公开(公告)号：US20060273876A1

公开(公告)日：2006-12-07

申请号：US11144238

申请日：2005-06-02

Applicant: Timothy Pachla ,  Stephen Whitney

Inventor： Timothy Pachla ,  Stephen Whitney

IPC: H01H61/06 ,  H01H71/18

CPC classification number: H05K1/0201 ,  H05K2201/0308 ,  H05K2203/175

Abstract: Over-temperature protection devices, over-temperature applications on substrates, such as printed circuit boards, and over-temperature protection circuits, e.g., over-temperature protection in combination with a fuse or heater are provided. In various embodiments a shape memory alloy member is used, which can either break electrical contact with a conductor (open a circuit) or make electrical contact with a conductor (close a circuit). Upon opening a first circuit, the member can move to contact another conductor and complete a second circuit. The member can close a circuit, which is in parallel with a fused load, to provide a short circuit path that opens a fuse upon an over-temperature condition occurring, e.g., within an electrical device such as a cell phone or battery. Or, the member can be provided in parallel with a heater that energizes upon an overcurrent condition, triggering the member to open a circuit.

Abstract translation: 提供过温保护装置，诸如印刷电路板的衬底上的过温应用以及过温保护电路，例如与保险丝或加热器组合的过温保护。 在各种实施例中，使用形状记忆合金构件，其可以断开与导体的电接触（打开电路）或者与导体（闭合电路）进行电接触。 在打开第一电路时，构件可以移动以接触另一导体并完成第二电路。 该构件可以闭合与熔融负载并联的电路，以提供短路路径，该短路路径在例如在诸如手机或电池的电气装置内发生的过温状态下打开熔断器。 或者，该构件可以与加热器并联设置，该加热器在过电流状态下通电，触发构件打开电路。

公开(公告)号：US06655990B2

公开(公告)日：2003-12-02

申请号：US09557251

申请日：2000-04-24

Applicant: Hideaki Terauchi ,  Fumio Aoki ,  Kazuhiko Ota ,  Yasuhiro Teshima

Inventor： Hideaki Terauchi ,  Fumio Aoki ,  Kazuhiko Ota ,  Yasuhiro Teshima

IPC: H01R1360

CPC classification number: H01R12/7058 ,  H01R12/7023 ,  H01R12/7047 ,  H01R12/707 ,  H01R12/716 ,  H05K3/303 ,  H05K3/306 ,  H05K7/12 ,  H05K2201/0308 ,  H05K2201/10189 ,  H05K2201/10598 ,  Y02P70/613 ,  Y10S439/943 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is removed from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.

公开(公告)号：US5925298A

公开(公告)日：1999-07-20

申请号：US494509

申请日：1995-06-26

Applicant: Bethany Joy Walles ,  Michael George Todd ,  Robert Edward Belke, Jr.

Inventor： Bethany Joy Walles ,  Michael George Todd ,  Robert Edward Belke, Jr.

IPC: B29C53/06 ,  B29C61/00 ,  H05K3/00 ,  B32B31/00 ,  B28B7/30 ,  B29C37/02 ,  B29C41/00

CPC classification number: B29C53/063 ,  H05K3/0014 ,  B29C61/006 ,  H05K2201/0308 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10S264/04 ,  Y10S264/66

Abstract: A method and apparatus for forming a rigid circuit board has a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has a clamping member and a stationary member. The clamping member uses a shape memory alloy actuator with a transition temperature about the same as the glass transition temperature of the laminate. The actuator is used to form the bend region to a predetermined shape around the stationary member. When the circuit board is cooled, the circuit board again becomes rigid in its predetermined shape.

Abstract translation: 用于形成刚性电路板的方法和装置具有在弯曲区域中具有减小的厚度的电路板。 弯曲区域可以具有多层层压体和导电材料。 电路板被加热到允许电路板变得柔性的玻璃化转变温度。 该装置具有夹紧构件和固定构件。 夹紧构件使用形状记忆合金致动器，其转变温度与层叠体的玻璃化转变温度大致相同。 致动器用于将弯曲区域形成为围绕固定构件的预定形状。 当电路板被冷却时，电路板再次变成其预定形状的刚性。

公开(公告)号：US5067007A

公开(公告)日：1991-11-19

申请号：US645357

申请日：1991-01-24

Applicant: Kanji Otsuka ,  Masao Kato ,  Takashi Kumagai ,  Mitsuo Usami ,  Shigeo Kuroda ,  Kunizo Sahara ,  Takeo Yamada ,  Seiji Miyamoto ,  Yuuji Shirai ,  Takayuki Okinaga ,  Kazutoshi Kubo ,  Hiroshi Tachi ,  Masayuki Kawashima

Inventor： Kanji Otsuka ,  Masao Kato ,  Takashi Kumagai ,  Mitsuo Usami ,  Shigeo Kuroda ,  Kunizo Sahara ,  Takeo Yamada ,  Seiji Miyamoto ,  Yuuji Shirai ,  Takayuki Okinaga ,  Kazutoshi Kubo ,  Hiroshi Tachi ,  Masayuki Kawashima

IPC: H01L23/50 ,  H01L23/433 ,  H01L23/495 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L23/49555 ,  H01L23/433 ,  H01L23/49579 ,  H01L23/49811 ,  H05K3/3426 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K2201/0308 ,  H05K2201/10318 ,  H05K2201/10681 ,  H05K2201/10704 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Attempts have been made to increase the number of pins of packages accompanying the trend toward fabricating integrated circuits highly densely and in smaller sizes. The present invention provides technology for improving reliability in fabricating packages of the surface-mounted type that have increased number of pins. That is, when the packages are mounted on the wiring substrate, the lead pins that receive load from the axial direction exhibit bending strength which is smaller than the junction strength of solder at the junction portions. To achieve this object, the lead pins are made of a material having large resiliency such as a fiber-reinforced material, a transformation pseudo elastic material, an ultra-high tension material, or a heat-resistant ultra-high tension material.

Abstract translation: 随着制造高密度和小尺寸集成电路的趋势，已经尝试增加封装引脚的数量。 本发明提供了提高具有增加的引脚数的表面安装型封装的可靠性的技术。 也就是说，当封装被安装在布线基板上时，从轴向接收负载的引线销显示出小于接合部处的焊料的接合强度的弯曲强度。 为了实现该目的，引脚由具有大弹性的材料制成，例如纤维增强材料，变形假弹性材料，超高张力材料或耐热超高张力材料。

公开(公告)号：US4857387A

公开(公告)日：1989-08-15

申请号：US113420

申请日：1987-10-27

Applicant: Eberhardt, Andre ,  Serge Dominiak ,  Marcel Berveiller ,  Jean P. Lucas ,  Robert P. Y. Guyon

Inventor： Eberhardt, Andre ,  Serge Dominiak ,  Marcel Berveiller ,  Jean P. Lucas ,  Robert P. Y. Guyon

IPC: C03C27/04 ,  C04B37/02 ,  C22F1/00 ,  H01L23/373 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K1/09 ,  C03C27/046 ,  C04B37/028 ,  C22F1/006 ,  H01L23/3733 ,  H05K1/0271 ,  C04B2237/32 ,  C04B2237/407 ,  C04B2237/706 ,  H01L2924/0002 ,  H05K2201/0308 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/12 ,  Y10T428/12028 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12507 ,  Y10T428/24917 ,  Y10T428/263 ,  Y10T428/264

Abstract: A printed circuit comprising an electrically insulating substrate and an electrically conductive layer on the substrate, this layer being a pseudo-elastic or elastically deformable alloy that undergoes significant deformations in a reversible manner and is a copper alloy containing at least 50% by weight copper in the form of large-grained polycrystals that undergo martensitic transformation. Preferably, the layer contains 60-80% by weight of copper, the large-grained polycrystals having a grain size of at least about 3 mm. The martensitic transformation takes place within the temperature range -55.degree. C. to +125.degree. C., and the layer has a thickness between 30.mu. and 200.mu., preferably about 100.mu..

Abstract translation: 一种印刷电路，其包括电绝缘基板和在基板上的导电层，该层是以可逆方式经受显着变形的假弹性或可弹性变形的合金，并且是含有至少50重量％铜的铜合金 经历马氏体转变的大晶粒多晶体的形式。 优选地，该层含有60-80重量％的铜，大颗粒多晶体具有至少约3mm的晶粒尺寸。 马氏体相变发生在-55℃〜+ 125℃的温度范围内，该层的厚度为30〜200μm，优选为100μm左右。

公开(公告)号：US11751362B2

公开(公告)日：2023-09-05

申请号：US17451833

申请日：2021-10-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John S. Werner ,  Noah Singer ,  Samuel R. Connor

IPC: H05K9/00 ,  H05K7/20 ,  H05K5/00

CPC classification number: H05K7/20836 ,  H05K5/00 ,  H05K7/20009 ,  H05K9/0009 ,  H05K9/0015 ,  H05K2201/0308

Abstract: A system and a method of providing electromagnetic compatibility (EMC) protection. A removable component is inserted into an end product. The removable component includes a retractable EMC protection apparatus. In response to the insertion of the removable component a shape memory alloy on the EMC protection apparatus is heated to a temperature above the activation temperature of the shape memory alloy. The shape memory alloy then changes from a first shape to a second shape in response to the heating. In response to the change in the shape of the shape memory alloy an EMC protection component of the EMC protection apparatus is inserted into an enclosure opening of the removable component.

公开(公告)号：US20180332701A1

公开(公告)日：2018-11-15

申请号：US16040790

申请日：2018-07-20

Applicant: International Business Machines Corporation

Inventor： Bruce J. Chamberlin ,  Scott B. King ,  Joseph Kuczynski ,  David J. Russell

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/16

CPC classification number: H05K1/0201 ,  H05K1/0263 ,  H05K1/111 ,  H05K1/16 ,  H05K1/18 ,  H05K1/182 ,  H05K1/183 ,  H05K1/186 ,  H05K3/341 ,  H05K2201/0308 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/105 ,  H05K2201/10568 ,  H05K2203/043 ,  H05K2203/175 ,  H05K2203/176

Abstract: An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.

公开(公告)号：US20180324945A1

公开(公告)日：2018-11-08

申请号：US15804265

申请日：2017-11-06

Applicant: International Business Machines Corporation

Inventor： Bruce J. Chamberlin ,  Scott B. King ,  Joseph Kuczynski ,  David J. Russell

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0293 ,  H05K1/0201 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/182 ,  H05K1/183 ,  H05K1/186 ,  H05K2201/0308

Abstract: An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component.

公开(公告)号：US09981421B2

公开(公告)日：2018-05-29

申请号：US14332412

申请日：2014-07-16

Applicant: The Boeing Company

Inventor： Jeffery L. Marcoe ,  Sahrudine Apdalhaliem ,  Moushumi Shome

IPC: H01B17/20 ,  H01B17/38 ,  H01B7/08 ,  B29C61/06 ,  B64C3/48 ,  B64C3/52 ,  B29C70/30 ,  B32B15/08 ,  F03G7/06 ,  H05K1/05 ,  H05K1/16 ,  B29C70/88 ,  B29B11/16 ,  B64C3/44 ,  B64C27/72 ,  B64C3/54 ,  B29K71/00 ,  B29K267/00 ,  B29L31/30 ,  B29C53/82

CPC classification number: B29C61/0625 ,  B29B11/16 ,  B29C53/822 ,  B29C70/30 ,  B29C70/88 ,  B29K2071/00 ,  B29K2267/00 ,  B29L2031/3085 ,  B32B15/08 ,  B32B2250/02 ,  B32B2605/18 ,  B64C3/48 ,  B64C3/52 ,  B64C2003/445 ,  B64C2003/543 ,  B64C2027/7288 ,  F03G7/065 ,  H05K1/056 ,  H05K1/165 ,  H05K2201/0129 ,  H05K2201/0308 ,  Y02T50/34 ,  Y02T50/43

Abstract: Systems and processes that integrate thermoplastic and shape memory alloy materials to form an adaptive composite structure capable of changing its shape. For example, the adaptive composite structure may be designed to serve as a multifunctional adaptive wing flight control surface. Other applications for such adaptive composite structures include in variable area fan nozzles, winglets, fairings, elevators, rudders, or other aircraft components having an aerodynamic surface whose shape is preferably controllable. The material systems can be integrated by means of overbraiding (interwoven) with tows of both thermoplastic and shape memory alloy materials or separate layers of each material can be consolidated (e.g., using induction heating) to make a flight control surface that does not require separate actuation.

公开(公告)号：US20160016355A1

公开(公告)日：2016-01-21

申请号：US14332412

申请日：2014-07-16

Applicant: The Boeing Company

Inventor： Jeffery L. Marcoe ,  Sahrudine Apdalhaliem ,  Moushumi Shome

IPC: B29C61/06 ,  H05K1/16 ,  F03G7/06 ,  H05K1/05 ,  B29C70/30 ,  B32B15/08

CPC classification number: B29C61/0625 ,  B29B11/16 ,  B29C53/822 ,  B29C70/30 ,  B29C70/88 ,  B29K2071/00 ,  B29K2267/00 ,  B29L2031/3085 ,  B32B15/08 ,  B32B2250/02 ,  B32B2605/18 ,  B64C3/48 ,  B64C3/52 ,  B64C2003/445 ,  B64C2003/543 ,  B64C2027/7288 ,  F03G7/065 ,  H05K1/056 ,  H05K1/165 ,  H05K2201/0129 ,  H05K2201/0308 ,  Y02T50/34 ,  Y02T50/43

Abstract: Systems and processes that integrate thermoplastic and shape memory alloy materials to form an adaptive composite structure capable of changing its shape. For example, the adaptive composite structure may be designed to serve as a multifunctional adaptive wing flight control surface. Other applications for such adaptive composite structures include in variable area fan nozzles, winglets, fairings, elevators, rudders, or other aircraft components having an aerodynamic surface whose shape is preferably controllable. The material systems can be integrated by means of overbraiding (interwoven) with tows of both thermoplastic and shape memory alloy materials or separate layers of each material can be consolidated (e.g., using induction heating) to make a flight control surface that does not require separate actuation.

Abstract translation: 整合热塑性和形状记忆合金材料的系统和工艺，形成能够改变其形状的自适应复合结构。 例如，自适应复合结构可以被设计为用作多功能自适应翼飞行控制表面。 用于这种自适应复合结构的其它应用包括在可变区域的风扇喷嘴，小翼，整流罩，电梯，方向舵或具有优选可控的形状的空气动力学表面的其它飞行器部件。 材料系统可以通过用热塑性塑料和形状记忆合金材料的丝束进行重叠（交织）整合，或者可以将每种材料的单独层合并（例如，使用感应加热）来制造不需要分开的飞行控制表面 致动。