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    PRINTED CIRCUIT BOARD ASSEMBLY CHIP PACKAGE COMPONENT AND SOLDERING COMPONENT
    11.
    发明申请
    PRINTED CIRCUIT BOARD ASSEMBLY CHIP PACKAGE COMPONENT AND SOLDERING COMPONENT 有权
    印刷电路板组件芯片封装组件和焊接组件

    公开(公告)号：US20120295454A1

    公开(公告)日：2012-11-22

    申请号：US13564483

    申请日：2012-08-01

    Applicant: Zhiwei Jiang ,  Xiaochen Chen ,  Zhipeng Guo

    Inventor： Zhiwei Jiang ,  Xiaochen Chen ,  Zhipeng Guo

    IPC: H01R12/51

    CPC classification number: H05K1/111 ,  H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H05K2201/09072 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/042 ,  Y02P70/611

    Abstract: A printed circuit board assembly (PCBA) chip package component includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad.

    Abstract translation: 印刷电路板组件（PCBA）芯片封装组件包括：模块板和接口板。 第一个焊盘设置在模块板的底部，第二个焊盘设置在接口板的顶部，第二个焊盘为城堡式结构。 第一焊盘包括第一焊接区域，第二焊接区域和连接第一焊接区域和第二焊接区域的连接桥。 第一焊接区域对应于第二焊盘的顶表面，并且当第一焊接区域焊接到第二焊盘时，第二焊接区域位于第二焊盘的外部。

    Processing image data
    12.
    发明申请
    Processing image data 失效
    处理图像数据

    公开(公告)号：US20090310155A1

    公开(公告)日：2009-12-17

    申请号：US12318961

    申请日：2009-01-13

    Applicant: Kwansoo Yun ,  Prasad Jvv ,  Jaewoo Joung ,  Shanghoon Seo ,  Sangdo Cho

    Inventor： Kwansoo Yun ,  Prasad Jvv ,  Jaewoo Joung ,  Shanghoon Seo ,  Sangdo Cho

    IPC: G06K1/00

    CPC classification number: H05K3/125 ,  H05K1/11 ,  H05K3/0005 ,  H05K3/0008 ,  H05K2201/0939

    Abstract: A method of obtaining image data for printing a circular pad having a radius R by forming ink blots having a radius r in an overlapping manner. The method can include: setting a base pitch as the base distance between adjacent ink blots, arranging the vector data of the pad in an x-y coordinate system, setting a first base point in the coordinate system, selecting a first determination point that is separated from the first base point by a unit distance along each of the x-axis and y-axis in any one direction of 45 degrees and 135 degrees, comparing the distance from the first base point to the first determination point with the base pitch, and storing the coordinates of the first determination point as print data if the distance from the first base point to the first determination point is greater than or equal to the base pitch.

    Abstract translation: 通过以重叠的方式形成具有半径r的油墨印迹，获得用于印刷具有半径R的圆形垫的图像数据的方法。 该方法可以包括：将基座间距设置为相邻墨迹之间的基本距离，将该垫的矢量数据排列在xy坐标系中，在坐标系中设置第一基点，选择与 第一基点以45度和135度的任何一个方向沿着x轴和y轴的每一个单位距离，将从第一基点到第一确定点的距离与基座间距进行比较，并且存储 如果从第一基点到第一确定点的距离大于或等于基本间距，则第一确定点的坐标作为打印数据。

    Circuit board and electronic equipment using the same
    14.
    发明申请
    Circuit board and electronic equipment using the same 有权
    电路板和电子设备使用相同

    公开(公告)号：US20020074164A1

    公开(公告)日：2002-06-20

    申请号：US09985727

    申请日：2001-11-06

    Applicant: NEC CORPORATION

    Inventor： Naomi Ishizuka ,  Akihito Matsumoto ,  Eiichi Kono ,  Motoji Suzuki ,  Akihiro Sato ,  Hiroshi Matsuoka ,  Masafumi Kanai

    IPC: H05K001/11 ,  H01R012/04

    CPC classification number: H05K3/3447 ,  H01R4/023 ,  H05K1/116 ,  H05K3/3463 ,  H05K2201/0939 ,  H05K2201/099

    Abstract: In a circuit board having lands 2 each of which has a through hole 4 through which a lead of an electrical part is inserted, the lead 3 and the land 2 being mounted in the circuit board by using lead-free solder 6, the width of the land 2 corresponding to the difference in radius between the land 2 and the through hole 4 is set to about 0.40 mm or more. The width of the land 2 is set to such a value that the land exfoliation due to the solidification/shrinkage of the lead-free solder 6 and the shrinkage of the circuit board in the thickness direction can be prevented. The circuit board 1 has circuit wires at least on both the surface and the back surface.

    Abstract translation: 在具有焊盘2的电路板中，每个焊盘2具有插入电气部件的引线的通孔4，引线3和焊盘2通过使用无铅焊料6安装在电路板中，宽度 对应于焊盘2和通孔4之间的半径差的焊盘2被设定为大约0.40mm或更大。 焊盘2的宽度被设定为可以防止由于无铅焊料6的凝固/收缩导致的焊盘剥离和电路板在厚度方向上的收缩的值。 电路板1至少在表面和背面都具有电路线。

    Printed circuit board
    15.
    发明授权
    Printed circuit board 失效
    印刷电路板

    公开(公告)号：US4164778A

    公开(公告)日：1979-08-14

    申请号：US816197

    申请日：1977-07-15

    Applicant: Hitoshi Sawairi ,  Fuminori Hirose ,  Kaoru Konishikawa

    Inventor： Hitoshi Sawairi ,  Fuminori Hirose ,  Kaoru Konishikawa

    IPC: H05K1/11 ,  H05K3/34 ,  H05K5/00

    CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09727 ,  H05K2201/099 ,  H05K2201/10636 ,  H05K2203/042 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A printed circuit board which is an electrically insulative substrate of synthetic resin having at least one pair of spaced electroconductive layers. An electric and/or electronic component, such as resistor or capacitor, of a type which has no lead wires extending outwardly therefrom for external electric connection, but which is constituted by a substantially cubic body having its opposed area applied with respective films or foils of electroconductive material which serve as terminal electrodes, is mounted on the substrate with the terminal electrodes soldered to the respective electroconductive layers. To this end, each of the electroconductive layers has a round portion for connection with the associated terminal electrode of the component. Each round portion has an effective surface area equal to or smaller than any of the terminal electrodes.

    Abstract translation: 一种印刷电路板，其是具有至少一对隔开的导电层的合成树脂的电绝缘基板。 电气和/或电子部件，例如电阻器或电容器，其类型不具有从外部电连接向外延伸的引线，但是由基本上立方体构成，其相对面积施加有相应的膜或箔 用作端子电极的导电材料安装在基板上，端子电极焊接到相应的导电层上。 为此，每个导电层具有用于与部件的相关联的端子电极连接的圆形部分。 每个圆形部分具有等于或小于任何端子电极的有效表面积。

    Circuit board
    17.
    发明授权
    Circuit board 有权

    公开(公告)号：US12063737B2

    公开(公告)日：2024-08-13

    申请号：US17921778

    申请日：2021-04-26

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Hae Sik Kim ,  Jee Heum Paik

    IPC: H05K1/02 ,  H04N23/68 ,  H05K1/11

    CPC classification number: H05K1/0296 ,  H04N23/687 ,  H05K1/116 ,  H05K2201/0939 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10287

    Abstract: A circuit board according to an embodiment includes an insulating layer; and a lead pattern portion disposed on the insulating layer, wherein the lead pattern portion includes: a first portion disposed on the insulating layer; and a second portion extending from one end of the first portion; wherein the first portion is disposed overlapping the insulating layer in a vertical direction, wherein the second portion is disposed in an outer region of the insulating layer and does not overlap the insulating layer; and wherein the lead pattern portion has a centerline average roughness in a range of 0.05 μm to 0.5 μm or a 10-point average roughness in a range of 1.0 μm to 5.0 μm.

    NARROW FRAME DISPLAY PANEL AND DISPLAY
    20.
    发明申请
    NARROW FRAME DISPLAY PANEL AND DISPLAY 审中-公开

    公开(公告)号：US20180338377A1

    公开(公告)日：2018-11-22

    申请号：US15543995

    申请日：2017-05-09

    Applicant: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

    Inventor： Qingcheng ZUO

    IPC: H05K1/14 ,  H05K1/11

    CPC classification number: H05K1/147 ,  G02F1/133308 ,  G02F1/13454 ,  G02F2001/13456 ,  H05K1/118 ,  H05K2201/0939 ,  H05K2201/10128

    Abstract: The embodiment of the present invention discloses a narrow frame display panel, comprising: an integrated circuit input pad, being located on a lower side of the display panel and comprising a plurality of input terminals; a flexible printed circuit bonding pad, being located on a lower edge of the display panel and below the integrated circuit input pad, and the flexible printed circuit bonding pad comprising a plurality of bonding terminals, and bonding terminals of at least one end of the flexible printed circuit bonding pad are first bonding terminals, wherein each of the first bonding terminals comprising at least one three-side bracketing structure extending outward in a horizontal direction; wires, electrically connecting the integrated circuit input pad with the flexible printed circuit bonding pad. The embodiment of the present invention further discloses a display. By utilizing the present invention, being advantageous for narrow frame design is achieved.

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