公开(公告)号：US20110139489A1

公开(公告)日：2011-06-16

申请号：US12772469

申请日：2010-05-03

Applicant: Hee-Soo Yoon ,  Dong-Hwan Lee ,  Kyoung-Ho Lee ,  Yoon-Dong Kim ,  Su-Bong Jang

Inventor： Hee-Soo Yoon ,  Dong-Hwan Lee ,  Kyoung-Ho Lee ,  Yoon-Dong Kim ,  Su-Bong Jang

IPC: H05K1/00

CPC classification number: H05K1/0227 ,  H05K1/0262 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09663

Abstract: A printed circuit board is disclosed. The printed circuit board in accordance with an embodiment of the present invention can include an insulation substrate, a first ground, which is formed on one surface of the insulation substrate and connected to a first power source, a second ground, which is formed on one surface of the insulation substrate and connected to a second power source, a separator, which separates the first ground from the second ground, a first signal line, which is stacked on at least one of the first ground and the second ground, and a second signal line, which is stacked on at least one of the first ground and the second ground and is adjacent to the first signal line. The separator can include a curved part, which is bent in between the first signal line and the second signal line.

Abstract translation: 公开了印刷电路板。 根据本发明的实施例的印刷电路板可以包括绝缘基板，第一接地，其形成在绝缘基板的一个表面上并连接到第一电源，第二接地形成在第一接地 绝缘基板的表面并且连接到第二电源，将第一接地与第二接地分离的隔离件，堆叠在第一接地和第二接地中的至少一个上的第一信号线，以及第二接地 信号线，其堆叠在第一接地和第二接地中的至少一个上并且与第一信号线相邻。 分离器可以包括在第一信号线和第二信号线之间弯曲的弯曲部分。

公开(公告)号：US20100263462A1

公开(公告)日：2010-10-21

申请号：US12762510

申请日：2010-04-19

Applicant: Hidehiro NAKAMURA

Inventor： Hidehiro NAKAMURA

IPC: H05K1/00 ,  G01D21/00 ,  H01R43/02

CPC classification number: H05K13/00 ,  G01D1/00 ,  G01D15/00 ,  H05K1/028 ,  H05K1/118 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/4602 ,  H05K3/4635 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09163 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2203/061 ,  H05K2203/167

Abstract: There is provided a method of manufacturing a concave connector substrate that has high connection accuracy, a low manufacturing cost, and high flexibility in design, can ensure stable repeated use, and significantly improve use convenience.A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and holds the plate-shaped connector at the connection position and a cut portion for removing a section having a shape corresponding to the guide/holding region on at least one side; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

Abstract translation: 提供了一种制造具有高连接精度，低制造成本和高设计灵活性的凹形连接器基板的方法，可以确保稳定的重复使用，并且显着提高使用方便性。 一种制造凹形连接器基板的方法包括：准备具有引导/保持区域的导向基板的步骤，该导向基板将板状连接器引导到连接位置并将板状连接器保持在连接位置， 在至少一个侧面上移除具有与所述引导/保持区域相对应的形状的部分; 在导向基板的两个表面上布置和对准两个布线基板，每个布线基板具有布线和与布线电连接的通孔连接部分，并且将粘合剂施加到引导基板的预定区域以键合 布线基板到引导基板; 将布线基板的一部分朝向引导基板的切断部的内侧弯曲并使配置在弯曲部的布线与切断部的内部压力接触的步骤; 以及去除切割部分内的部分以形成引导/保持区域的步骤。

公开(公告)号：US07811007B2

公开(公告)日：2010-10-12

申请号：US12382488

申请日：2009-03-17

Applicant: Masaki Kunii ,  Kazuya Sasaki ,  Shinichi Sakuramoto

Inventor： Masaki Kunii ,  Kazuya Sasaki ,  Shinichi Sakuramoto

IPC: G02B6/36

CPC classification number: H05K1/189 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/09318 ,  H05K2201/10121 ,  H05K2201/10969

Abstract: A single-fiber bidirectional optical transmitter/receiver includes a single-fiber bidirectional optical transmission/reception device. A circuit board has a signal processing circuit and a drive circuit configured to drive the single-fiber bidirectional optical transmission/reception device. A main housing accommodates the single-fiber bidirectional optical transmission/reception device and the circuit board. A ground part of a reception side of the single-fiber bidirectional optical transmission/reception device is electrically connected to a ground part of a transmission side of the single-fiber bidirectional optical transmission/reception device through a ground wiring pattern formed on a flexible printed board.

Abstract translation: 单纤双向光发射机/接收机包括单纤双向光发射/接收设备。 电路板具有信号处理电路和被配置为驱动单光纤双向光发送/接收装置的驱动电路。 主壳体容纳单纤双向光发射/接收装置和电路板。 单纤双向光发送接收装置的接收侧的接地部分通过形成在柔性印刷线路上的接地布线图形电连接到单纤双向光发送/接收装置的发送侧的接地部分 板。

公开(公告)号：US20100195303A1

公开(公告)日：2010-08-05

申请号：US12699716

申请日：2010-02-03

Applicant: Koji Ishikawa

Inventor： Koji Ishikawa

IPC: H01R12/16

CPC classification number: G03B17/00 ,  H01R12/59 ,  H01R12/722 ,  H05K1/0218 ,  H05K1/0245 ,  H05K1/147 ,  H05K2201/043 ,  H05K2201/0715 ,  H05K2201/09318 ,  H05K2201/10189

Abstract: An electronic apparatus includes an outer cover member, an internal structure member, first and second external connection connectors, and first and second printed circuit boards. The first printed circuit board has a first surface on which the first external connector is mounted thereon, a signal pattern of the first external connector is formed on the first surface, and a second surface. The second printed circuit board has a first surface on which the second external connector is mounted thereon, a signal pattern of the second external connector is formed on the first surface, and a second surface. Ground patterns are formed on the second surfaces of the printed circuit boards. The first and second external connectors overlap and are arranged in a space surrounded by the outer cover member and the internal structure member so that the second surfaces of the first and second printed circuit boards face each other.

Abstract translation: 电子设备包括外盖构件，内部结构构件，第一和第二外部连接连接器以及第一和第二印刷电路板。 第一印刷电路板具有其上安装有第一外部连接器的第一表面，在第一表面上形成第一外部连接器的信号图案和第二表面。 第二印刷电路板具有其上安装有第二外部连接器的第一表面，在第一表面上形成第二外部连接器的信号图案和第二表面。 在印刷电路板的第二表面上形成接地图案。 第一外部连接器和第二外部连接器重叠并且布置在由外盖构件和内部结构构件包围的空间中，使得第一和第二印刷电路板的第二表面彼此面对。

公开(公告)号：US20100180437A1

公开(公告)日：2010-07-22

申请号：US12603071

申请日：2009-10-21

Applicant: William E. McKinzie, III

Inventor： William E. McKinzie, III

IPC: H01R43/00

CPC classification number: H01P1/20 ,  H01P1/2005 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0236 ,  H05K1/0239 ,  H05K1/162 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09609 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09718 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband. Coplanar EBG structures may be integrated into power distribution networks of printed wiring boards for broadband suppression of electromagnetic noise.

Abstract translation: 用于宽带抑制印刷电路板上的噪声的混合电磁带隙（EBG）结构包括通过串联电感互连到电网中的共面贴片阵列，以及将共面贴片连接到第二导电平面的相应阵列的分流LC网络。 串联电感和并联谐振通孔的组合降低了基波阻带的截止频率。 串联电感和分流电容可以使用表面贴装元件技术或印刷迹线实现。 补片也可以通过共面耦合传输线相互连接。 可以通过在与传输线相对布置的第二导电平面中形成槽，降低截止频率并增加基带阻带的带宽来增加耦合线的偶模和奇模阻抗。 共面EBG结构可以集成到用于宽带抑制电磁噪声的印刷线路板的配电网络中。

公开(公告)号：US20100073892A1

公开(公告)日：2010-03-25

申请号：US12628778

申请日：2009-12-01

Applicant: Pascal Meier ,  Sanjay Dabral

Inventor： Pascal Meier ,  Sanjay Dabral

IPC: H05K7/02 ,  H05K3/36

CPC classification number: H05K3/4611 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/112 ,  H05K1/147 ,  H05K3/0064 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/09318 ,  H05K2201/10734 ,  Y10T29/49126

Abstract: A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract translation: 电路板可以包括第一和第二侧，在侧面之间的多个电路板层和位于相应的电路板层中的多个信号迹线。 电路板层和信号迹线可以从电路板的第一侧的第一部件连接区域延伸到电路板的第一侧的第二部件连接区域。 因此，信号迹线可以在组件连接区域之间形成通过电路板的不连续的信号路径。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：US20090324238A1

公开(公告)日：2009-12-31

申请号：US12382488

申请日：2009-03-17

Applicant: Masaki Kunii ,  Kazuya Sasaki ,  Shinichi Sakuramoto

Inventor： Masaki Kunii ,  Kazuya Sasaki ,  Shinichi Sakuramoto

IPC: H04B10/02

CPC classification number: H05K1/189 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/09318 ,  H05K2201/10121 ,  H05K2201/10969

Abstract: A single-fiber bidirectional optical transmitter/receiver includes a single-fiber bidirectional optical transmission/reception device. A circuit board has a signal processing circuit and a drive circuit configured to drive the single-fiber bidirectional optical transmission/reception device. A main housing accommodates the single-fiber bidirectional optical transmission/reception device and the circuit board. A ground part of a reception side of the single-fiber bidirectional optical transmission/reception device is electrically connected to a ground part of a transmission side of the single-fiber bidirectional optical transmission/reception device through a ground wiring pattern formed on a flexible printed board.

Abstract translation: 单纤双向光发射机/接收机包括单纤双向光发射/接收设备。 电路板具有信号处理电路和被配置为驱动单光纤双向光发送/接收装置的驱动电路。 主壳体容纳单纤双向光发射/接收装置和电路板。 单纤双向光发送接收装置的接收侧的接地部分通过形成在柔性印刷线路上的接地布线图形电连接到单纤双向光发送/接收装置的发送侧的接地部分 板。

公开(公告)号：US20090316409A1

公开(公告)日：2009-12-24

申请号：US12457803

申请日：2009-06-22

Applicant: Yu-Sik Kim ,  Woo-Sung Han

Inventor： Yu-Sik Kim ,  Woo-Sung Han

IPC: F21S4/00 ,  F21V19/00 ,  H01J9/24

CPC classification number: H05K1/0295 ,  H01L25/0753 ,  H01L2224/16225 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09318 ,  H05K2201/0949 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2203/173

Abstract: A sub-mount adapted for AC and DC operation of devices mountable thereon, the sub-mount including a base substrate including a first surface and a second surface different from the first surface, a conductive pattern on the first surface, a first pair and a second pair of first and second electrodes on the second surface, and vias extending through the base substrate between the first and second surfaces, wherein the conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the via portions connecting respective portions of the conductive pattern to respective electrodes of the first and second pair of first and second electrodes through the vias.

Abstract translation: 一种用于可安装在其上的装置的AC和DC操作的子安装座，所述子安装件包括基底基板，所述基底基板包括第一表面和与所述第一表面不同的第二表面，所述第一表面上的导电图案， 在第二表面上的第二对第一和第二电极以及在第一和第二表面之间延伸通过基底基板的通孔，其中导电图案包括第一组安装部分和沿着第一对之间的第一电路径的两个通孔部分 的第一和第二电极，以及第二组安装部分和沿着第二对电极之间的第二电气路径的两个通孔部分，所述通孔部分将导电图案的各个部分连接到第一和第二电极的相应电极 一对第一和第二电极穿过通孔。

公开(公告)号：US07626216B2

公开(公告)日：2009-12-01

申请号：US11583212

申请日：2006-10-18

Applicant: William E. McKinzie, III

Inventor： William E. McKinzie, III

IPC: H01L31/072 ,  H01L31/109 ,  H01L31/0328 ,  H01L31/0336

CPC classification number: H01P1/20 ,  H01P1/2005 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0236 ,  H05K1/0239 ,  H05K1/162 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09609 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09718 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband. Coplanar EBG structures may be integrated into power distribution networks of printed wiring boards for broadband suppression of electromagnetic noise.

Abstract translation: 用于宽带抑制印刷电路板上的噪声的混合电磁带隙（EBG）结构包括通过串联电感互连到电网中的共面贴片阵列，以及将共面贴片连接到第二导电平面的相应阵列的分流LC网络。 串联电感和并联谐振通孔的组合降低了基波阻带的截止频率。 串联电感和分流电容可以使用表面贴装元件技术或印刷迹线实现。 补片也可以通过共面耦合传输线相互连接。 可以通过在与传输线相对布置的第二导电平面中形成槽，降低截止频率并增加基带阻带的带宽来增加耦合线的偶模和奇模阻抗。 共面EBG结构可以集成到用于宽带抑制电磁噪声的印刷线路板的配电网络中。

公开(公告)号：US07626208B2

公开(公告)日：2009-12-01

申请号：US11309200

申请日：2006-07-13

Applicant: Chien-Cheng Yang ,  Chao-Kai Hsu ,  Jing-Yao Chang

Inventor： Chien-Cheng Yang ,  Chao-Kai Hsu ,  Jing-Yao Chang

IPC: H01L33/00

CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21V33/0008 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/09481 ,  H05K2201/10106 ,  H05K2201/10553 ,  H05K2203/049 ,  H01L2924/00

Abstract: A bendable LED planar light source structure, a flexible substrate therefore, and a manufacturing method thereof are provided. The flexible substrate has metal layers on both sides, where the metal layer on one side has a circuit layout, and the metal layer on the other side has a pattern structure or a whole metal coating with reflecting and scattering characteristics. Meanwhile, bonding pads are provided on the same side or opposite side as the metal layer with the circuit layout, and an array of LED dies is bonded with the bonding pads through wire bonding or flip chip bonding, such that the LED dies are conducted with current through the circuit layout on the flexible substrate, so as to form a planar light source.

Abstract translation: 提供了一种可弯曲的LED平面光源结构，因此可挠性基板及其制造方法。 柔性基板的两侧具有金属层，其一侧的金属层具有电路布局，另一侧的金属层具有具有反射和散射特性的图案结构或整体金属涂层。 同时，在具有电路布局的金属层的相同侧或相对侧上设置接合焊盘，并且通过引线接合或倒装芯片接合将LED管芯阵列与接合焊盘接合，使得LED管芯与 电流通过柔性基板上的电路布局，以形成平面光源。