公开(公告)号：US09474160B2

公开(公告)日：2016-10-18

申请号：US14400261

申请日：2012-05-18

Applicant: Logan Peter Palmer

Inventor： Logan Peter Palmer

IPC: H05K7/00 ,  H05K1/18 ,  H05K3/28 ,  H05K9/00 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/189 ,  H05K3/0091 ,  H05K3/284 ,  H05K3/4691 ,  H05K9/0022 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/042 ,  H05K2201/055 ,  H05K2201/056 ,  Y10T29/49124

Abstract: Printed circuit board apparatus with electromagnetic interference shields and methods of making the same.

Abstract translation: 具有电磁干扰屏蔽的印刷电路板装置及其制造方法。

公开(公告)号：US09163974B1

公开(公告)日：2015-10-20

申请号：US14567514

申请日：2014-12-11

Applicant: Enevo Oy

Inventor： Fredrik Kekäläinen

IPC: G01F23/284 ,  H05K5/06

CPC classification number: G01F23/284 ,  B65F2210/128 ,  B65F2210/1443 ,  B65F2210/168 ,  B65F2210/184 ,  B65F2210/20 ,  G01D11/245 ,  G01F1/007 ,  G01F23/00 ,  H01Q1/225 ,  H01Q1/40 ,  H01Q1/42 ,  H04B1/03 ,  H05K1/141 ,  H05K1/165 ,  H05K3/281 ,  H05K3/285 ,  H05K5/065 ,  H05K2201/0158 ,  H05K2201/0376 ,  H05K2201/10098 ,  H05K2203/1311 ,  H05K2203/1316

Abstract: Disclosed is a wireless gauge apparatus and manufacturing method thereof. The wireless gauge apparatus comprises a printed circuit board comprising a wireless transceiver and at least one sensor, a power source electrically coupled with the printed circuit board, an antenna electrically coupled with the wireless transceiver and a casing encasing the printed circuit board, the power source and the antenna. The casing is made of polyurethane having a density of 0.8-1.2 g/cm3. The antenna is surrounded by a protective layer having a thickness of 4-8 mm, a density of at most 50 kg/m3 and a dielectric constant of 1-2.7.

Abstract translation: 公开了一种无线计量装置及其制造方法。 该无线计量装置包括印刷电路板，其包括无线收发器和至少一个传感器，与印刷电路板电耦合的电源，与无线收发器电耦合的天线和封装印刷电路板的外壳，电源 和天线。 外壳由密度为0.8-1.2g / cm3的聚氨酯制成。 该天线由厚度为4-8mm，密度至多为50kg / m 3，介电常数为1-2.7的保护层包围。

公开(公告)号：US20150050473A1

公开(公告)日：2015-02-19

申请号：US14445771

申请日：2014-07-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Kwan SEO ,  Jun Young KIM

IPC: G03F7/085 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00

CPC classification number: G03F7/085 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/038 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/0023 ,  H05K3/38 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2203/0514 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.

Abstract translation: 树脂组合物，使用该组合物的印刷电路板以及印刷电路板的制造方法。 树脂组合物包括：可光聚合化合物，例如具有在分子中可聚合的烯属不饱和键的光聚合化合物，光引发剂和通过烷基磺化四唑化合物的表面改性二氧化硅。

公开(公告)号：US20140340826A1

公开(公告)日：2014-11-20

申请号：US13896332

申请日：2013-05-17

Applicant: Asia Vital Components Co., Ltd.

Inventor： Ching-Hang Shen ,  Fu-Kuei Chang

IPC: G06F1/16 ,  H05K1/02

CPC classification number: G06F1/1666 ,  H05K1/0216 ,  H05K1/0266 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/28 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/029 ,  H05K2201/0308 ,  H05K2201/051 ,  H05K2201/057 ,  H05K2201/09781 ,  H05K2201/09936 ,  H05K2201/10037

Abstract: A portable input device includes a flexible main body, a sensing electrode layer, a protection layer and a memory metal body. The flexible main body has a first face and a second face. The sensing electrode layer has a first sensing electrode and a second sensing electrode disposed on the second face of the flexible main body. The protection layer is correspondingly disposed on the second face of the flexible main body to cover the sensing electrode layer. The memory metal body is disposed on one face of the flexible main body or one face of the protection layer for curling the flexible main body for easy carry or storage. Accordingly, the convenient portable input device is flexible, lightweight and thin for a user to conveniently carry.

Abstract translation: 便携式输入装置包括柔性主体，感测电极层，保护层和记忆金属体。 柔性主体具有第一面和第二面。 感测电极层具有设置在柔性主体的第二面上的第一感测电极和第二感测电极。 保护层相应地设置在柔性主体的第二面上以覆盖感测电极层。 记忆金属体设置在柔性主体的一个面或保护层的一个表面上，用于卷曲柔性主体以便于携带或存放。 因此，方便的便携式输入设备是灵活的，轻便的和薄的，用户方便携带。

公开(公告)号：US20140287158A1

公开(公告)日：2014-09-25

申请号：US14219047

申请日：2014-03-19

Applicant: Intrinsiq Materials, Inc.

Inventor： Janet Heyen ,  Michael Carmody

IPC: C09D5/24

CPC classification number: H05K1/095 ,  C08K9/10 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0326 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/0514 ,  H01L2924/00

Abstract: A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents.

Abstract translation: 用于筛网的导电糊剂具有平均直径在1.0-8.0微米之间的铜薄片和平均直径为10nm至100nm的铜纳米颗粒的混合物，其中铜片与纳米颗粒的比例为2:1 和5：1重量比; 以及包含分子量超过10,000的聚合物的大约一半的树脂和一种或多种溶剂。

公开(公告)号：US08721950B2

公开(公告)日：2014-05-13

申请号：US13666339

申请日：2012-11-01

Applicant: Scivax Corporation ,  Maruzen Petrochemical Co., Ltd.

Inventor： Takemori Toshifumi ,  Yoshiaki Takaya ,  Takahito Mita ,  Tetsuya Iizuka ,  Yuji Hashima ,  Takahisa Kusuura ,  Mitsuru Fujii ,  Takuji Taguchi ,  Anupam Mitra

IPC: B29C59/02 ,  C08G61/08 ,  C08F8/04 ,  C08F32/08

CPC classification number: B29C59/005 ,  B29C59/026 ,  B29K2045/00 ,  C08F232/08 ,  C08G61/06 ,  C08G61/08 ,  H05K1/032 ,  H05K3/0014 ,  H05K3/107 ,  H05K2201/0158 ,  H05K2203/0108

Abstract: A resin for thermal imprint include a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]>10. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved. Tg(° C.)

Abstract translation: 用于热压印的树脂包括在主链中含有由以下化学式1或以下化学式2表示的骨架中的至少一种的环状烯烃系热塑性树脂。 玻璃化转变温度Tg（℃）和MFR在260℃下的值（[M]）满足下列等式1，[M]> 10。 热压印特性（转印性，脱模特性等）优异，生产率（生产率）提高​​。 Tg（℃）<219×log [M] -104 [等式1]

公开(公告)号：US20140004324A1

公开(公告)日：2014-01-02

申请号：US13679777

申请日：2012-11-16

Applicant: ELITE ELECTRONIC MATERIAL (ZHONGSHAN)

Inventor： CHEN-YU HSIEH ,  CHANG-YUAN LI

IPC: C08L71/12 ,  B32B3/10 ,  C08L79/00 ,  B32B15/08 ,  C08L25/08 ,  C08L57/00

CPC classification number: C08L71/123 ,  B32B3/10 ,  B32B15/08 ,  B82Y30/00 ,  C08L25/08 ,  C08L57/00 ,  C08L71/126 ,  C08L79/00 ,  C08L79/02 ,  C08L79/04 ,  H05K1/024 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/31692 ,  C08L23/00

Abstract: A resin composition includes (A) 100 parts by weight of poly(phenylene oxide) resin with styrene end group; (B) 5 to 75 parts by weight of olefin copolymer; and (C) 1 to 150 parts by weight of cyanate resin with poly(phenylene oxide) functional group. The resin composition is characterized by specific composition and proportion conducive to achieving a low dielectric constant, a low dielectric loss, and a high thermal tolerance and preparing a prepreg or a resin film, thereby being applicable to copper-clad laminates and printed circuit boards.

Abstract translation: 树脂组合物包含（A）100重量份的具有苯乙烯端基的聚苯醚树脂; （B）5〜75重量份的烯烃共聚物; 和（C）1〜150重量份具有聚（苯醚）官能团的氰酸酯树脂。 树脂组合物的特征在于具有有助于实现低介电常数，低介电损耗和高耐热性的特定组成和比例，并且制备预浸料或树脂膜，从而可应用于覆铜层压板和印刷电路板。

公开(公告)号：US08568891B2

公开(公告)日：2013-10-29

申请号：US13463541

申请日：2012-05-03

Applicant: Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

Inventor： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

IPC: B32B15/08

CPC classification number: H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract translation: 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有1,2-乙烯基和（C）交联剂，处于相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US08551628B2

公开(公告)日：2013-10-08

申请号：US12267198

申请日：2008-11-07

Applicant: Min She Su

Inventor： Min She Su

IPC: B32B5/02 ,  B32B27/04 ,  B32B27/12

CPC classification number: H05K1/0373 ,  H05K1/032 ,  H05K1/0366 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/24355 ,  Y10T442/2418 ,  Y10T442/2475 ,  Y10T442/2992 ,  Y10T442/3594

Abstract: A composite material, a high-frequency circuit substrate made from the composite material, and a method of making the high-frequency circuit substrate. The composite material includes: a thermosetting composition including a butadiene styrene copolymer resin with a molecular weight less than 11,000 containing more than 60 percent of vinyl, a polybutadiene resin with polarity groups containing more than 60 percent vinyl, and a maleic anhydride grafted polybutadiene styrene copolymer with a molecular weight of more than 50,000; a fiberglass cloth; a powder filler; and a cure initiator. The composite material permits easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for the processing operation. The composite material is suitable for making the circuit substrate.

Abstract translation: 复合材料，由复合材料制成的高频电路基板以及制造高频电路基板的方法。 复合材料包括：热固性组合物，其包含分子量小于11,000的丁二烯苯乙烯共聚物树脂，其含有60％以上的乙烯基，极性基团含有大于60％的乙烯基的聚丁二烯树脂和马来酸酐接枝的聚丁二烯苯乙烯共聚物 分子量超过50,000; 玻璃纤维布; 粉末填料; 和固化引发剂。 复合材料允许容易地制造预浸料和铜箔的高粘结。 由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切和优异的耐热性，并且便于加工操作。 复合材料适用于制造电路基板。

公开(公告)号：US08519273B2

公开(公告)日：2013-08-27

申请号：US12937018

申请日：2009-02-13

Applicant: Sankar Paul ,  Dirk M. Baars

Inventor： Sankar Paul ,  Dirk M. Baars

IPC: H05K1/00

CPC classification number: H05K1/0373 ,  B32B7/12 ,  B32B15/06 ,  B32B15/08 ,  B32B15/085 ,  B32B15/20 ,  B32B27/285 ,  B32B27/32 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2262/0276 ,  B32B2264/0278 ,  B32B2307/204 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/714 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/00 ,  C08K3/22 ,  C08L15/00 ,  C08L19/006 ,  C08L71/12 ,  C08L2666/14 ,  C09D5/24 ,  C09D7/61 ,  C09J107/00 ,  C12Q1/6886 ,  C12Q2600/154 ,  C12Q2600/156 ,  H05K1/032 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/2804 ,  Y10T428/31826 ,  Y10T428/31833 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31924 ,  Y10T428/31931 ,  Y10T428/31938 ,  C08L2666/08

Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Abstract translation: 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。