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    Electromagnetic bandgap structure and printed circuit board having the same
    11.
    发明授权
    Electromagnetic bandgap structure and printed circuit board having the same 失效
    电磁带隙结构和具有相同功能的印刷电路板

    公开(公告)号：US08330048B2

    公开(公告)日：2012-12-11

    申请号：US12650486

    申请日：2009-12-30

    Applicant: Won Woo Cho ,  Young Soo Kim ,  Yoon Jung Kim ,  Dek Gin Yang ,  Myung Gun Chong ,  Hyung Ho Kim

    Inventor： Won Woo Cho ,  Young Soo Kim ,  Yoon Jung Kim ,  Dek Gin Yang ,  Myung Gun Chong ,  Hyung Ho Kim

    IPC: H05K9/00

    CPC classification number: H05K1/0236 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627

    Abstract: Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates; and a metal layer disposed over or under the conductive layer and including a stitching pattern to electrically connect a first conductive plate to a second conductive plate of the plurality of conductive plates. The bandgap structure includes a spiral stitching pattern formed in a metal layer different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.

    Abstract translation: 本文公开了一种电磁带隙结构和具有该电阻带隙结构的印刷电路板。 带隙结构包括包括多个导电板的导电层; 以及设置在所述导电层上或下的金属层，并且包括将所述第一导电板电连接到所述多个导电板的第二导电板的缝合图案。 带隙结构包括形成在与导电层不同的金属层中的螺旋缝合图案，从而在紧凑的结构中提供具有期望带宽的阻挡带。

    Multilayer printed wiring board
    12.
    发明授权
    Multilayer printed wiring board 有权
    多层印刷线路板

    公开(公告)号：US08324512B2

    公开(公告)日：2012-12-04

    申请号：US13004325

    申请日：2011-01-11

    Applicant: Yukihiko Toyoda ,  Yoichiro Kawamura ,  Tomoyuki Ikeda

    Inventor： Yukihiko Toyoda ,  Yoichiro Kawamura ,  Tomoyuki Ikeda

    IPC: H05K1/11

    CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/116 ,  H05K3/28 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09745 ,  H01L2924/00

    Abstract: A multilayered printed circuit board including a substrate, a multilayered structure built thereon and having conductor circuits and interlaminar resin insulating layers in an alternate fashion, and one or more stack-via structures including via-holes stacked one another and electrically connected to the conductor circuits through the insulating layers. Each of the via-holes includes a land portion formed on a respective one of the insulating layers and a filled via structure portion filling an opening of the respective one of the insulating layers with a metal layer such that the via-holes are stacked one another immediately above the filled via structure portion of each via-hole, the via-holes include the outermost layer via-hole in the outermost layer of the insulating layers, and one or more via-holes have the land portion having the land diameter which is larger than the land diameter of the land portion of the outermost layer via-hole.

    Abstract translation: 一种多层印刷电路板，包括基板，在其上构建的多层结构，并且具有交替形式的导体电路和层间树脂绝缘层，以及一个或多个堆叠通孔结构，其包括彼此堆叠并且电连接到导体电路的通孔 通过绝缘层。 每个通孔包括形成在绝缘层的相应一个上的接合部分和填充的通孔结构部分，其中填充有绝缘层的相应一个绝缘层的开口的金属层使得通孔彼此堆叠 在通孔的填充通孔结构部分的正上方，通孔包括绝缘层的最外层中的最外层通孔，一个或多个通孔具有焊盘直径为 大于最外层通孔的陆部的陆部直径。

    Electromagnetic interference noise reduction board using electromagnetic bandgap structure
    15.
    发明授权
    Electromagnetic interference noise reduction board using electromagnetic bandgap structure 有权
    电磁干扰降噪板采用电磁带隙结构

    公开(公告)号：US08212150B2

    公开(公告)日：2012-07-03

    申请号：US12654368

    申请日：2009-12-17

    Applicant: Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

    Inventor： Han Kim ,  Mi-Ja Han ,  Dae-Hyun Park ,  Hyo-Jic Jung ,  Kang-Wook Bong

    IPC: H05K9/00

    CPC classification number: H05K1/0236 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2924/00014

    Abstract: An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic bandgap structure therein. The electromagnetic bandgap structure includes: a plurality of first conductive plates and a plurality of second conductive plates placed on a same planar surface along the side portion of the first area; and a stitching via configured to electrically connect the first conductive plate to the second conductive plate through a planar surface that is different from the first conductive plate and the second conductive plate.

    Abstract translation: 公开了一种EMI降噪板。 具有用于屏蔽噪声的电磁带隙结构的电磁干扰（EMI）降噪板包括：具有接地层和功率层的第一区域; 放置在其中具有电磁带隙结构的第一区域的侧部的第二区域。 电磁带隙结构包括：多个第一导电板和沿着第一区域的侧面部分放置在同一平面上的多个第二导电板; 以及缝合通孔，其被构造成通过不同于所述第一导电板和所述第二导电板的平坦表面将所述第一导电板电连接到所述第二导电板。

    Split wave compensation for open stubs
    16.
    发明授权
    Split wave compensation for open stubs 有权
    开放桩的分波补偿

    公开(公告)号：US08063316B2

    公开(公告)日：2011-11-22

    申请号：US11818508

    申请日：2007-06-14

    Applicant: Dan Gorcea

    Inventor： Dan Gorcea

    IPC: H05K1/11

    CPC classification number: H05K1/0248 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/09336 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31511

    Abstract: In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

    Abstract translation: 根据第一实施例，本发明提供了一种包括第一表面的电路基板; 第二表面 具有靠近所述第一表面的第一端和靠近所述第二表面的第二端的第一通孔; 第二通孔，其具有靠近所述第一表面的第一端和靠近所述第二表面的第二端; 电连接所述第一通孔的所述第一端和所述第二通孔的所述第一端的第一导电元件; 电连接所述第一通孔的所述第二端和所述第二通孔的所述第二端的第二导电元件; 耦合到所述第一通孔的输入信号线; 以及耦合到所述第二通孔的输出信号线。

    Circuit board
    17.
    发明授权
    Circuit board 失效
    具有电磁噪声滤波器结构的电路板

    公开(公告)号：US08035993B2

    公开(公告)日：2011-10-11

    申请号：US12422292

    申请日：2009-04-13

    Applicant: Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

    Inventor： Shih-Chieh Chao ,  Chih-Wen Huang ,  Chun-Lin Liao

    IPC: H05K9/00

    CPC classification number: H05K1/0236 ,  H01F2017/0046 ,  H05K1/0231 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627

    Abstract: A circuit board including a first patterned metal layer and a second patterned metal layer is provided. The first patterned metal layer has metal blocks and spiral structures. A gap is kept between any two adjacent metal blocks. Each of the spiral structures is electrically connected between any two adjacent metal blocks. The second patterned metal layer is disposed beside the first patterned metal layer and has jumper segments. Each of the jumper segments has a first end and a second end opposite to the first end. Each of the spiral structures has an outer end and an inner end. The outer end is connected to one of the two adjacent metal blocks. The inner end is electrically connected to the first end of one of the jumper segments, and the second end of the jumper segment is electrically connected to the other one of the two the metal blocks.

    Abstract translation: 提供了包括第一图案化金属层和第二图案化金属层的电路板。 第一图案化金属层具有金属块和螺旋结构。 在任何两个相邻的金属块之间保持间隙。 每个螺旋结构电连接在任何两个相邻的金属块之间。 第二图案化金属层设置在第一图案化金属层旁边并且具有跨接段。 每个跳线段具有与第一端相对的第一端和第二端。 每个螺旋结构具有外端和内端。 外端连接到两个相邻的金属块中的一个。 内端电连接到一个跳线段的第一端，并且跳线段的第二端电连接到两个金属块中的另一个。

    PRINTED WIRING BOARD AND ELECTRONIC-COMPONENT PACKAGE
    19.
    发明申请
    PRINTED WIRING BOARD AND ELECTRONIC-COMPONENT PACKAGE 有权
    印刷线路板和电子元器件包装

    公开(公告)号：US20100288545A1

    公开(公告)日：2010-11-18

    申请号：US12775916

    申请日：2010-05-07

    Applicant: Akiyoshi Saitou

    Inventor： Akiyoshi Saitou

    IPC: H05K1/16 ,  H05K1/11

    CPC classification number: H05K1/0251 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0242 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/09627 ,  H05K2201/0979 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    Abstract: A printed wiring board having an insulating core; a plurality of vias having axes parallel to and at equal distance from a reference axis and passing through the core; a first conductive film formed on a front surface of the core from the reference axis to each of the individual vias; a first insulating film stacked on the front surface of the core and covering the first conductive film; a first connecting via having an axis identical to the reference axis and passing through the first stacked film; a second conductive film formed on a back surface of the core from the reference axis to each of the individual vias; a second insulating film stacked on the back surface of the core and covering the second conductive film; and a second connecting via having an axis identical to the reference axis and passing through the second stacked film.

    Abstract translation: 一种具有绝缘芯的印刷线路板; 多个通孔具有平行于参考轴线并且距离参考轴线等距离并且穿过芯部的轴线; 第一导电膜，其形成在所述芯的前表面上，从参考轴线到每个所述各个通孔; 第一绝缘膜，堆叠在所述芯的前表面上并覆盖所述第一导电膜; 第一连接通孔，其具有与参考轴线相同的轴线并穿过第一层叠膜; 形成在所述芯的背面上的第二导电膜，所述第二导电膜从所述参考轴线到每个所述各个通孔; 层叠在所述芯的背面上并覆盖所述第二导电膜的第二绝缘膜; 以及第二连接通孔，其具有与参考轴线相同的轴线并且穿过第二层叠膜。

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