Patent search cpc:"H05K2201/10007" Page 2

11.

发明授权
Package structure and method of manufacturing the same 有权

公开(公告)号：US09972599B2

公开(公告)日：2018-05-15

申请号：US14558955

申请日：2014-12-03

Applicant: PHOENIX PIONEER TECHNOLOGY CO., LTD.

Inventor： Shih-Ping Hsu , Chao-Chung Tseng

IPC: H05K1/18 , H01L25/065 , H01L23/00 , H01L21/683 , H01L25/16 , H01L25/00 , H01L23/538 , H05K3/46 , H01L23/28 , H01L23/29 , H05K3/00 , H01L23/498 , H01L21/48 , H05K1/16 , H05K3/28 , H01L23/50 , H05K1/02 , H05K3/34

CPC classification number: H01L25/0657 , H01L21/486 , H01L21/6835 , H01L23/49827 , H01L23/50 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/16 , H01L25/50 , H01L2221/68345 , H01L2224/13023 , H01L2224/131 , H01L2224/16112 , H01L2224/16113 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2924/15153 , H01L2924/15331 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/0231 , H05K1/162 , H05K1/183 , H05K1/185 , H05K3/0032 , H05K3/0044 , H05K3/284 , H05K3/3431 , H05K3/4682 , H05K3/4697 , H05K2201/10 , H05K2201/10007 , H05K2201/10015 , H05K2201/1003 , H05K2201/10037 , H05K2201/10545 , Y10T29/49131 , H01L2924/014

Abstract: A method of manufacturing a package structure is provided, including forming a first wiring layer on a carrier board, forming up plurality of first conductors on the first wiring layer, forming a first insulating layer that encapsulates the first wiring layer and the first conductors, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, forming a second insulating layer that encapsulates the second wiring layer and the second conductors, and forming at least an opening on the second insulating layer for at least one electronic component to be disposed therein. Since the first and second insulating layers are formed before the opening, there is no need of stacking or laminating a substrate that already has an opening, and the electronic component will not be laminated and make a displacement. Therefore, the package structure thus manufactured has a high yield rate. The present invention further provides the package structure.

12.

发明授权
High-frequency component and high-frequency module including the same 有权

公开(公告)号：US09743519B2

公开(公告)日：2017-08-22

申请号：US14883792

申请日：2015-10-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyofumi Takai , Hidenori Obiya , Shinya Hitomi

IPC: H05K1/18 , H05K1/14 , H01L23/12 , H01L23/13 , H01L23/29 , H01L23/31 , H01L23/498 , H05K1/02 , H05K1/11 , H01L23/552 , H01L23/538 , H01L23/66 , H01L23/00 , H01L23/24

CPC classification number: H05K1/147 , H01L23/12 , H01L23/13 , H01L23/24 , H01L23/293 , H01L23/3107 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/5384 , H01L23/5385 , H01L23/552 , H01L23/66 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/16227 , H01L2224/291 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/81205 , H01L2224/81801 , H01L2924/14 , H01L2924/1421 , H01L2924/15153 , H01L2924/15159 , H01L2924/15311 , H01L2924/15313 , H01L2924/15787 , H01L2924/15788 , H01L2924/16152 , H01L2924/16251 , H01L2924/1631 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/0298 , H05K1/111 , H05K1/18 , H05K2201/042 , H05K2201/10007 , H05K2201/10053 , H05K2201/10098 , H05K2201/1053 , H01L2924/00014 , H01L2924/014 , H01L2924/00012

Abstract: A filter circuit component includes desired frequency characteristics without being influenced by a parasitic inductance and a parasitic capacitance, and since the ground terminal of the filter circuit component connected to the mounting electrode of the high-frequency component is connected to the ground electrode of the high-frequency component through the via conductors of the high-frequency component at the shortest distance, the packing density of the filter circuit component is significantly increased and the occurrence of an unnecessary parasitic inductance and an unnecessary parasitic capacitance is prevented. The filter circuit component is mounted on the high-frequency component to obtain the desired frequency characteristics without the influence of a parasitic inductance and a parasitic capacitance. Since the component is located in a space surrounded by the inner peripheral surface of the supporting frame body, the packing density of components mounted on the high-frequency component is increased.

13.

发明申请
WIRED CIRCUIT BOARD 审中-公开

公开(公告)号：US20170229635A1

公开(公告)日：2017-08-10

申请号：US15425607

申请日：2017-02-06

Applicant: NITTO DENKO CORPORATION

Inventor： Takahiro TAKANO , Takatoshi SAKAKURA , Tomoaki OKUNO

IPC: H01L41/053 , G11B5/48 , H05K1/18 , H05K1/11 , H05K1/09

CPC classification number: H01L41/053 , G11B5/4826 , H01L41/0475 , H01L41/29 , H05K1/09 , H05K1/111 , H05K1/181 , H05K3/244 , H05K3/3405 , H05K3/3463 , H05K2201/0338 , H05K2201/10007

Abstract: The wired circuit board includes a conductive layer having a terminal; a gold plated layer provided on the surface of the terminal; and a solder layer provided on the surface of the gold plated layer and provided so that the terminal and the electronic component can be electrically connected. The solder layer is made of a solder composition containing Sn, Bi, Cu and/or Ni, and the thickness Tsolder of the solder layer relative to the thickness TAu of the gold plated layer is 16 or more.

14.

发明授权
Graphene mounted on aerogel 有权

公开(公告)号：US09721726B2

公开(公告)日：2017-08-01

申请号：US15076856

申请日：2016-03-22

Applicant: Elwha LLC

Inventor： Jeffrey A. Bowers , Alistair K. Chan , Geoffrey F. Deane , Roderick A. Hyde , Nathan Kundtz , Nathan P. Myhrvold , David R. Smith , Lowell L. Wood, Jr.

IPC: H01G4/008 , H05K1/03 , H05K1/02 , H05K1/09 , H05K1/18 , B32B37/14 , H05K3/00 , B32B9/00 , B32B5/18 , H01L29/16 , H01G4/005 , H01G4/002 , H01L29/786 , H01L27/12 , B82Y30/00

CPC classification number: H01G4/008 , B32B5/18 , B32B9/007 , B32B37/14 , B32B2266/04 , B32B2266/057 , B32B2266/126 , B32B2307/202 , B32B2457/08 , B82Y30/00 , H01G4/002 , H01G4/005 , H01L27/12 , H01L29/1606 , H01L29/78603 , H05K1/02 , H05K1/0274 , H05K1/0306 , H05K1/032 , H05K1/09 , H05K1/097 , H05K1/181 , H05K3/00 , H05K2201/0323 , H05K2201/10007 , H05K2201/10121 , Y10S977/734 , Y10T29/49128 , Y10T29/49826 , Y10T156/10 , Y10T428/24331 , Y10T428/24777 , Y10T428/24996 , Y10T428/249981 , Y10T428/24999 , Y10T428/30

Abstract: An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.

15.

发明申请
ELECTRONIC COMPONENT-EMBEDDED MODULE AND COMMUNICATION TERMINAL DEVICE 审中-公开

公开(公告)号：US20170171966A1

公开(公告)日：2017-06-15

申请号：US15418918

申请日：2017-01-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Naoki GOUCHI

IPC: H05K1/02 , H05K1/11 , H05K3/24 , H05K3/40

CPC classification number: H05K1/0287 , H05K1/0292 , H05K1/0293 , H05K1/0298 , H05K1/0306 , H05K1/0393 , H05K1/111 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/24 , H05K3/4007 , H05K3/4092 , H05K3/4632 , H05K2201/0195 , H05K2201/09509 , H05K2201/096 , H05K2201/09663 , H05K2201/0969 , H05K2201/09781 , H05K2201/10007 , H05K2201/10159 , H05K2201/10984 , H05K2201/2072 , H05K2203/0271 , H05K2203/063 , H05K2203/08

Abstract: To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.

16.

发明申请
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECTRONIC PART EMBEDDED SUBSTRATE 审中-公开
Title translation: 电子部件嵌入式基板和生产电子部件嵌入式基板的方法

公开(公告)号：US20160358858A1

公开(公告)日：2016-12-08

申请号：US15241482

申请日：2016-08-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Takaharu YAMANO , Hajime IIZUKA , Hideaki SAKAGUCHI , Toshio KOBAYASHI , Tadashi ARAI , Tsuyoshi KOBAYASHI , Tetsuya KOYAMA , Kiyoaki IIDA , Tomoaki MASHIMA , Koichi TANAKA , Yuji KUNIMOTO , Takashi YANAGISAWA

IPC: H01L23/538 , H01L21/48 , H01L21/56 , H01L23/31

CPC classification number: H01L23/5389 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/56 , H01L21/563 , H01L21/565 , H01L21/6835 , H01L23/3114 , H01L23/3121 , H01L23/3128 , H01L23/49822 , H01L23/49833 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/97 , H01L25/105 , H01L25/16 , H01L25/162 , H01L2221/68345 , H01L2224/0401 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81005 , H01L2224/81193 , H01L2224/81801 , H01L2224/83101 , H01L2224/83102 , H01L2224/83192 , H01L2224/85 , H01L2224/92125 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/07811 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/207 , H01L2924/3025 , H01L2924/3511 , H05K1/185 , H05K1/186 , H05K3/20 , H05K3/4614 , H05K3/462 , H05K3/4644 , H05K2201/10007 , H05K2201/10378 , H05K2201/10674 , H05K2201/10977 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract translation: 公开了一种电子部件嵌入式基板。电子部件嵌入式基板包括第一基板，第二基板，电子部件，电连接部件和密封部件。还公开了一种制造电子部件嵌入式基板的方法。该方法包括将电子部件安装到第一基板上，通过电连接部件将第二基板层压在第一基板上; 以及用密封构件填充第一基板和第二基板之间的空间以密封电子部件。

17.

发明授权
Antenna array feeding structure having circuit boards connected by at least one solderable pin 有权
Title translation: 具有由至少一个可焊接引脚连接的电路板的天线阵列馈电结构

公开(公告)号：US09408306B2

公开(公告)日：2016-08-02

申请号：US14155920

申请日：2014-01-15

Applicant: Honeywell International Inc.

Inventor： Nan Wang , Orville Nyhus , Chao Wang

IPC: H05K1/14 , H01Q21/00 , H05K1/02 , H05K1/11 , H05K3/46 , H05K3/10 , H01Q1/00 , H01P3/08 , H01Q1/24 , H01Q1/50

CPC classification number: H05K1/144 , H01L2224/00 , H01P3/084 , H01Q1/002 , H01Q1/246 , H01Q1/50 , H01Q21/0081 , H05K1/0251 , H05K1/0298 , H05K1/115 , H05K1/14 , H05K3/10 , H05K3/46 , H05K2201/10007 , Y10T29/49126 , Y10T29/49155

Abstract: Systems and methods for a feeding structure for an antenna array are provided. In at least one embodiment, the feeding structure for an antenna array comprises one or more circuit boards with one or more circuits formed thereon, one or more conductive layers wherein the one or more circuit boards are mounted to the one or more conductive layers, and one or more connectors coupled to the one or more circuits through an opening in the one or more conductive layers. Furthermore, the one or more conductive layers are separated by a dielectric from the one or more circuits and the one or more conductive layers contact the one or more circuit boards such that the one or more circuits are isolated from the one or more conductive layers.

Abstract translation: 提供了一种用于天线阵列馈电结构的系统和方法。在至少一个实施例中，天线阵列的馈电结构包括一个或多个电路板，其上形成有一个或多个电路，一个或多个导电层，其中一个或多个电路板安装到一个或多个导电层，以及一个或多个通过所述一个或多个导电层中的开口耦合到所述一个或多个电路的连接器。此外，一个或多个导电层由电介质与一个或多个电路隔开，并且一个或多个导电层接触一个或多个电路板，使得一个或多个电路与一个或多个导电层隔离。

18.

发明申请
ELECTRONIC DEVICE COMPRISING A SUBSTRATE BOARD EQUIPPED WITH A LOCAL REINFORCING OR BALANCING LAYER 有权
Title translation: 包含配有本地增强或平衡层的基板的电子设备

公开(公告)号：US20150036309A1

公开(公告)日：2015-02-05

申请号：US14444583

申请日：2014-07-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean-Michel Riviere , Karine Saxod

IPC: H05K1/02 , H05K1/18 , H05K3/30

CPC classification number: H05K1/0271 , H01L23/49844 , H01L23/562 , H01L24/16 , H01L2224/131 , H01L2224/16111 , H01L2224/16237 , H05K1/181 , H05K3/28 , H05K3/30 , H05K2201/0275 , H05K2201/09909 , H05K2201/10007 , H05K2201/2009 , Y10T29/4913 , H01L2924/014

Abstract: A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in electrical contact with the electrical connection network. A local reinforcing or balancing layer made of a non-metallic material is mounted to the face of the substrate board in at least one local zone free of the face which is free of metal portions of the electrical connection network.

Abstract translation: 基板包括在其表面上的电连接网络。集成电路芯片安装到与电连接网络电接触的基板的表面。由非金属材料制成的局部增强或平衡层在至少一个不具有电连接网络的金属部分的表面的局部区域中安装到基板的表面上。