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公开(公告)号：US20050186808A1
公开(公告)日：2005-08-25
申请号：US10787681
申请日：2004-02-24
Applicant: Victor Prokofiev
Inventor： Victor Prokofiev
IPC: H01L23/48 , H01L23/498 , H01R12/00 , H01R13/05 , H05K3/30
CPC classification number: H05K3/308 , H01L23/49827 , H01L24/72 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19106 , H01L2924/30107 , H01R12/52 , H01R12/58 , H01R13/052 , H05K2201/09472 , H05K2201/09509 , H05K2201/09827 , H05K2201/1059 , H05K2201/10856
Abstract: A socket may be formed with socket pins that include two spring biased arms biased to extend away from one another. The arms may be provided with tapered upper surfaces that engage contact holes on a pin guide 18 of an integrated circuit package, camming the socket pin arms together. The pin guide may have a tapered via structure that expands as it extends into the package. Thus, as the spring arms spread apart inside the pin guide, they may rotate through an angle which causes contacting surfaces on the spring arms and the pin guide to be parallel, creating good surface contact.
Abstract translation: 插座可以形成有插座销，插座销包括被偏置以彼此远离延伸的两个弹簧偏置臂。 臂可以设置有锥形上表面，其接合集成电路封装的引脚引导件18上的接触孔，将插座销臂相互固定在一起。 销引导件可以具有锥形通孔结构，其在其延伸到包装中时膨胀。 因此，当弹簧臂在销引导件内分开时，它们可以旋转一定角度，这导致弹簧臂上的接触表面和销引导件平行，形成良好的表面接触。
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公开(公告)号：US06795296B1
公开(公告)日：2004-09-21
申请号：US10677083
申请日：2003-09-30
Applicant: Cengiz A. Palanduz , Victor Prokofiev
Inventor： Cengiz A. Palanduz , Victor Prokofiev
IPC: H01G406
CPC classification number: H01G4/1227 , C04B35/4682 , C04B35/62805 , C04B2235/32 , C04B2235/3206 , C04B2235/3208 , C04B2235/3224 , C04B2235/3227 , C04B2235/3251 , C04B2235/3272 , C04B2235/3279 , H01G4/33 , Y10T29/43
Abstract: A method for making, and a dielectric material is provided. A capacitor is provided that includes a lossy dielectric layer that is also not leaky. The lossy behavior dampens unwanted oscillations in power supplies or other electrical systems. A capacitor is further provided is tunable for an amount of lossy behavior over a broad range. A core dopant concentration can be varied, and a doped core grain fraction can be varied to control the extent of a desired lossy property in a capacitor. Dielectric materials having grains with doped shells reduce leakiness. Additionally in selected embodiments, undoped core grains mixed with doped core grains reduce leakiness.
Abstract translation: 提供了制造方法和电介质材料。 提供了一种电容器，其包括也不漏的有损介质层。 有损行为会抑制电源或其他电气系统中的不必要的振荡。 进一步提供的电容器可在一个宽范围内调节一定量的有损行为。 可以改变芯掺杂剂浓度，并且可以改变掺杂的芯晶粒分数以控制电容器中期望的有损性质的程度。 具有掺杂壳的晶粒的介电材料减少泄漏。 另外在选择的实施例中，与掺杂的芯颗粒混合的未掺杂的芯晶粒减少泄漏。
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13.发明授权Method of forming a substrate core with embedded capacitor and structures formed thereby 有权用嵌入式电容器形成衬底芯的方法和由此形成的结构公开(公告)号：US09572258B2
公开(公告)日：2017-02-14
申请号：US11027386
申请日：2004-12-30
Applicant: Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
Inventor： Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
CPC classification number: H05K1/162 , H01G4/10 , H01G4/1209 , H01G4/33 , H05K3/429 , H05K3/4611 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , Y10T29/43 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括通过将第一电介质层附着到薄膜电容器的第二导电层并且将第二电介质层附接到薄膜电容器的第一导电层来形成衬底芯。
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14.发明授权Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same 有权具有嵌入式薄膜电容器的有机基板，其制造方法以及包含其的系统公开(公告)号：US07636231B2
公开(公告)日：2009-12-22
申请号：US12055467
申请日：2008-03-26
Applicant: John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev
Inventor： John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev
IPC: H01G4/06
CPC classification number: H01L23/49822 , H01G4/236 , H01G4/33 , H01L21/4857 , H01L23/50 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/15312 , H05K1/162 , H05K2201/09309 , H05K2201/09481 , H05K2201/09509 , H05K2201/09518 , H05K2201/09718 , Y10T29/435 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.
Abstract translation: 薄膜电容器组件包括通过深和浅通孔访问的两个板。 薄膜电容器组件能够与间隔件和插入件耦合。 薄膜电容器组件也能够与多个薄膜电容器组件堆叠。 薄膜电容器组件也是计算系统的一部分。
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15.发明申请ORGANIC SUBSTRATES WITH EMBEDDED THIN-FILM CAPACITORS, METHODS OF MAKING SAME, AND SYSTEMS CONTAINING SAME 有权具有嵌入式薄膜电容器的有机基板，其制造方法和包含其的系统公开(公告)号：US20080174938A1
公开(公告)日：2008-07-24
申请号：US12055467
申请日：2008-03-26
Applicant: John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev
Inventor： John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev
CPC classification number: H01L23/49822 , H01G4/236 , H01G4/33 , H01L21/4857 , H01L23/50 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/15312 , H05K1/162 , H05K2201/09309 , H05K2201/09481 , H05K2201/09509 , H05K2201/09518 , H05K2201/09718 , Y10T29/435 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.
Abstract translation: 薄膜电容器组件包括通过深和浅通孔访问的两个板。 薄膜电容器组件能够与间隔件和插入件耦合。 薄膜电容器组件也能够与多个薄膜电容器组件堆叠。 薄膜电容器组件也是计算系统的一部分。
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Patent Agency Ranking
16.发明授权Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same 有权具有集成薄膜电容器的有机衬底，其制造方法以及含有它们的系统公开(公告)号：US07288459B2
公开(公告)日：2007-10-30
申请号：US11095917
申请日：2005-03-31
Applicant: John S. Guzek , Victor Prokofiev
Inventor： John S. Guzek , Victor Prokofiev
IPC: H01L21/20
CPC classification number: H05K1/162 , H01G4/236 , H01G4/33 , H01L21/4857 , H01L23/49822 , H01L23/50 , H01L23/642 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/15311 , H01L2924/15312 , H05K1/141 , H05K3/4602 , H05K2201/09309 , H05K2201/09481 , H05K2201/09518 , H05K2201/09718 , H05K2201/10674 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: An organic substrate, thin-film capacitor composite includes two plates that are accessed through deep and shallow vias. The organic substrate, thin-film capacitor composite includes integral structure with at least one trace in the organic substrate. The composite is able to be coupled with an interposer. The composite is also part of computing system.
Abstract translation: 有机基板，薄膜电容器复合材料包括通过深和浅通孔访问的两个板。 有机衬底，薄膜电容器复合材料包括在有机衬底中具有至少一个迹线的整体结构。 复合材料能够与插入件耦合。 复合也是计算系统的一部分。
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17.发明授权Forming a substrate core with embedded capacitor and structures formed thereby 有权形成具有嵌入式电容器的基板芯和由此形成的结构公开(公告)号：US07224571B2
公开(公告)日：2007-05-29
申请号：US11218357
申请日：2005-09-02
Applicant: Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
Inventor： Sriram Srinivasan , John S. Guzek , Cengiz A. Palanduz , Victor Prokofiev , Joel A. Auernheimer
IPC: H01G4/228
CPC classification number: H05K1/162 , H01G4/10 , H01G4/1209 , H01G4/33 , H05K3/429 , H05K3/4611 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , Y10T29/43 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括通过将第一电介质层附着到薄膜电容器的第二导电层并且将第二电介质层附接到薄膜电容器的第一导电层来形成衬底芯。
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18.发明申请Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same 有权具有集成薄膜电容器的有机衬底，其制造方法以及含有它们的系统公开(公告)号：US20060223226A1
公开(公告)日：2006-10-05
申请号：US11095917
申请日：2005-03-31
Applicant: John Guzek , Victor Prokofiev
Inventor： John Guzek , Victor Prokofiev
CPC classification number: H05K1/162 , H01G4/236 , H01G4/33 , H01L21/4857 , H01L23/49822 , H01L23/50 , H01L23/642 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/15311 , H01L2924/15312 , H05K1/141 , H05K3/4602 , H05K2201/09309 , H05K2201/09481 , H05K2201/09518 , H05K2201/09718 , H05K2201/10674 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: An organic substrate, thin-film capacitor composite includes two plates that are accessed through deep and shallow vias. The organic substrate, thin-film capacitor composite includes integral structure with at least one trace in the organic substrate. The composite is able to be coupled with an interposer. The composite is also part of computing system.
Abstract translation: 有机基板，薄膜电容器复合材料包括通过深和浅通孔访问的两个板。 有机衬底，薄膜电容器复合材料包括在有机衬底中具有至少一个迹线的整体结构。 复合材料能够与插入件耦合。 复合也是计算系统的一部分。
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公开(公告)号：US07470147B2
公开(公告)日：2008-12-30
申请号：US10787681
申请日：2004-02-24
Applicant: Victor Prokofiev
Inventor： Victor Prokofiev
IPC: H01R13/73
CPC classification number: H05K3/308 , H01L23/49827 , H01L24/72 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19106 , H01L2924/30107 , H01R12/52 , H01R12/58 , H01R13/052 , H05K2201/09472 , H05K2201/09509 , H05K2201/09827 , H05K2201/1059 , H05K2201/10856
Abstract: A socket may be formed with socket pins that include two spring biased arms biased to extend away from one another. The arms may be provided with tapered upper surfaces that engage contact holes on a pin guide 18 of an integrated circuit package, camming the socket pin arms together. The pin guide may have a tapered via structure that expands as it extends into the package. Thus, as the spring arms spread apart inside the pin guide, they may rotate through an angle which causes contacting surfaces on the spring arms and the pin guide to be parallel, creating good surface contact.
Abstract translation: 插座可以形成有插座销，插座销包括被偏置以彼此远离延伸的两个弹簧偏置臂。 臂可以设置有锥形上表面，其接合集成电路封装的引脚引导件18上的接触孔，将插座销臂相互固定在一起。 销引导件可以具有锥形通孔结构，其在其延伸到包装中时膨胀。 因此，当弹簧臂在销引导件内分开时，它们可以旋转一定角度，这导致弹簧臂上的接触表面和销引导件平行，形成良好的表面接触。
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公开(公告)号：US07235880B2
公开(公告)日：2007-06-26
申请号：US10931917
申请日：2004-09-01
Applicant: Victor Prokofiev
Inventor： Victor Prokofiev
CPC classification number: H01L23/49838 , H01L23/49816 , H01L2224/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01087 , H01L2924/1532 , H01L2924/15323 , H01L2924/1533 , H01L2924/16152 , H01L2924/16235 , H01L2924/16251 , H01L2924/3011 , H05K1/0203 , H05K1/0262 , H05K1/141 , H05K1/145 , H05K1/182 , H05K2201/066 , H05K2201/10477 , H05K2201/10734 , H01L2224/0401
Abstract: A package for integrated circuits is described. The package has a package substrate with a land side and an opposite die side, a first set of low level signal connectors on the die side to connect to an IC to be carried by the package, and a second set of low level signal connectors on the die side to connect to external components. The package may have power connectors on the land side or a power supply attached to the land side. A heat spreader or cooler may be attached to the die side.
Abstract translation: 描述了集成电路的封装。 封装具有封装衬底，其具有焊盘侧和相对的裸片侧，裸片侧的第一组低电平信号连接器连接到要由封装承载的IC，以及第二组低电平信号连接器 模具侧连接到外部组件。 该包装可能在陆地上具有电源连接器或者连接到陆地侧的电源。 散热器或冷却器可以附接到管芯侧。
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