公开(公告)号：US09923107B2

公开(公告)日：2018-03-20

申请号：US14795653

申请日：2015-07-09

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Kazumasa Toya ,  Takashi Iwasaki ,  Youichi Nagai ,  Koji Mori ,  Kenji Saito ,  Rui Mikami

IPC: H01L31/042 ,  H01L31/0392 ,  H02S40/34 ,  H05K3/30 ,  H01L31/05 ,  H02S40/22 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L31/03926 ,  H01L31/02013 ,  H01L31/0508 ,  H01L31/0543 ,  H02S20/32 ,  H02S30/10 ,  H02S40/22 ,  H02S40/34 ,  H02S40/42 ,  H05K1/0204 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/142 ,  H05K1/144 ,  H05K1/189 ,  H05K3/301 ,  H05K2201/046 ,  H05K2201/049 ,  H05K2201/09263 ,  H05K2201/10121 ,  H05K2201/10143 ,  Y02E10/52

Abstract: A photovoltaic module includes: a flexible printed circuit; and a plurality of power generating elements mounted on the flexible printed circuit, wherein the flexible printed circuit includes a turning portion, and strip-shaped portions of the flexible printed circuit which are located on opposite sides of the turning portion are aligned so as to oppose each other.

公开(公告)号：US20180027659A1

公开(公告)日：2018-01-25

申请号：US15494672

申请日：2017-04-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Andreas Huber ,  Harald Huels ,  Stefano S. Oggioni ,  Thomas Strach ,  Thomas-Michael Winkel

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/02 ,  H05K3/00 ,  H05K1/11 ,  H05K3/34 ,  H05K1/14 ,  H05K3/18

CPC classification number: H05K1/183 ,  H01L23/49838 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06537 ,  H01L2225/06548 ,  H05K1/0219 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K3/0097 ,  H05K3/18 ,  H05K3/34 ,  H05K3/4697 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10106

Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.

公开(公告)号：US20180010739A1

公开(公告)日：2018-01-11

申请号：US15631234

申请日：2017-06-23

Applicant: CANON KABUSHIKI KAISHA

Inventor： Jun Hirabayashi

IPC: H05K1/18 ,  H01L33/48 ,  H01L33/60

CPC classification number: F21K9/238 ,  H01L33/486 ,  H01L33/60 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/0064 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/10106

Abstract: The circuit board has a surface mount LED with a lens on the circuit board. A conductive portion and remaining space in the periphery of the LED are covered with solid copper foil so that reflectance of light and a heat dissipation effect are enhanced. In addition, layer structures between the circuit board and an assembled component are the same between contact portions with the assembled component so that tilt in mounting the board is suppressed. As a result, the circuit board having mounted thereon the surface mount LED having high directivity can be accurately mounted on the assembled component, tilt of an optical axis can be suppressed, the reflectance of light from the LED can be increased, and the heat dissipation effect can be enhanced.

公开(公告)号：US09801283B2

公开(公告)日：2017-10-24

申请号：US14334688

申请日：2014-07-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto Ogawa ,  Takashi Watanabe ,  Junya Shimakawa

IPC: H05K3/00 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K3/0052 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.

公开(公告)号：US20170231085A1

公开(公告)日：2017-08-10

申请号：US15464851

申请日：2017-03-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Norio Sakai ,  Tetsuya Kanagawa

IPC: H05K1/02 ,  H05K1/18 ,  H01F27/255 ,  H05K1/16 ,  H01F27/28

CPC classification number: H05K1/0243 ,  H01F17/04 ,  H01F27/255 ,  H01F27/2823 ,  H01F27/40 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15173 ,  H05K1/113 ,  H05K1/165 ,  H05K1/181 ,  H05K3/3452 ,  H05K2201/049 ,  H05K2201/0979 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10378 ,  H01L2924/00

Abstract: A high-frequency component includes a resin layer and a high-frequency circuit provided in and on the resin layer and includes an inductor and an electronic component. The electronic component is arranged on an upper surface of the resin layer. The inductor includes first and second metal pins provided such that upper end surfaces thereof are exposed from the upper surface of the resin layer and lower end surfaces thereof are exposed from a lower surface of the resin layer. The electronic component has a first outer electrode provided at a position superposed with the upper end surface of the first metal pin in plan view and is connected to the first metal pin, and a second outer electrode provided at a position superposed with the upper end surface of the second metal pin in plan view and is connected to the second metal pin.

公开(公告)号：US20170223831A1

公开(公告)日：2017-08-03

申请号：US15010465

申请日：2016-01-29

Applicant: Peraso Technologies Inc.

Inventor： Marc SUPINSKI

IPC: H05K1/18 ,  H04B17/12 ,  G01R29/10 ,  H01Q1/38 ,  H01Q1/50

CPC classification number: H05K1/18 ,  G01R29/10 ,  H01Q1/12 ,  H01Q1/38 ,  H01Q1/50 ,  H04B17/12 ,  H04B17/17 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/10098

Abstract: A wireless communication assembly includes a first support member carrying a baseband processor and a radio processor, and defining a first mounting surface including a first pair of electrical contacts. The first support member has a first pair of electrical connections between the radio processor and the first electrical contacts. The assembly also includes a second support member carrying an antenna and defining a second mounting surface including a second pair of electrical contacts. The second support member has a second pair of electrical connections between the antenna and the second electrical contacts. The second mounting surface is configured to engage the first mounting surface to rigidly couple the first and second support members and to bring the first pair of electrical contacts into contact with the second pair of electrical contacts for electrically connecting the radio processor and the antenna via the first and second pairs of electrical connections.

公开(公告)号：US09673179B1

公开(公告)日：2017-06-06

申请号：US15214565

申请日：2016-07-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Andreas Huber ,  Harald Huels ,  Stefano S. Oggioni ,  Thomas Strach ,  Thomas-Michael Winkel

IPC: H01L25/065 ,  H01L23/498

CPC classification number: H05K1/183 ,  H01L23/49838 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06537 ,  H01L2225/06548 ,  H05K1/0219 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K3/0097 ,  H05K3/18 ,  H05K3/34 ,  H05K3/4697 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10106

Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.

公开(公告)号：US20170105283A1

公开(公告)日：2017-04-13

申请号：US15179513

申请日：2016-06-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Yoon KIM ,  Kyoung Jin JUN ,  Min Kyoung CHEON

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/141 ,  H05K1/181 ,  H05K1/189 ,  H05K3/301 ,  H05K3/3442 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/2045 ,  Y02P70/613

Abstract: An electronic component includes a body including a dielectric material and internal electrodes embedded in the dielectric material; external electrodes connected to the internal electrodes and disposed on the body; a first substrate connected to the external electrodes and disposed on one side of the body; and a second substrate connected to the first substrate and disposed on one side of the first substrate. The first and second substrates have different Young's modulus.

公开(公告)号：US20170094780A1

公开(公告)日：2017-03-30

申请号：US15230596

申请日：2016-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-woong CHO ,  Dong-keun KIM ,  Sung-woo KIM ,  Hyeong-gwon KIM ,  Ji-hoon PARK

IPC: H05K1/02 ,  H01F27/29 ,  H01F27/28 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H01F17/02 ,  H01F27/2804 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/324 ,  H01F2027/2809 ,  H05K1/0225 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/049 ,  H05K2201/1003 ,  H05K2201/10265

Abstract: A circuit board for a power supply, an electronic apparatus including the same, and an inductor device are provided. The circuit board includes a first pattern arranged on a first layer of the circuit board and including a first terminal coupled to a coil, a first layer region arranged on the first layer, the coil being disposed on the first layer region, and a second pattern arranged on a second layer of the circuit board, below the first layer. The second pattern includes a first blank region located below the first layer region, and has no conductive material arranged thereon.

公开(公告)号：US20170094773A1

公开(公告)日：2017-03-30

申请号：US15215849

申请日：2016-07-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Il-Jong SEO ,  Ogura ICHIRO ,  Myung-Sam KANG ,  Tae-Hong MIN

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0206 ,  H05K1/0207 ,  H05K1/115 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0338 ,  H05K2201/049 ,  H05K2201/06 ,  H05K2201/09536 ,  H05K2201/09609 ,  H05K2201/09645 ,  H05K2201/10674

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board may include a core layer, a metal layer disposed on the core layer, and a heat dissipation unit disposed to pass through the core layer in across a thickness of the core layer.