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公开(公告)号：US20240064900A1
公开(公告)日：2024-02-22
申请号：US18260485
申请日：2021-12-23
Applicant: SONY GROUP CORPORATION
Inventor： KANAHIRO SHIROTA , KEIICHI HIRANO
CPC classification number: H05K1/148 , H01R12/722 , H01R12/73 , H01R12/716 , H05K2201/10189 , H05K2201/042
Abstract: There is provided a multilayer electronic substrate that is reduced in size and thickness while reducing stress applied to a connector. The multilayer electronic substrate includes: a first substrate; a second substrate placed on the first substrate such that surfaces of the first and second substrates face each other; a first connector mounted on the surface of the first substrate and electrically connected to a first wire of the first substrate; a second connector mounted on the surface of the second substrate and electrically connected to a first wire of the second substrate, the second connector being directly connected to the first connector; and a wiring member having flexibility, the wiring member having one end electrically connected to a second wire of the first substrate and another end electrically connected to a second wire of the second substrate, to electrically connect the second wire of the first substrate and the second wire of the second substrate.
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公开(公告)号：US11889626B2
公开(公告)日：2024-01-30
申请号：US17679735
申请日：2022-02-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyungho Lee , Yunoh Chi
CPC classification number: H05K1/144 , H05K1/113 , H05K3/0047 , H05K2201/042 , H05K2201/09027 , H05K2201/09063 , H05K2201/09072 , H05K2201/10378
Abstract: An electronic device is provided. The electronic device comprises an interposer disposed between first circuit board and second circuit board, and including an opening area and for accommodating the at least one electronic component, and the interposer comprises a board including an inner surface that faces the opening area and an outer surface that faces an opposite direction to the inner surface, wherein the outer surface is formed in a convexo-concave form having a plurality of first concave areas and a plurality of first concave areas, and a side conductive member disposed on the first concave areas and the first concave areas of the outer surface, and formed along the convexo-concave form of the outer surface.
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公开(公告)号：US20230413441A1
公开(公告)日：2023-12-21
申请号：US18455782
申请日：2023-08-25
Applicant: Unimicron Technology Corporation
Inventor： CHING-HO HSIEH , MING-HSING WU , KUEI-SHENG WU
CPC classification number: H05K1/144 , H05K1/028 , H01R12/79 , H05K2201/09063 , H05K2201/042 , H05K2201/2018 , H05K2201/10189
Abstract: A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.
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公开(公告)号：US20230354555A1
公开(公告)日：2023-11-02
申请号：US18246195
申请日：2021-07-30
Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
Inventor： Shun TAKAMIZAWA , Shigeki YAMANE
CPC classification number: H05K7/2039 , H05K1/144 , H05K1/181 , H05K2201/042
Abstract: A board unit includes: a board stack including a first circuit board and a second circuit board that are supported while being spaced apart from each other; an electronic component mounted on the first circuit board; a first heat dissipation member that covers the board stack from outside of the first circuit board; a second heat dissipation member that covers the board stack from outside of the second circuit board; a first heat transfer portion that thermally connects the electronic component and the first heat transfer portion; and a second heat transfer portion that thermally connects the electronic component and the second circuit board. The electronic component has a body located between the first circuit board and the second circuit board, and the second heat transfer portion is partially provided at a position that corresponds to the body of the electronic component.
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公开(公告)号：US20230354536A1
公开(公告)日：2023-11-02
申请号：US18348655
申请日：2023-07-07
Applicant: KIOXIA CORPORATION
Inventor： Akitoshi SUZUKI
CPC classification number: H05K5/0269 , H05K7/20472 , G06F3/0688 , G06F1/182 , H05K2201/10159 , H05K7/20454 , H05K2201/042 , H05K1/0275
Abstract: According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.
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Patent Agency Ranking
公开(公告)号：US20230345636A1
公开(公告)日：2023-10-26
申请号：US18138029
申请日：2023-04-21
Inventor： MING-HUA DUAN , YA-NI ZHANG , HAN-YU LI
IPC: H05K1/14
CPC classification number: H05K1/144 , H05K2201/042
Abstract: A fixing auxiliary device includes a support frame, an elastic member, and a plurality of first support members. The first support member includes a first segment, a second segment, and a third segment which are connected in sequence. The third segment is detachably connected to the support frame, the first segment is configured to extend into a first component. An end of the second segment facing away from the third segment includes a first stop surface configured for stopping the first component from moving towards the support frame. The elastic member is configured to provide an elastic force to a second component to press against the support frame.
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公开(公告)号：US11785718B2
公开(公告)日：2023-10-10
申请号：US17429353
申请日：2020-03-26
Applicant: Mitsubishi Electric Corporation
Inventor： Takamichi Kono , Hitoshi Arai , Tatsuya Sakamoto
CPC classification number: H05K1/144 , H05K3/368 , H05K3/4644 , H05K2201/042
Abstract: A composite printed wiring board that allows for reflow heating for mounting electronic components using solder includes a first printed wiring board, an intermediate member, a second printed wiring board, and a bonding layer. The intermediate member is stacked on the first printed wiring board. The intermediate member has a cavity. The second printed wiring board is stacked on a surface on the opposite side to a surface opposed to the first printed wiring board in the intermediate member. The bonding layer is arranged at a bonding section between the first printed wiring board and the intermediate member and at a bonding section between the second printed wiring board and the intermediate member. The bonding layer contains high melting point metal and low melting point metal. The melting point of the bonding layer is higher than the melting point of the low melting point metal.
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公开(公告)号：US11778744B2
公开(公告)日：2023-10-03
申请号：US17549679
申请日：2021-12-13
Applicant: VIVO MOBILE COMMUNICATION CO., LTD.
Inventor： Houxun Tang
CPC classification number: H05K1/144 , H05K1/0216 , H05K2201/042
Abstract: A printed circuit board assembly and a terminal are provided. The printed circuit board assembly includes: a first printed circuit board and a second printed circuit board, where the second printed circuit board is electrically connected to the first printed circuit board through at least four solder joints; the at least four solder joints include a first solder joint, a second solder joint, a third solder joint, and a fourth solder joint, the first solder joint communicates with the second solder joint, the third solder joint communicates with the fourth solder joint, and at least one solder joint and/or at least one printed circuit board cavity is provided between the second solder joint and the third solder joint; and the printed circuit board cavity is a recess structure that is recessed inwards from a surface of the printed circuit board.
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公开(公告)号：US11768396B1
公开(公告)日：2023-09-26
申请号：US17932107
申请日：2022-09-14
Applicant: Chyng Hong Electronic Co., Ltd.
Inventor： Mu-Chun Lin
IPC: G02F1/1333 , H05K1/14
CPC classification number: G02F1/13338 , G02F1/133308 , H05K1/144 , H05K2201/042 , H05K2201/10136
Abstract: A human-machine interface module structure includes a circuit module, a retaining seat, and a liquid crystal panel. The circuit module is fixedly connected to a frame. The circuit module includes a first circuit board and a second circuit board that are stacked in parallel. The first circuit board is fixedly connected to an inner side of the frame. The second circuit board is located behind the first circuit board. The first circuit board is electrically connected to the second circuit board. The retaining seat is parallel with and connected to the first circuit board. A front of the retaining seat has an accommodating space. The liquid crystal panel is accommodated in the accommodating space. The liquid crystal panel is electrically connected to the first circuit board through a flat flexible cable. The human-machine interface module structure is small in size and is easy to assemble and durable.
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公开(公告)号：US20230247765A1
公开(公告)日：2023-08-03
申请号：US18128263
申请日：2023-03-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keiichi ICHIKAWA
CPC classification number: H05K1/144 , H01Q1/2283 , H01Q21/06 , H01Q9/0407 , H05K2201/042 , H05K2201/10098 , H01L2224/16227 , H01L24/16
Abstract: A first board body includes a first board body upper main surface and a first board body lower main surface that are arranged in a vertical direction. A second board body includes a second board body upper main surface and a second board body lower main surface that are arranged in the vertical direction. The second board body is above the first board body such that the first board body upper main surface and the second board body lower main surface face each other. A semiconductor element is mounted on the first board body lower main surface. An antenna is provided on the second board body. A thickness of a metal plate is larger than a thickness of a first conductor pattern. The metal plate is surface-joined to the first board body upper main surface to overlap the semiconductor element.
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