公开(公告)号：US08988890B2

公开(公告)日：2015-03-24

申请号：US13598308

申请日：2012-08-29

Applicant: Michael B. Wittenberg ,  Jared M. Kole ,  Sawyer I. Cohen ,  Shayan Malek

Inventor： Michael B. Wittenberg ,  Jared M. Kole ,  Sawyer I. Cohen ,  Shayan Malek

IPC: H05K7/00

CPC classification number: H05K3/341 ,  H05K3/0052 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/1031 ,  H05K2201/1034 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.

Abstract translation: 组件可以使用焊料安装到印刷电路基板上。 分离的支撑片可以可拆卸地连接到部件，并且可以有助于防止在回流操作期间部件移动或翻倒。 部件和分离支撑片可以由金属片形成。 将组件连接到分离支撑片的接口可以是穿孔的或半剪切的，以允许分离支撑片在回流操作之后容易地与部件分离。 分离式支撑片可以在回流操作期间通过将分离支撑片机械地联接到固定装置或通过将分离的支撑片安装到印刷电路板的面板的未使用部分来固定到位。 分离的支撑片可以机械耦合在印刷电路基板上的两个部件之间，并且可以用于在回流操作期间保持部件之间的距离。

公开(公告)号：US08966746B2

公开(公告)日：2015-03-03

申请号：US13064847

申请日：2011-04-20

Applicant: Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

Inventor： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC: H05K3/30 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/162 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric layer, placed between the two conductive layers, the method including: removing an upper conductive layer and the first dielectric layer excluding a lower conductive layer of the two conductive layers to allow a cavity to be formed between the two conductive layers, the lower conductive layer being supposed to be used as any one of electrodes of the cavity capacitor; stacking a dielectric material on the cavity to allow a second dielectric layer having a lower stepped portion than the first dielectric layer to be formed in the cavity; and stacking a conductive material on an upper part of the second dielectric layer and side parts of the cavity to allow the upper conductive layer to be used as the other electrode of the cavity capacitor.

Abstract translation: 一种嵌入在印刷电路板中的空腔电容器的方法，包括分别用作功率层和接地层的两个导电层和放置在两个导电层之间的第一介电层，所述方法包括： 上导电层和除了两个导电层的下导电层之外的第一电介质层，以允许在两个导电层之间形成腔，下导电层假定用作空腔电容器的任一电极; 在所述空腔上堆叠电介质材料以允许在所述空腔中形成具有比所述第一电介质层更低的台阶部分的第二电介质层; 并且在第二电介质层的上部和空腔的侧部上堆叠导电材料，以允许上部导电层用作空腔电容器的另一个电极。

公开(公告)号：US20150053465A1

公开(公告)日：2015-02-26

申请号：US14517672

申请日：2014-10-17

Applicant: Honeywell International Inc.

Inventor： Daniel Youngner ,  Son Thai Lu ,  Helen Chanhvongsak ,  Lisa Lust ,  Douglas Carlson

IPC: H05K3/46 ,  H05K3/30 ,  H05K3/06 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4644 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/167 ,  H05K3/0058 ,  H05K3/06 ,  H05K3/061 ,  H05K3/24 ,  H05K3/30 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4682 ,  H05K2201/0104 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2201/0394 ,  H05K2203/016 ,  H05K2203/0165 ,  H05K2203/0271

Abstract: An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric may be held in a fixture for fabrication like that of integrated circuits. The metal may be patterned and have components attached. More layers of dielectric and patterned metal may be added to the flexible circuit. Also bond pads and connecting vias may be fabricated in the flexible circuit. The flexible circuit may be cut into a plurality of smaller flexible circuits.

公开(公告)号：US20150027766A1

公开(公告)日：2015-01-29

申请号：US14326193

申请日：2014-07-08

Applicant: CANON KABUSHIKI KAISHA

Inventor： Satoshi Ogawara

IPC: H05K1/16 ,  G03G15/00

CPC classification number: G03G15/80 ,  G03G21/1652 ,  H05K1/0254 ,  H05K1/0269 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10363

Abstract: A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion.

Abstract translation: 一种印刷电路板，包括：通过焊料在其上安装部件的基板; 以及具有焊接在所述基板上的焊接部分的接触板，所述接触板被构造成与所述基板要附接的装置的接触部接触，其中所述焊接部分被焊接在所述基板的表面上 与其上安装有部件的基板的表面相对，并且其中接触板具有抑制部分，该抑制部分被配置为抑制焊料焊剂与接触板与接触部分接触的部分的粘附， 所述抑制部分使得所述焊剂从所述焊接部分流向比从所述焊接部分到所述部分的直线距离长的部分。

公开(公告)号：US20140353007A1

公开(公告)日：2014-12-04

申请号：US14283612

申请日：2014-05-21

Applicant: NITTO DENKO CORPORATION

Inventor： Kouji ICHINOSE ,  Jun ISHII ,  Yoshito FUJIMURA

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K1/118 ,  H05K1/0271 ,  H05K1/05 ,  H05K3/0082 ,  H05K3/32 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/2009 ,  H05K2203/0285 ,  H05K2203/308

Abstract: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction.

Abstract translation: 布线电路板包括金属支撑层，第一绝缘层，导电图案和第二绝缘层。 第一和第二绝缘层包括露出导电图案的两个表面的第一和第二开口。 导电图案的另一侧的表面在厚度方向上通过第一开口露出并被构造为第一端子部分，并且其厚度方向的一侧的表面通过第二开口露出， 作为第二终端部分。 金属支撑层包括第三开口，其暴露第一绝缘层的第一端子部分和覆盖导电图案的覆盖部分，该第一绝缘层覆盖连接到第一端子部分的导电图案，以及加强部分，位于覆盖物的另一侧的表面上 部分厚度方向。

公开(公告)号：US20140205864A1

公开(公告)日：2014-07-24

申请号：US14019486

申请日：2013-09-05

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Sang-Il Yi ,  Moon-Gil Kang

IPC: H01M2/34

CPC classification number: H01M2/34 ,  H01M2/105 ,  H01M2/204 ,  H01M10/425 ,  H05K3/3426 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/10037 ,  H05K2201/1031 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10916 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613

Abstract: A rechargeable battery pack includes a plurality of battery cells, a connection tab electrically coupled to one or more terminals of the battery cells, a connection plate electrically coupled to the connection tab, and having an opening for accommodating a protruding portion of the connection tab, and a protective circuit module electrically coupled to the connection plate, and having a combination groove, wherein the connection plate is on a first surface of the protective circuit module to face the combination groove, and wherein the first surface of the protective circuit module faces the connection tab.

Abstract translation: 可再充电电池组包括多个电池单元，电连接到电池单元的一个或多个端子的连接凸片，电连接到连接凸片的连接板，并具有用于容纳连接凸片的突出部分的开口， 以及保护电路模块，电连接到所述连接板，并且具有组合凹槽，其中所述连接板位于所述保护电路模块的面对所述组合凹槽的第一表面上，并且其中所述保护电路模块的第一表面面向 连接标签。

公开(公告)号：US20140144680A1

公开(公告)日：2014-05-29

申请号：US14086445

申请日：2013-11-21

Applicant: NITTO DENKO CORPORATION

Inventor： Tomoaki OKUNO ,  Saori KANEZAKI ,  Tsuyoshi OGURO ,  Takeshi KAWAKAMI

IPC: H05K3/44 ,  H05K1/05 ,  H05K1/02

CPC classification number: H05K1/0271 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0281 ,  H05K1/05 ,  H05K1/056 ,  H05K1/09 ,  H05K1/117 ,  H05K2201/0154 ,  H05K2201/0394 ,  Y10T29/49155

Abstract: A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction.

Abstract translation: 制造布线电路基板的方法包括：制备金属支撑层的第一步骤，在金属支撑层的厚度方向的一侧上形成具有第一开口的绝缘层和多个第一开口的第二步骤 的第三步骤，在所述绝缘层的厚度方向的一侧形成具有多个端子部分的导电层，所述多个端子部分对应于所述多个端子形成部分，第四步骤，部分地去除所述金属 支撑层以形成第二开口和设置在所述多个端子形成部之间的至少一个加强金属支撑部，以及第五步骤，去除从所述第二开口露出的所述多个端子形成部，以暴露所述多个端子形成部的两个侧表面 端子部分在厚度方向上。

公开(公告)号：US20140063769A1

公开(公告)日：2014-03-06

申请号：US13598308

申请日：2012-08-29

Applicant: Michael B. Wittenberg ,  Jared M. Kole ,  Sawyer I. Cohen ,  Shayan Malek

Inventor： Michael B. Wittenberg ,  Jared M. Kole ,  Sawyer I. Cohen ,  Shayan Malek

IPC: H05K3/34 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K3/341 ,  H05K3/0052 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/1031 ,  H05K2201/1034 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.

Abstract translation: 组件可以使用焊料安装到印刷电路基板上。 分离的支撑片可以可拆卸地连接到部件，并且可以有助于防止在回流操作期间部件移动或翻倒。 部件和分离支撑片可以由金属片形成。 将组件连接到分离支撑片的接口可以是穿孔的或半剪切的，以允许分离支撑片在回流操作之后容易地与部件分离。 分离式支撑片可以在回流操作期间通过将分离支撑片机械地联接到固定装置或通过将分离的支撑片安装到印刷电路板的面板的未使用部分来固定到位。 分离的支撑片可以机械耦合在印刷电路基板上的两个部件之间，并且可以用于在回流操作期间保持部件之间的距离。

公开(公告)号：US08624121B2

公开(公告)日：2014-01-07

申请号：US13114693

申请日：2011-05-24

Applicant: Ayao Niki

Inventor： Ayao Niki

IPC: H05K1/00

CPC classification number: H05K1/115 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes.

Abstract translation: 多层印刷线路板包括一个或多个具有通孔的树脂层和具有通孔的芯层。 在一个或多个树脂层中形成的通孔在与芯层中形成的通路孔打开的方向相反的方向上开口。 一种制造多层印刷线路板的方法包括制备单面或双面覆铜层压板的步骤; 通过加工覆铜层压板来形成焊盘的步骤; 在覆铜层压板的上表面上形成树脂层的步骤，在树脂层中形成通孔的开口，然后形成通孔; 以及在覆铜层压板的下表面中形成用于通孔的开口，然后形成通孔的步骤。

公开(公告)号：US08618669B2

公开(公告)日：2013-12-31

申请号：US12174212

申请日：2008-07-16

Applicant: Toru Furuta

Inventor： Toru Furuta

IPC: H01L23/52

CPC classification number: H05K1/186 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/113 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A combination substrate includes a first substrate having multiple wiring board mounting pads for installing a printed wiring board and multiple connection pads on the opposite side of the wiring board mounting pads, a second substrate having multiple package substrate mounting pads for loading one or more package substrates and multiple connection pads on the opposite side of the package substrate mounting pads, a resin component filling a space between the first substrate and the second substrate, and multiple component loading pads positioned to load an electronic component between the first substrate and the second substrate and formed on one of the first substrate and the second substrate. The connection pads of the second substrate are electrically connected to the connection pads of the first substrate.

Abstract translation: 组合基板包括具有用于安装印刷线路板的多个布线板安装焊盘和在布线板安装焊盘的相对侧上的多个连接焊盘的第一基板，具有用于装载一个或多个封装基板的多个封装基板安装焊盘的第二基板 以及在所述封装衬底安装衬垫的相对侧上的多个连接焊盘，填充所述第一衬底和所述第二衬底之间的空间的树脂部件以及被定位成在所述第一衬底和所述第二衬底之间加载电子部件的多个部件装载垫，以及 形成在第一基板和第二基板中的一个上。 第二基板的连接焊盘电连接到第一基板的连接焊盘。