公开(公告)号：US20180310406A1

公开(公告)日：2018-10-25

申请号：US15670044

申请日：2017-08-07

Applicant: Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co .,Ltd.

Inventor： MING-JAAN HO ,  XIAN-QIN HU ,  FU-YUN SHEN ,  WEN-ZHU WEI

IPC: H05K1/11 ,  H05K3/42 ,  H05K1/09 ,  H05K3/06 ,  H05K3/02

CPC classification number: H05K1/115 ,  H05K1/09 ,  H05K3/027 ,  H05K3/067 ,  H05K3/425 ,  H05K2201/0355 ,  H05K2203/0369 ,  Y10T29/49165

Abstract: A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.

公开(公告)号：US20180279482A1

公开(公告)日：2018-09-27

申请号：US15910499

申请日：2018-03-02

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Masafumi ISHII ,  Misato HONDA ,  Nobuaki MIYAMOTO

IPC: H05K3/02 ,  B32B3/26 ,  B32B15/08 ,  B32B15/20 ,  C25D7/06 ,  H05K3/20 ,  H05K3/38

CPC classification number: H05K3/025 ,  B32B3/26 ,  B32B15/08 ,  B32B15/20 ,  B32B2457/08 ,  C23C18/1653 ,  C23C18/405 ,  C25D1/04 ,  C25D3/38 ,  C25D3/562 ,  C25D3/58 ,  C25D5/022 ,  C25D5/10 ,  C25D5/18 ,  C25D5/34 ,  C25D5/48 ,  C25D7/0614 ,  C25D7/0671 ,  H05K1/09 ,  H05K3/205 ,  H05K3/384 ,  H05K3/388 ,  H05K3/389 ,  H05K3/427 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K2203/0726 ,  H05K2203/1152

Abstract: A surface-treated copper foil is capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. A resin substrate is provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil has a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm.

公开(公告)号：US10080285B2

公开(公告)日：2018-09-18

申请号：US15150234

申请日：2016-05-09

Applicant: International Business Machines Corporation

Inventor： Michael A. Christo ,  Julio A. Maldonado ,  Roger D. Weekly ,  Tingdong Zhou

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/112 ,  H05K1/0263 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/3436 ,  H05K2201/0355 ,  H05K2201/1028 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.

公开(公告)号：US20180103548A1

公开(公告)日：2018-04-12

申请号：US15839464

申请日：2017-12-12

Applicant: International Business Machines Corporation

Inventor： Brian L. Carlson ,  John R. Dangler ,  Roger S. Krabbenhoft ,  Kevin A. Splittstoesser

IPC: H05K3/26 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H01P3/02 ,  H05K3/38 ,  H05K1/02 ,  H05K3/06 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K3/26 ,  H01P3/02 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K3/06 ,  H05K3/064 ,  H05K3/382 ,  H05K3/46 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/0391 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A circuit apparatus includes at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

公开(公告)号：US20180097283A1

公开(公告)日：2018-04-05

申请号：US15567817

申请日：2015-11-09

Applicant: HANSOL TECHNICS INC.

Inventor： Jae-Ho BOO ,  Chi-Young CHOI

IPC: H01Q1/38 ,  H01Q1/24 ,  H05K1/03 ,  H05K3/06 ,  H05K3/22 ,  H05K3/40

CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H05K1/032 ,  H05K1/119 ,  H05K3/0014 ,  H05K3/06 ,  H05K3/22 ,  H05K3/4038 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09018 ,  H05K2203/0759

Abstract: Provided is a curved-type rigid board. The curved-type rigid board includes: a main sheet layer capable of maintaining a curved state with a certain curvature; a first adhesive layer formed on the main sheet layer; and a pattern forming layer bonded onto the main sheet layer by the first adhesive layer.

公开(公告)号：US09860985B1

公开(公告)日：2018-01-02

申请号：US13716726

申请日：2012-12-17

Applicant: Lockheed Martin Corporation

Inventor： Jack V. Ajoian

IPC: H05K1/11 ,  H05K3/42 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K1/115 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0222 ,  H05K1/111 ,  H05K1/112 ,  H05K1/116 ,  H05K3/3452 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0355 ,  H05K2201/096 ,  H05K2201/09809 ,  H05K2201/09854

Abstract: A system and method of isolating a layer-to-layer transition between conductors in a multilayer printed circuit board includes formation of a first ground via at least partially surrounding a first signal conductor in at least one layer of the printed circuit board and formation of a second ground via at least partially surrounding a second signal conductor in another layer of the printed circuit board. The first and second ground vias are plated with a conductive material.

公开(公告)号：US09839124B2

公开(公告)日：2017-12-05

申请号：US15015551

申请日：2016-02-04

Applicant: JX NIPPON MINING & METALS CORPORATION

Inventor： Michiya Kohiki

IPC: H05K1/09 ,  H05K3/00 ,  C25D1/04 ,  H05K3/20 ,  C25D7/06 ,  H05K3/02 ,  H05K3/40 ,  H05K3/42 ,  C25D3/04 ,  C25D3/18 ,  C25D3/38 ,  C25D3/56 ,  C25D5/14 ,  C23C18/16

CPC classification number: H05K1/09 ,  C23C18/1653 ,  C25D1/04 ,  C25D3/04 ,  C25D3/18 ,  C25D3/38 ,  C25D3/562 ,  C25D5/14 ,  C25D7/0614 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/421 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/0726

Abstract: Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.

公开(公告)号：US20170303405A1

公开(公告)日：2017-10-19

申请号：US15486899

申请日：2017-04-13

Applicant: JX NIPPON MINING & METALS CORPORATION

Inventor： RYO FUKUCHI

IPC: H05K3/46 ,  B32B27/06 ,  B32B37/14 ,  H05K1/02 ,  B32B15/08 ,  H05K1/09 ,  B32B38/10 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K3/4652 ,  B32B15/08 ,  B32B27/06 ,  B32B37/14 ,  B32B38/10 ,  B32B2457/08 ,  H05K1/0237 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0026 ,  H05K3/022 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2201/09209 ,  H05K2203/107

Abstract: To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable.A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.

公开(公告)号：US09769933B2

公开(公告)日：2017-09-19

申请号：US14514819

申请日：2014-10-15

Applicant: Hitachi Metals, Ltd.

Inventor： Hideyuki Sagawa ,  Keisuke Fujito ,  Takayuki Tsuji ,  Kotaro Tanaka ,  Hiromitsu Kuroda

IPC: H05K1/09 ,  H05K3/10 ,  H05K3/28 ,  H05K3/06 ,  H05K3/24

CPC classification number: H05K3/282 ,  H05K3/06 ,  H05K3/244 ,  H05K2201/0341 ,  H05K2201/0355 ,  H05K2203/0315 ,  H05K2203/087 ,  Y10T29/49162

Abstract: A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than the copper.

公开(公告)号：US09756730B2

公开(公告)日：2017-09-05

申请号：US13883154

申请日：2011-10-21

Applicant: Andreas Steffen Klein ,  Eckhard Ditzel ,  Frank Krüger ,  Michael Schumann

Inventor： Andreas Steffen Klein ,  Eckhard Ditzel ,  Frank Krüger ,  Michael Schumann

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/36 ,  H01L33/60 ,  H01L23/00 ,  H05K3/00 ,  H01L33/48 ,  H05K3/40

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/36 ,  H01L24/32 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/29339 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8384 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/00 ,  H05K3/4084 ,  H05K2201/0355 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0278 ,  H05K2203/049 ,  H05K2203/063 ,  H05K2203/1484 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator.