公开(公告)号：US20150334826A1

公开(公告)日：2015-11-19

申请号：US14281631

申请日：2014-05-19

Applicant: Konstantine Karavakis ,  Kenneth S. Bahl ,  Steve Carney

Inventor： Konstantine Karavakis ,  Kenneth S. Bahl ,  Steve Carney

IPC: H05K1/03 ,  H05K3/40 ,  H05K3/08 ,  H05K3/10 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/08 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4038 ,  H05K2201/017 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/025 ,  H05K2203/0716 ,  H05K2203/107

Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.

Abstract translation: 印刷电路板包括层叠基板。 层压基板包括抵抗金属电镀的催化材料，除了催化材料的表面被烧蚀之外。 金属痕迹形成在层压基板内的痕迹通道内。 通道延伸到催化材料的表面之下。

公开(公告)号：US20150223317A1

公开(公告)日：2015-08-06

申请号：US14423281

申请日：2013-06-27

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Sotaro Oi

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0203 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/017 ,  H01L2924/00

Abstract: To provide a power-module substrate having a multi-layered structure which can meet higher integration by improving a performance of a power-cycle and a performance of a heat cycle: a plurality of circuit-layer metal-plates 4A to 4E, 5A, and 5B made of copper or copper alloy are bonded in a layered state intermediating a first ceramic substrate 2; a metal member 12 connecting both the circuit-layer metal-plates disposed on both surfaces of the first ceramic substrate 2 is inserted into a through hole 11 formed in the first ceramic substrate 2; a second ceramic substrate 3 is bonded on a surface of one side of the circuit-layer metal-plates 4A to 4E, 5A and 5B in the layered state; and a heat-radiation-layer metal-plate 6 made of aluminum or aluminum alloy is bonded on a surface of the second ceramic substrate 3 counter to the circuit-layer metal-plates 4A to 4E, 5A, and 5B.

Abstract translation: 提供具有多层结构的功率模块基板，其可以通过提高功率循环的性能和加热循环的性能来满足更高的集成度：多个电路层金属板4A至4E，5A， 由铜或铜合金制成的5B以中间化第一陶瓷基板2的层状结合; 将设置在第一陶瓷基板2的两面的电路层金属板连接的金属部件12插入到形成在第一陶瓷基板2中的通孔11中; 第二陶瓷基板3以层叠状态接合在电路层金属板4A〜4E，5A，5B的一侧的表面上; 在第二陶瓷基板3的与电路层金属板4A〜4E，5A，5B相反的表面上接合由铝或铝合金构成的散热层金属板6。

公开(公告)号：US20150107879A1

公开(公告)日：2015-04-23

申请号：US14000568

申请日：2012-02-01

Applicant: Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

Inventor： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC: H05K1/03 ,  C04B41/00 ,  H05K1/14

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.

Abstract translation: 布线基板包括由陶瓷层叠体形成的矩阵形状的基板主体，并且具有前表面和后表面，并且具有四个侧表面，每个侧表面位于前表面和背面之间 表面，并且具有位于朝向前表面的一侧的凹槽表面和位于朝向后表面的一侧的断裂表面; 以及金属化层，其形成在所述基板主体的前表面上，以便沿着所述四个侧表面延伸，并且在平面图中具有矩形框架形状，其中所述基板主体的陶瓷层叠体的水平表面 在金属化层与基板主体的各侧面的槽面之间露出。

公开(公告)号：US20150083565A1

公开(公告)日：2015-03-26

申请号：US14560528

申请日：2014-12-04

Applicant: INNOLUX CORPORATION

Inventor： KAI MENG ,  LIEN-HSIN LEE

IPC: H03K17/96

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

公开(公告)号：US20150070238A1

公开(公告)日：2015-03-12

申请号：US14268082

申请日：2014-05-02

Applicant: L. Pierre de Rochemont

Inventor： L. Pierre de Rochemont

IPC: H01Q9/04

CPC classification number: H01Q9/0414 ,  B82Y30/00 ,  C04B2235/768 ,  C04B2235/781 ,  H01C7/003 ,  H01C17/003 ,  H01C17/06533 ,  H01G4/10 ,  H01G4/1209 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01037 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q15/0086 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/207 ,  H05K2201/017 ,  H05K2201/0175 ,  H05K2201/09763 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/121 ,  Y10T428/12493

Abstract: An electrical component provides a ceramic element located on or in a dielectric substrate between and in contact with a pair of electrical conductors, wherein the ceramic element includes one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.5 mol % throughout the ceramic element. A method of fabricating an electrical component, provides or forming a ceramic element between and in contact with a pair of electrical conductors on a substrate including depositing a mixture of metalorganic precursors and causing simultaneous decomposition of the metal oxide precursors to form the ceramic element including one or more metal oxides.

Abstract translation: 电气部件提供位于电介质基板上或介质基板之间的陶瓷元件，其与一对电导体接触并接触，其中陶瓷元件包括一种或多种具有小于或等于1.5摩尔的金属 - 氧化物组成均匀性波动的金属氧化物 ％整个陶瓷元件。 一种制造电气部件的方法，在衬底上提供或形成与一对电导体接触的陶瓷元件，包括沉积金属有机前体的混合物并引起金属氧化物前体的同时分解以形成陶瓷元件，包括一个 或更多的金属氧化物。

公开(公告)号：US08729910B2

公开(公告)日：2014-05-20

申请号：US12718068

申请日：2010-03-05

Applicant: Kai Meng ,  Lien-Hsin Lee

Inventor： Kai Meng ,  Lien-Hsin Lee

IPC: G01R27/26

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: The invention discloses a method of fabricating a capacitance touch panel module. The method includes providing a substrate with a touching area and a peripheral area; forming a plurality of first conductive patterns on the substrate along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covers one connecting portion; forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

Abstract translation: 本发明公开了一种电容触摸面板模块的制造方法。 该方法包括提供具有接触区域和周边区域的基板; 沿着第一取向在所述基板上形成多个第一导电图案，沿着第二取向形成多个第二导电图案，以及在所述接触区域中形成多个连接部分; 形成多个绝缘突起，其中每个绝缘突起覆盖一个连接部分; 在周边区域形成绝缘框架; 以及在每个绝缘突起上形成桥接构件。

公开(公告)号：US20130271992A1

公开(公告)日：2013-10-17

申请号：US13882529

申请日：2011-08-25

Applicant: Hyo Tae Kim ,  Gi Seok Song ,  Heung Soon Kim

Inventor： Hyo Tae Kim ,  Gi Seok Song ,  Heung Soon Kim

IPC: F21V29/00

CPC classification number: H01L33/64 ,  H01L33/648 ,  H05K1/0203 ,  H05K1/053 ,  H05K2201/017 ,  H05K2201/064 ,  H05K2201/10106 ,  H05K2201/10969

Abstract: The present invention provides an LED array module having an improved heat-dissipating effect, and a manufacturing method thereof. To this end, an LED array module includes one or more LED unit modules, the LED unit module comprising: an LED; a heat conductive heat-dissipating slug attached to the lower portion of the LED; and leads connected to the cathode and anode of the LED, respectively, wherein the LED array module comprises: a heat-dissipating plate; a heat conductive solder layer disposed and bonded between the upper surface of the heat-dissipating plate and the lower surface of the heat-dissipating slug; a first insulating layer formed on the upper surface of the heat-dissipating plate; and array electrodes which are formed on the upper surface of the insulating layer and are electrically connected to the leads to drive the LED.

Abstract translation: 本发明提供一种具有改善的散热效果的LED阵列模块及其制造方法。 为此，LED阵列模块包括一个或多个LED单元模块，该LED单元模块包括：LED; 连接到LED的下部的导热散热块; 以及分别连接到LED的阴极和阳极的引线，其中LED阵列模块包括：散热板; 散热板的上表面和散热块的下表面之间设置并结合的导热焊料层; 形成在散热板的上表面上的第一绝缘层; 以及阵列电极，其形成在绝缘层的上表面上并且电连接到引线以驱动LED。

公开(公告)号：US08541805B2

公开(公告)日：2013-09-24

申请号：US13582330

申请日：2011-04-27

Applicant: Atsushi Motoya ,  Kazuyuki Okano ,  Minako Akai ,  Yurika Goto ,  Naoki Tagami ,  Makoto Horiuchi ,  Toshio Mori ,  Takaari Uemoto ,  Masahiro Miki

Inventor： Atsushi Motoya ,  Kazuyuki Okano ,  Minako Akai ,  Yurika Goto ,  Naoki Tagami ,  Makoto Horiuchi ,  Toshio Mori ,  Takaari Uemoto ,  Masahiro Miki

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  F21K9/23 ,  F21V3/00 ,  F21V7/22 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/09701 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/017 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/263 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips.

Abstract translation: 本发明的目的是提供一种可以充分提高LED灯的发光效率的安装基板，制造方法，发光模块和照明装置。 根据本发明的安装基板包括基板和反射膜，所述基板和反射膜形成在基板的前表面上并且具有要安装LED芯片的正面，反射膜由金属氧化物微粒制成， 玻璃料，并且反射来自LED芯片的光。

公开(公告)号：US08441796B2

公开(公告)日：2013-05-14

申请号：US11795276

申请日：2006-01-16

Applicant: Robert Morse

Inventor： Robert Morse

IPC: H05K7/20

CPC classification number: C25D11/04 ,  C25D11/026 ,  H01L2924/0002 ,  H05K1/053 ,  H05K1/095 ,  H05K3/06 ,  H05K3/108 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4664 ,  H05K3/4685 ,  H05K2201/017 ,  H05K2201/10166 ,  H05K2201/10575 ,  H05K2203/0315 ,  H05K2203/095 ,  H05K2203/121 ,  H01L2924/00

Abstract: An electrical power substrate comprises a metallic body at least one surface of the body having a coating generated by plasma electrolytic oxidation (PEO). The coating includes a dense hard layer adjacent the said surface of the metallic body, and a porous outer layer. Electrically conductive elements are attached to the said coating.

Abstract translation: 电力基板包括金属体，主体的至少一个表面具有由等离子体电解氧化（PEO）产生的涂层。 涂层包括邻近金属体的所述表面的致密硬质层和多孔外层。 导电元件附着在所述涂层上。

公开(公告)号：US20130004779A1

公开(公告)日：2013-01-03

申请号：US13387681

申请日：2011-03-23

Applicant: Ryokichi Ogata

Inventor： Ryokichi Ogata

IPC: B32B15/04 ,  C03C17/02 ,  C03B23/20 ,  C03C17/10

CPC classification number: H01L33/60 ,  H01L23/3677 ,  H01L24/73 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0306 ,  H05K2201/017 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method for manufacturing a light-emitting-element mounting substrate includes a step of applying a glass paste using powder of a glass material having a softening point higher than a softening point of a glass component contained in a glass-ceramic green sheet and lower than a melting point of silver so as to cover a conductor paste which is applied to a main surface of the glass-ceramic green sheet and consists of or consists primarily of silver; and a step of coating a metal layer obtained by heating them and sintering the conductor paste, with a transparent glass layer obtained by melting and then cooling the glass paste. By using the glass paste, the reaction of silver in the conductor paste with the glass component in the glass paste upon heating is suppressed, and the metal layer can be coated with the glass layer having high transparency.

Abstract translation: 发光元件安装基板的制造方法包括使用软化点高于玻璃陶瓷生片中所含的玻璃成分的软化点的玻璃材料的粉末涂布玻璃浆料的步骤， 银的熔点，以覆盖施加到玻璃 - 陶瓷生片的主表面并由银构成或主要由银组成的导体糊料; 以及通过对通过熔化然后冷却玻璃浆料而获得的透明玻璃层来涂覆通过加热并烧结导体糊而获得的金属层的步骤。 通过使用玻璃糊，可以抑制导体糊中的银与加热时玻璃糊中的玻璃成分的反应，并且金属层可以被具有高透明性的玻璃层涂覆。