公开(公告)号：US08253430B2

公开(公告)日：2012-08-28

申请号：US12251196

申请日：2008-10-14

Applicant: Alexander Leon

Inventor： Alexander Leon

IPC: G01R31/00 ,  G01R31/02

CPC classification number: G01R1/06738 ,  G01R31/2808 ,  H05K1/0268 ,  H05K1/116 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/0545

Abstract: A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.

Abstract translation: 当探头的边缘接触测试点的焊锡墩时，使用设置在固定方向的边缘探头来探测电路板的测试点。 焊锡墩具有细长的形状。 当边缘接触焊料堆并且保持在固定取向时，边缘的长度基本上垂直于焊料堆的长度。

公开(公告)号：US08022551B2

公开(公告)日：2011-09-20

申请号：US11399856

申请日：2006-04-07

Applicant: Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

Inventor： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L29/40

CPC classification number: H01L24/13 ,  B32B15/01 ,  C22C5/02 ,  C22C9/02 ,  C22C11/06 ,  C22C13/00 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/4924 ,  H01L23/49513 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81409 ,  H01L2224/81815 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/045 ,  H05K2201/09572 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract translation: 在半导体器件和衬底之间形成的每一个接合点包括Cu的金属球或Sn的其它材料和化合物以及金属球，金属球通过化合物结合在一起。

公开(公告)号：US20100090324A1

公开(公告)日：2010-04-15

申请号：US12474429

申请日：2009-05-29

Applicant: Hye-Jin KIM

Inventor： Hye-Jin KIM

IPC: H01L23/52 ,  H01L23/48 ,  H01L23/488

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package having a solder ball having a double connection structure which reduces a total height of a package on package (POP). The semiconductor package includes a first semiconductor package in which a semiconductor device is mounted on a lower surface of a first substrate, and a through hole is formed in a solder ball pad region of the first substrate, a second semiconductor package in which a semiconductor device is mounted on an upper surface of a second substrate, and a solder ball pad of the second substrate is formed to correspond to the through hole of the first substrate and is mounted on the first substrate, and a common solder ball that is disposed below the first substrate and is connected to the solder ball pad of the second substrate through the through hole.

Abstract translation: 一种具有双重连接结构的焊球的半导体封装，其减少了封装（POP）上的封装的总高度。 半导体封装包括第一半导体封装，其中半导体器件安装在第一衬底的下表面上，并且通孔形成在第一衬底的焊球焊盘区域中;第二半导体封装，其中半导体器件 安装在第二基板的上表面上，并且形成第二基板的焊球垫，以对应于第一基板的通孔，并且安装在第一基板上，并且配置公共焊球， 并且通过通孔与第二基板的焊球焊盘连接。

公开(公告)号：US20090072374A1

公开(公告)日：2009-03-19

申请号：US11856652

申请日：2007-09-17

Applicant: Stephan Dobritz ,  Christoph Polaczyk ,  Roland Irsigler

Inventor： Stephan Dobritz ,  Christoph Polaczyk ,  Roland Irsigler

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H05K3/3436 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/112 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: According to one embodiment of the present invention, an electric device includes: a top surface and a bottom surface; a contact hole extending from the top surface through the device to the bottom surface; a conductive sealing element which seals the contact hole at or near the bottom surface; a conductive connection which is coupled to the conductive sealing element and which extends through the contact hole to the top surface; and solder material which is provided on a bottom surface of the conductive sealing element.

Abstract translation: 根据本发明的一个实施例，电气设备包括：顶表面和底表面; 从所述顶表面穿过所述装置延伸到所述底表面的接触孔; 导电密封元件，其在底表面处或附近密封接触孔; 导电连接，其连接到导电密封元件并且延伸穿过接触孔到达顶表面; 以及设置在导电性密封元件的底面上的焊料。

公开(公告)号：US20090058445A1

公开(公告)日：2009-03-05

申请号：US12251196

申请日：2008-10-14

Applicant: Alexander Leon

Inventor： Alexander Leon

IPC: G01R31/28

CPC classification number: G01R1/06738 ,  G01R31/2808 ,  H05K1/0268 ,  H05K1/116 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/0545

Abstract: A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.

Abstract translation: 当探头的边缘接触测试点的焊锡墩时，使用设置在固定方向的边缘探头来探测电路板的测试点。 焊锡墩具有细长的形状。 当边缘接触焊料堆并且保持在固定取向时，边缘的长度基本上垂直于焊料堆的长度。

公开(公告)号：US07381066B2

公开(公告)日：2008-06-03

申请号：US10580261

申请日：2005-09-29

Applicant: Masahiro Higashiguchi ,  Kunihiro Tan ,  Kazuhiro Yoneda

Inventor： Masahiro Higashiguchi ,  Kunihiro Tan ,  Kazuhiro Yoneda

IPC: H01R12/00

CPC classification number: H01M10/42 ,  H01M2/24 ,  H01M10/425 ,  H05K1/113 ,  H05K3/3405 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/09572 ,  H05K2201/099 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2203/0182 ,  H05K2203/0455 ,  Y02P70/613

Abstract: A printed circuit board comprises a base substrate and an external interconnection terminal provided on the base substrate, wherein external interconnection terminal comprises a land formed on a front surface of the base substrate and a metal plate soldered upon the land via a solder layer, a through-hole being formed in the base substrate such that the through-hole penetrates through the land and through the base substrate, the through-hole being filled with a solder such that the solder in the through-hole extends in continuation to the solder layer connecting the metal plate to the land.

Abstract translation: 印刷电路板包括基底基板和设置在基底基板上的外部互连端子，其中外部互连端子包括形成在基底基板的前表面上的焊盘和通过焊料层焊接在焊盘上的金属板， 孔形成在基底基板中，使得通孔穿过平台并穿过基底基板，通孔填充有焊料，使得通孔中的焊料继续延伸到焊料层连接 金属板到土地。

公开(公告)号：US20070111557A1

公开(公告)日：2007-05-17

申请号：US10580261

申请日：2005-09-29

Applicant: Masahiro Higashiguchi ,  Kunihiro Tan ,  Kazuhiro Yoneda

Inventor： Masahiro Higashiguchi ,  Kunihiro Tan ,  Kazuhiro Yoneda

IPC: H01R12/00

CPC classification number: H01M10/42 ,  H01M2/24 ,  H01M10/425 ,  H05K1/113 ,  H05K3/3405 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/09572 ,  H05K2201/099 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2203/0182 ,  H05K2203/0455 ,  Y02P70/613

Abstract: A printed circuit board comprises a base substrate and an external interconnection terminal provided on the base substrate, wherein external interconnection terminal comprises a land formed on a front surface of the base substrate and a metal plate soldered upon the land via a solder layer, a through-hole being formed in the base substrate such that the through-hole penetrates through the land and through the base substrate, the through-hole being filled with a solder such that the solder in the through-hole extends in continuation to the solder layer connecting the metal plate to the land.

Abstract translation: 印刷电路板包括基底基板和设置在基底基板上的外部互连端子，其中外部互连端子包括形成在基底基板的前表面上的焊盘和通过焊料层焊接在焊盘上的金属板， 孔形成在基底基板中，使得通孔穿过平台并穿过基底基板，通孔填充有焊料，使得通孔中的焊料继续延伸到焊料层连接 金属板到土地。

公开(公告)号：US20070031279A1

公开(公告)日：2007-02-08

申请号：US11399856

申请日：2006-04-07

Applicant: Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

Inventor： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: C22C9/02

CPC classification number: H01L24/13 ,  B32B15/01 ,  C22C5/02 ,  C22C9/02 ,  C22C11/06 ,  C22C13/00 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/4924 ,  H01L23/49513 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81409 ,  H01L2224/81815 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/045 ,  H05K2201/09572 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract translation: 在半导体器件和衬底之间形成的每一个接合点包括Cu的金属球或Sn的其它材料和化合物以及金属球，金属球通过化合物结合在一起。

公开(公告)号：US07145231B2

公开(公告)日：2006-12-05

申请号：US10844392

申请日：2004-05-13

Applicant: Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

Inventor： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC: H01L23/34

CPC classification number: H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

公开(公告)号：US20050263318A1

公开(公告)日：2005-12-01

申请号：US11138314

申请日：2005-05-27

Applicant: Shinichi Yoshioka

Inventor： Shinichi Yoshioka

IPC: H01L23/40 ,  E21B7/12 ,  E21B29/12 ,  E21B33/037 ,  E21B34/04 ,  H05K1/00 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0206 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/09572 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/0455 ,  Y02P70/613

Abstract: A structure is disclosed for fixing an electronic device having a heat-releasing plate to a substrate. The structure includes a substrate, a land portion which is formed on a front face of the substrate and on which said heat-releasing plate of the electronic device is to be soldered, a through-hole formed in and penetrating said substrate and said land portion. The through-hole is adapted to release heat generated in the electronic device. The structure further includes a partitioning portion provided to be positioned between the heat-releasing plate and the land portion. The partitioning portion is adapted for preventing a solder, which should partially run out from a specific edge portion of the heat-releasing plate on soldering the heat-releasing plate to the land portion, from partially flowing into the through-hole.

Abstract translation: 公开了一种用于将具有散热板的电子装置固定到基板的结构。 该结构包括：基板，形成在基板的正面上并且其上要焊接电子设备的散热板的接地部分，形成并贯穿所述基板的通孔和所述接地部分 。 通孔适于释放在电子设备中产生的热量。 该结构还包括设置在定位在散热板和陆部之间的分隔部分。 分隔部适于防止在将散热板焊接到台面部分时部分地从散热板的特定边缘部分流出的焊料部分地流入通孔。