公开(公告)号：US20110101411A1

公开(公告)日：2011-05-05

申请号：US13000042

申请日：2009-06-23

Applicant: Marcus Johannes Gerardus Elzinga

Inventor： Marcus Johannes Gerardus Elzinga

IPC: H01L33/62 ,  F21V21/00

CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

Abstract: A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.

Abstract translation: 一种支撑模块（1），包括具有槽孔（5）的导电层（2）和适于接收固态光源（3）的接收表面，所述电接触焊盘（4）与所述通孔 （5）。 支撑模块（1）还包括电绝缘元件（8）和延伸穿过电绝缘元件（8）并且穿过通孔（5）突出的至少一个接触销（9）。 此外，电绝缘元件（8）包括通道（10），允许接触到接触销（9）的端部和由固态光源（3）的表面接收的固态光源（3）的电接触焊盘（4） 导电层（2）。 这样的通道使得可以用焊接工具通过绝缘元件到达接触针和接触垫的端部。 因此，可以通过将接触销焊接到接触焊盘来将固态光源附着在金属表面上。 由于金属表面的散热性优于印刷电路板，因此在金属表面上安装固态照明装置在需要良好散热的应用中是有利的。

公开(公告)号：US07458823B2

公开(公告)日：2008-12-02

申请号：US11408076

申请日：2006-04-21

Applicant: Keiichi Sugimoto ,  Mitsuru Nakagawa

Inventor： Keiichi Sugimoto ,  Mitsuru Nakagawa

IPC: H01R13/504

CPC classification number: B29C45/14065 ,  B29C45/14639 ,  H05K3/284 ,  H05K3/3405 ,  H05K5/0034 ,  H05K5/065 ,  H05K2201/09754 ,  H05K2201/1034 ,  H05K2203/1316

Abstract: A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

Abstract translation: 电子钥匙收发装置的壳体形成为密封电路部件的整体，安装有电路部件的印刷电路板的安装面以及端子的其他部分露出的部分端子。 印刷电路板的与安装面相对的后表面提供了外壳的外表面的一部分。 当通过插入成型工艺将印刷板设置在壳体中时，印刷板被保持在成型模具的空腔中，使得印刷板的后表面紧密接触空腔的内表面。 因此，由于在树脂浇注时或当树脂硬化时引起的压力导致印刷基板的变形被抑制。

公开(公告)号：US07227758B2

公开(公告)日：2007-06-05

申请号：US10624063

申请日：2003-07-21

Applicant: Scott D. Brandenburg ,  Thomas A. Degenkolb

Inventor： Scott D. Brandenburg ,  Thomas A. Degenkolb

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K3/4092 ,  H01R13/6658 ,  H01R31/065 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/184 ,  H05K3/284 ,  H05K2201/086 ,  H05K2201/09163 ,  H05K2201/09754 ,  H05K2201/10924

Abstract: A printed circuit board (PCB) assembly includes a PCB and a first integrated conductive bus structure extending from a first edge of the PCB. The PCB connects a plurality of electronic components and includes a plurality of conductive layers, each separated by a non-conductive layer. The first integrated conductive bus structure includes a first portion that extends from the first edge of the PCB and which forms a plurality of electrically separate contacts of a connector. A second portion of the bus structure is integrated within the PCB and couples each of the contacts to at least one conductive trace of the PCB through plated holes.

Abstract translation: 印刷电路板（PCB）组件包括PCB和从PCB的第一边缘延伸的第一集成导电总线结构。 PCB连接多个电子部件，并且包括多个导电层，每个导体层由非导电层隔开。 第一集成导电总线结构包括从PCB的第一边缘延伸并且形成连接器的多个电分离触点的第一部分。 总线结构的第二部分集成在PCB内，并且通过电镀孔将每个触点耦合到PCB的至少一个导电迹线。

公开(公告)号：US20060203455A1

公开(公告)日：2006-09-14

申请号：US11372104

申请日：2006-03-10

Applicant: Masataka Suzuki ,  Kenji Hayakawa

Inventor： Masataka Suzuki ,  Kenji Hayakawa

IPC: H05K7/20

CPC classification number: H05K3/4092 ,  H05K1/056 ,  H05K3/403 ,  H05K3/429 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924

Abstract: The present invention is to provide a metal-core substrate without mounting large size terminals and connectors. Hence, the metal-core substrate can be smaller and thinner. A metal-core substrate includes a metal plate, an insulating layer formed on a surface of the metal plate and a circuit pattern formed on a surface of the insulating layer, wherein a part of said metal plate is exposed to outside of the insulating layer and is utilized as connector terminals. The metal plate has a heat sink plate to heat sink a heat-generating device mounted on the metal-core substrate and connector terminal plates disposed separately from the heat sink plate and utilized for the connector terminals. The heat-generating device and a driving part thereof each are disposed on a different surface of the metal-core substrate.

Abstract translation: 本发明提供一种不安装大尺寸端子和连接器的金属芯基板。 因此，金属芯基板可以更小更薄。 金属芯基板包括金属板，形成在金属板的表面上的绝缘层和形成在绝缘层的表面上的电路图案，其中所述金属板的一部分暴露于绝缘层的外部， 被用作连接器端子。 金属板具有散热板，用于将安装在金属芯基板上的发热装置和与散热板分开设置的连接器端子板散热，用于连接器端子。 发热元件及其驱动部分分别设置在金属芯基板的不同表面上。

公开(公告)号：US20050208789A1

公开(公告)日：2005-09-22

申请号：US11109656

申请日：2005-04-20

Applicant: Takehiro Shirai ,  Masayuki Iwase

Inventor： Takehiro Shirai ,  Masayuki Iwase

IPC: G02B6/38 ,  G02B6/42 ,  H01L23/24 ,  H01L23/498 ,  H01R12/00 ,  H05K1/05 ,  H05K3/44

CPC classification number: G02B6/4201 ,  G02B6/3885 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/4292 ,  H01L23/24 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/056 ,  H05K3/06 ,  H05K3/44 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09754 ,  H05K2201/10121 ,  H05K2203/0323 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.

Abstract translation: 印刷布线板包括多个导体板，其包括至少一个导体板，该导体板用作与外部电路电连接的引线，导体板彼此空间分离; 在导体板上或横跨导体板上形成绝缘层，或者两者在导体板上并跨过导体板; 以及形成在所述绝缘层上的多个布线图案。 至少一个导体板通过通孔与至少一个布线图形电连接。

公开(公告)号：US20040159461A1

公开(公告)日：2004-08-19

申请号：US10778114

申请日：2004-02-17

Applicant: DENSO CORPORATION

Inventor： Keiichi Kato ,  Tamotsu Morishima

IPC: H05K001/00

CPC classification number: B60R16/0239 ,  H05K1/141 ,  H05K3/103 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/09754 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10287 ,  H05K2203/1316

Abstract: In a vehicle electronic control unit, a power device and a circuit component, which structure a circuit in which current flows when the power device is driven, and a printed board are disposed within an aluminum case as a housing. Both the power device and the circuit component are disposed within a resin mold unit in a state where both the power device and the circuit component are wired so that a loop circuit is structured as a current path. Both the power device and the circuit component are mounted on the printed board by using a connection terminal which protrudes from the resin mold unit. According to the vehicle electronic control unit, noise and efficiency of the circuit can be improved because a loop of large current can be reduced.

Abstract translation: 在车载电子控制单元，动力装置和电路部件中，其构成电力装置被驱动时电流流动的电路，印刷电路板设置在作为外壳的铝外壳内。 功率器件和电路部件在电力设备和电路部件都被布线的状态下设置在树脂模具单元内，使得环路电路被构造为电流路径。 通过使用从树脂模具单元突出的连接端子将功率器件和电路部件两者安装在印刷电路板上。 根据车辆电子控制单元，可以提高电路的噪声和效率，因为可以减小大电流回路。

公开(公告)号：US5249355A

公开(公告)日：1993-10-05

申请号：US785859

申请日：1991-10-31

Applicant: David J. Miehls ,  Felipe J. Martin ,  Ramona G. Pond ,  Paul S. Fleischner

Inventor： David J. Miehls ,  Felipe J. Martin ,  Ramona G. Pond ,  Paul S. Fleischner

IPC: H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  H05K3/36

CPC classification number: H01L21/4857 ,  H05K3/4092 ,  H05K1/0237 ,  H05K1/0306 ,  H05K2201/09754 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T156/1052 ,  Y10T29/49126

Abstract: An electrically conductive stripline (16) is formed on a thermally fusible sheet (10), with a portion (16a) of the stripline (16) extending adjacent to an edge (10a) of the sheet (10). A cavity (18) is formed in another thermally fusible sheet (12) having an end (18a) at an edge (12a) thereof. The sheets (10,12) are laminated together with their edges (10a,12a) aligned, and the cavity (18) aligned with and facing the edge portion (16a) of the stripline (16). A retaining pin (20) may be temporarily inserted into the cavity (18) to prevent collapse thereof during the lamination step. The laminated sheets (10,12) are heated to thermally fuse them together. An electrically conductive pin (28) is partially inserted into the cavity (18) and ohmically bonded to the stripline (18) to provide an external connection.

Abstract translation: 导电带状线（16）形成在热熔片（10）上，带状线（16）的一部分（16a）邻近片（10）的边缘（10a）延伸。 在另一个热熔片（12）上形成有一个在其边缘（12a）具有一端（18a）的空腔（18）。 片材（10,12）以它们的边缘（10a，12a）对齐的方式层叠在一起，并且空腔（18）与带状线（16）的边缘部分（16a）对准并且面对着带状线（16）的边缘部分（16a）。 可以将保持销（20）临时插入空腔（18）中，以防止在层压步骤期间其折叠。 层叠片（10,12）被加热以将它们热熔合在一起。 导电销（28）部分地插入到空腔（18）中并且欧姆接合到带状线（18）以提供外部连接。

公开(公告)号：US5210477A

公开(公告)日：1993-05-11

申请号：US871874

申请日：1992-04-21

Applicant: Mitchell R. Rowlette ,  Kenneth L. Hayden ,  Gary J. Steffes

Inventor： Mitchell R. Rowlette ,  Kenneth L. Hayden ,  Gary J. Steffes

IPC: H05K3/30 ,  H05K3/32

CPC classification number: H05K3/301 ,  H05K3/325 ,  H05K2201/09754 ,  H05K2201/10053 ,  H05K2201/10295 ,  H05K2203/176 ,  Y10T307/891

Abstract: A fan control board having a central low voltage wiring center as well as a safety interlock for electric heaters. The interlock uses diodes to insure proper fan operation in the event of miswiring of the heater sequencers. Another feature is a quick connect for the time delay relay which permits easy insertion and removal thereof for replacement and/or cleaning. Diode circuits are provided in both the circuit to normally power the fan motor as well as in the circuit to power the PTC resistor which closes the fan motor circuit with the circuit which powers the PTC resistor also being connected across the fan motor circuit to provided rectified power to the fan circuit and permit the fan motor to turn on concurrently with the application of power to the PTC resistor to prevent the heater from being turned on prior to the fan. Circuitry to control each of multiple furnace heater elements is also applied via rectification circuitry to the fan motor circuitry to cause operation of the fan motor regardless of the order of operation of the heater elements of a furnace. There is also provided a quick connect and time delay relay design to allow easy insertion and removal of the relay for cleaning and/or replacement by having three spaced contacts on the housing surface of the relay with the quick connect having resilient opposed C-shaped terminal for frictionally locking one of the relay contacts therein and a pair of terminals at opposite ends thereof, at least one being resilient for contacting the other contacts on the housing.

Abstract translation: 具有中央低压配线中心的风扇控制板以及电加热器的安全互锁。 互锁使用二极管来确保在加热器顺控程序错接的情况下适当的风扇操作。 另一个特征是用于延时继电器的快速连接，其允许容易地插入和移除其用于更换和/或清洁。 二极管电路均设置在电路中，以正常为风扇电机供电，并在电路中为PTC电阻供电，该PTC电阻关闭风扇电机电路，该电阻为PTC电阻器供电，该电路也连接在风扇电机电路两端，以提供整流 风扇电路的电源，并允许风扇电机同时向PTC电阻施加电源打开，以防止加热器在风扇之前打开。 控制多个炉加热器元件的电路也通过整流电路施加到风扇电动机电路，以使风扇电动机的操作无论炉的加热器元件的操作顺序如何。 还提供了快速连接和延时继电器设计，通过在继电器的壳体表面上具有三个间隔开的触点，允许容易地插入和移除继电器用于清洁和/或更换，快速连接具有弹性相对的C形端子 为了摩擦地将其中的一个继电器触点锁定在其相对端部的一对端子，至少一个用于接触壳体上的其它触点的弹性。

公开(公告)号：US5205738A

公开(公告)日：1993-04-27

申请号：US863643

申请日：1992-04-03

Applicant: Herbert R. Anderson, Jr. ,  Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  Donald E. Myers ,  Thomas J. Walsh

Inventor： Herbert R. Anderson, Jr. ,  Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  Donald E. Myers ,  Thomas J. Walsh

IPC: H01R4/02 ,  H01R12/52 ,  H01R43/02 ,  H01R43/16 ,  H05K3/40

CPC classification number: H01R12/526 ,  H05K3/4015 ,  H05K3/4046 ,  H01R4/02 ,  H01R43/02 ,  H01R43/16 ,  H05K2201/0129 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2203/1105 ,  H05K2203/1189 ,  H05K3/403 ,  Y10S29/044 ,  Y10S439/951 ,  Y10T29/49167 ,  Y10T29/49853 ,  Y10T29/53191

Abstract: There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system.

Abstract translation: 公开了一种高密度电子连接器系统，其中塑料绝缘体在一个或多个层次上支撑多个导电电路迹线。 这些迹线的输出触点由小金属球提供。 金属球被驱动与相应的导电迹线紧密接触并被塑料体吸收。 球用金覆盖，并在连接器系统中提供微型，耐磨的紧密间隔的输出触点。

公开(公告)号：US4845313A

公开(公告)日：1989-07-04

申请号：US43287

申请日：1987-03-19

Applicant: Satoru Endoh ,  Ohnishi Katsuga

Inventor： Satoru Endoh ,  Ohnishi Katsuga

IPC: H05K1/00 ,  H05K1/05 ,  H05K3/00 ,  H05K3/32 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/0061 ,  H05K3/4092 ,  H05K3/4635 ,  H05K3/4641 ,  H05K1/0393 ,  H05K1/056 ,  H05K2201/056 ,  H05K2201/0919 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K3/321 ,  H05K3/386 ,  H05K3/4623

Abstract: A metallic core printed circuit board having a number of lead terminals such as IC or LSI lead terminals provided on at least one edge of an electrically conductive substrate which forms a core by etching or other process. The respective terminals are electrically insulated from and secured to the core by an insulating binder, and then either conductor circuit patterns are directly formed on or a printed board wherein a printed circuit has been completed is bonded to the layer of the insulating binder. The metallic core printed circuit board makes it possible to increase a packaging density of required components, to allow easy connection to other circuit boards such as a mother board and the like, and to reduce a volume of the circuit.

Abstract translation: PCT No.PCT / JP86 / 00386 Sec。 371日期1987年3月19日 102（e）1987年3月19日PCT PCT。1986年7月22日。一种金属芯印刷电路板，其具有多个引线端子，例如IC或LSI引线端子，其设置在导电基板的至少一个边缘上，形成 蚀刻或其他工艺的核心。 各个端子通过绝缘粘接剂与芯电绝缘并固定到芯上，然后将导体电路图案直接形成在印刷电路板上，其中已经完成了印刷电路已经结合到绝缘粘合剂层。 金属芯印刷电路板使得可以提高所需部件的封装密度，从而容易地连接到诸如母板等的其它电路板，并且减小电路的体积。