-
公开(公告)号：US20190080842A1
公开(公告)日：2019-03-14
申请号：US16121701
申请日：2018-09-05
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.
-
公开(公告)号：US20180294100A1
公开(公告)日：2018-10-11
申请号：US15938561
申请日：2018-03-28
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and an external terminal. The chip component includes a terminal electrode formed on an end surface of a ceramic element body containing an internal electrode. The external terminal includes a first end electrically connected with the terminal electrode and a second end disposed opposite to the first end and connected with a mounting surface. The external terminal includes a first metal and a second metal different from the first metal. The first metal and the second metal are alternately exposed on a surface of the external terminal.
-
公开(公告)号：US20160343504A1
公开(公告)日：2016-11-24
申请号：US15142580
申请日：2016-04-29
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou KUSANO
CPC classification number: H01G2/16 , H01G2/065 , H01G2/14 , H01G4/232 , H01G4/30 , H01G4/40 , H05K1/181 , H05K2201/10015 , H05K2201/10181 , H05K2201/10515 , H05K2201/10522 , Y02P70/611
Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a first principal surface and a third side surface oppose each other. An electrode portion of a first external electrode and an electrode portion of a fourth external electrode are connected to each other.
Abstract translation: 第一金属端子包括连接到第二外部电极的电极部分的第一连接部分和从第一连接部分延伸的第一腿部部分。 第二金属端子包括连接到连接导体的导体部分的第二连接部分和从第二连接部分延伸的第二支腿部分。 多层电容器和过电流保护装置以使第一主面和第三侧面彼此相对的方式设置。 第一外部电极的电极部分和第四外部电极的电极部分彼此连接。
-
公开(公告)号：US20160227651A1
公开(公告)日：2016-08-04
申请号：US15007617
申请日：2016-01-27
Applicant: TDK CORPORATION
Inventor： Masahiro MORI , Atsushi SATO , Tomoyoshi FUJIMURA
CPC classification number: H05K1/181 , H01G2/065 , H01G4/0085 , H01G4/012 , H01G4/1227 , H01G4/224 , H01G4/228 , H01G4/232 , H01G4/30 , H05K1/0298 , H05K1/11 , H05K3/3436 , H05K2201/10015 , H05K2201/10378 , H05K2201/10636 , Y02P70/611 , Y02P70/613
Abstract: An electronic component includes a multilayer capacitor and an interposer The multilayer capacitor includes an element body and a pair of external electrodes. The interposer includes a substrate, a pair of first electrodes, and is pair of second electrodes. The substrate includes first and second principal faces. The pair of first electrodes are disposed on the first principal face. The pair of second electrodes are disposed on the second principal thee. The element body includes a first portion and a pair of second portions. The first portion is covered by the external electrodes. The pair of second portions are located on both sides or the first portion and separated from the interposer. A width in a second direction of the pair of external electrodes is smaller than a width in the second direction of the element body and larger than a width in the second direction of the second portion.
Abstract translation: 电子部件包括层叠电容器和插入件。多层电容器包括元件体和一对外部电极。 插入器包括衬底，一对第一电极，并且是一对第二电极。 衬底包括第一和第二主面。 一对第一电极设置在第一主面上。 一对第二电极设置在第二主体上。 元件主体包括第一部分和一对第二部分。 第一部分由外部电极覆盖。 一对第二部分位于两侧或第一部分上并与插入件分离。 一对外部电极的第二方向的宽度小于元件体的第二方向的宽度，大于第二部分的第二方向的宽度。
-
公开(公告)号：US20190304689A1
公开(公告)日：2019-10-03
申请号：US16353747
申请日：2019-03-14
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The holding pieces are formed on the terminal body. A connection member configured to connect the terminal body and the end surface of the terminal body exists in a joint region between the terminal body and the end surface of the terminal electrode. A pair of reinforcement pieces is formed on the terminal body so as not to overlap with the joint region in a direction extending from one to the other of the pair of holding pieces.
-
Patent Agency Ranking
公开(公告)号：US20180211784A1
公开(公告)日：2018-07-26
申请号：US15819804
申请日：2017-11-21
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Katsumi KOBAYASHI , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.
-
公开(公告)号：US20180197681A1
公开(公告)日：2018-07-12
申请号：US15819778
申请日：2017-11-21
Applicant: TDK Corporation
Inventor： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou MATSUNAGA , Kosuke YAZAWA
CPC classification number: H01G4/248 , H01G2/06 , H01G2/065 , H01G4/12 , H01G4/232 , H01G4/30 , H01G4/38
Abstract: An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.
-
公开(公告)号：US20180075973A1
公开(公告)日：2018-03-15
申请号：US15702047
申请日：2017-09-12
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Masahiro MORI , Sunao MASUDA , Kayou MATSUNAGA , Kosuke YAZAWA
Abstract: An electronic device including: a first chip component, having approximately rectangular parallelepiped shape; a second chip component, having approximately rectangular parallelepiped shape; and an external terminal electrically connected to a first terminal electrode and a second terminal electrode. The external terminal includes an electrode connecting component, connected to the first terminal electrode and the second terminal electrode. The electrode connecting component includes: a first component, connected to the coupling component and faces the first terminal electrode; and a second component, extends upward from the first component and faces the first terminal electrode and the second terminal electrode. Length of the second component in a width direction is shorter than a length of the first component in a width direction. Length W2 of the second component in a width direction is shorter than lengths W3, W4 of the first chip component and the second chip component in a width direction.
-
公开(公告)号：US20170103852A1
公开(公告)日：2017-04-13
申请号：US15286122
申请日：2016-10-05
Applicant: TDK CORPORATION
Inventor： Norihisa ANDO , Masahiro MORI , Sunao MASUDA , Kayou KUSANO
CPC classification number: H01G4/002 , H01C7/02 , H01C7/13 , H01G2/06 , H01G2/14 , H01G4/1227 , H01G4/1236 , H01G4/232 , H01G4/242 , H01G4/30 , H01G4/40 , H05K3/3426 , H05K2201/10015 , H05K2201/10181 , H05K2201/10378 , H05K2201/10515 , H05K2201/1053 , H05K2201/10537 , H05K2201/10757 , H05K2201/10946 , H05K2201/10962 , H05K2201/2045
Abstract: A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.
-
公开(公告)号：US20160118192A1
公开(公告)日：2016-04-28
申请号：US14918903
申请日：2015-10-21
Applicant: TDK CORPORATION
Inventor： Tomoyoshi FUJIMURA , Atsushi SATO , Masahiro MORI
CPC classification number: H01G4/30 , H01G2/06 , H01G2/065 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/248 , H05K1/11 , H05K1/111 , H05K1/181 , H05K3/3442 , H05K2201/10015 , H05K2201/10378 , H05K2201/2045 , Y02P70/611 , Y02P70/613
Abstract: An electronic component includes a multilayer capacitor and an interposer. The multilayer capacitor includes an element body and a pair of external electrodes. The interposer includes a substrate having first and second principal faces, a pair of first electrodes disposed on the first principal face, and a pair of second electrodes disposed on the second principal face so as to be separated from the pair of first electrodes in a first direction or in a second direction. Widths of the pair of external electrodes and the pair of first electrodes are smaller than a width of the element body. The element body has a first portion covered by the external electrode, and a pair of second portions located on both sides of the first portion. The pair of second portions are separated from the interposer and overlap the pair of second electrodes when viewed from a third direction.
Abstract translation: 电子部件包括多层电容器和内插器。 多层电容器包括元件体和一对外部电极。 插入器包括具有第一和第二主面的衬底，设置在第一主面上的一对第一电极和设置在第二主面上的一对第二电极，以与第一电极的第一电极分离 方向或第二方向。 一对外部电极和一对第一电极的宽度小于元件主体的宽度。 元件主体具有由外部电极覆盖的第一部分和位于第一部分两侧的一对第二部分。 当从第三方向观察时，该对第二部分与插入器分离并与该对第二电极重叠。
-
-
-
-
-
-
-
-
-
Search Results
27
records
(took 0.034 seconds)
