述安装部分具有形成约270°的角度的安装部分底面 形成相对于所述平板部分的角度以及相对于所述平板部分形成大约90度的角度的安装部分上表面，并且形成具有比所述安装部分底面更低的润湿性的阻焊区域。

公开(公告)号：US20170365399A1

公开(公告)日：2017-12-21

申请号：US15610966

申请日：2017-06-01

Applicant: TDK CORPORATION

Inventor： Katsumi KOBAYASHI ,  Kouyu OHI

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/24

CPC classification number: H01F17/045 ,  H01F27/2828 ,  H01F27/292

Abstract: A coil device 10 comprising, the core body 20 having a coil core part 22 and a core bottom face 24c, and a coil part forming spiral conductive pathway around the coil core part 22. A metal electrode 60 is formed at the core bottom face 24c, and the wire ends 41a, 41b, 42a, 42b which are the conductive pathway of the coil part 40 are formed at the metal electrode 60, and a part of the surface of the metal electrode 60 is covered by the conductive resin electrode 62.

公开(公告)号：US20170287645A1

公开(公告)日：2017-10-05

申请号：US15471108

申请日：2017-03-28

Applicant: TDK CORPORATION

Inventor： Sunao MASUDA ,  Katsumi KOBAYASHI

IPC: H01G4/38 ,  H01G4/12 ,  H01G4/248 ,  H01G4/005

CPC classification number: H01G4/38 ,  H01G4/005 ,  H01G4/12 ,  H01G4/248

Abstract: An electronic device includes a plurality of chip components and an external terminal. The chip components are provided with a terminal electrode formed on an end surface of a ceramic element body. The external terminal is electrically connected with the terminal electrodes to support the plurality of chip components adjacently in a first direction. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable with a mounting surface. The terminal electrode connection part is provided with a plurality of convex portions protruding toward the terminal electrode. At least one of the plurality of convex portions is respectively connected with each terminal electrode of the plurality of chip components.

公开(公告)号：US20160260546A1

公开(公告)日：2016-09-08

申请号：US15059047

申请日：2016-03-02

Applicant: TDK CORPORATION

Inventor： Masahiro MORI ,  Takayuki SAKAI ,  Katsumi KOBAYASHI

IPC: H01G4/228 ,  H01G4/12

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K3/301 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic device includes a chip component and an external terminal. The external terminal includes a terminal electrode connection part, a mounting connection part, and a support part. The terminal electrode connection part is arranged to face an end surface electrode part of a terminal electrode of the chip component. The mounting connection part is connectable to a mounting surface. The support part faces one side surface of an element body of the chip component closest to the mounting surface so as to support the one side surface spaced from the mounting surface. A bonding region and a non-bonding region are formed between the terminal electrode connection part of the external terminal and the end surface electrode part of the terminal electrode. The non-bonding region is formed from the terminal electrode connection part to the support part.

Abstract translation: 电子设备包括芯片组件和外部终端。 外部端子包括端子电极连接部，安装连接部和支撑部。 端子电极连接部被配置为与芯片部件的端子电极的端面电极部相对。 安装连接部分可连接到安装表面。 支撑部分面向最靠近安装表面的芯片部件的元件主体的一个侧表面，以支撑与安装表面间隔开的一个侧表面。 在外部端子的端子电极连接部和端子电极的端面电极部之间形成接合区域和非接合区域。 非接合区域由端子电极连接部分形成到支撑部分。

公开(公告)号：US20130328654A1

公开(公告)日：2013-12-12

申请号：US13910701

申请日：2013-06-05

Applicant: TDK Corporation

Inventor： Masaaki IWAKURA ,  Nobuo KITAJIMA ,  Katsumi KOBAYASHI ,  Satoshi SINBO

IPC: H01F27/00

CPC classification number: H01F27/006 ,  H01F27/325 ,  H01F2005/025

Abstract: A coil device 10 comprises a first bobbin 40 provided with a first winding part 45 at an outer circumference and a second bobbin 50 provided with a second winding part 55 at an outer circumference. A plurality of partition walls 46, separating portions of the wire 22 which are adjacent to each other along the scroll axis Z of the first wire 22 are formed on the first winding part 45 along the scroll axis at predetermined intervals. A section width w1 of each section 47, which is along the scroll axis Z, separated by the partition walls 46 is determined so that only one wire 22 can pass through. A height of the partition walls 46 is determined so that one or more of the wires 22 can pass through. At least one connecting groove 46a, connecting each section which are adjacent to each other, is formed on each partition wall 46.

Abstract translation: 线圈装置10包括在外周设置有第一绕组部分45的第一线轴40和在外周设置有第二绕线部分55的第二线轴50。 沿着第一线22的涡旋轴线Z彼此相邻的线22的分离部分的多个分隔壁46以预定间隔沿着滚动轴线形成在第一卷绕部分45上。 确定由分隔壁46分隔的沿着涡旋轴线Z的每个部分47的横截面宽度w1，使得只有一个导线22可以通过。 确定分隔壁46的高度，使得一根或多根电线22可以通过。 在每个分隔壁46上形成有至少一个连接槽46a，连接每个彼此相邻的部分。