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公开(公告)号：US20150260932A1
公开(公告)日：2015-09-17
申请号：US14727040
申请日：2015-06-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Terrel MORRIS
CPC classification number: G02B6/4269 , G02B6/4261 , G02B6/428 , G02B6/4285 , H01L23/4006 , H01L23/4093 , H01L23/42 , H01L24/16 , H01L25/167 , H01L27/14618 , H01L2224/16225 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H04N5/2253 , H04N5/335 , H05K3/325 , H05K3/34 , H05K2201/10121 , H05K2201/10393 , Y10T29/49126 , Y10T29/49144
Abstract: A circuit module can include a substrate, a photonic conversion unit placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion unit and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion unit. The photonic conversion unit is removably secured to the substrate by the retention assembly without the use of a bonding material.
Abstract translation: 电路模块可以包括衬底，放置在衬底上的光子转换单元; 和保持组件。 保持组件可以包括与光子转换单元和紧固件热接触的散热器。 紧固件可以机械地耦合到基板和散热器两者，并且被配置为将散热器压靠光子转换单元。 光子转换单元通过保持组件可移除地固定到基板上，而不使用粘结材料。
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12.发明申请公开(公告)号：US20150144386A1
公开(公告)日：2015-05-28
申请号：US14219768
申请日：2014-03-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Bong-Soo KIM
CPC classification number: H05K1/186 , H05K3/4673 , H05K2201/10393 , Y10T29/49139
Abstract: The present invention discloses an electronic component embedded substrate and a manufacturing method thereof. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core board having a cavity formed therein; an electronic component being embedded in the cavity; and a circuit pattern formed on one surface of the core board and configured for fixing the electronic component in the cavity by pressing the electronic component.
Abstract translation: 本发明公开了一种电子部件嵌入式基板及其制造方法。 根据本发明实施例的电子部件嵌入式基板包括：形成有腔的芯板; 电子部件嵌入在所述腔中; 以及电路图案，其形成在所述芯板的一个表面上并且被构造用于通过按压所述电子部件来将所述电子部件固定在所述空腔中。
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公开(公告)号：US20150138747A1
公开(公告)日：2015-05-21
申请号：US14540138
申请日：2014-11-13
Applicant: Sercomm Corporation
Inventor： Chin-Chang Chiang , Chin-Liang Wang
CPC classification number: H02G3/30 , H02G3/10 , H05K3/3447 , H05K5/0017 , H05K5/0204 , H05K5/0247 , H05K7/02 , H05K2201/10386 , H05K2201/10393 , H05K2201/10863
Abstract: A mounting plate and a security device using the same are provided. The mounting plate is for being fixed to a surface, wherein a mounting device is hanged up on the mounting plate, and the mounting plate comprises a first conductive sheet and a second conductive sheet electrically connected to a first electrode of an exterior power and a second electrode of the exterior power respectively. When the mounting device is hanged up on the mounting plate, the exterior power is electrically connected to the mounting device through the first conductive sheet and the second conductive sheet.
Abstract translation: 提供安装板和使用其的安全装置。 安装板用于固定到表面，其中安装装置悬挂在安装板上，并且安装板包括电连接到外部电源的第一电极的第一导电片和第二导电片，第二导电片 电源的外部电源。 当安装装置悬挂在安装板上时，外部电源通过第一导电片和第二导电片与安装装置电连接。
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14.发明授权公开(公告)号：US08902603B2
公开(公告)日：2014-12-02
申请号：US13210329
申请日：2011-08-15
Applicant: Carmen Rapisarda
Inventor： Carmen Rapisarda
CPC classification number: H05K1/11 , H01R12/7076 , H05K1/0203 , H05K1/0271 , H05K1/0274 , H05K1/181 , H05K3/284 , H05K3/325 , H05K2201/035 , H05K2201/10106 , H05K2201/10166 , H05K2201/10393 , H05K2201/10454 , H05K2201/10598 , H05K2201/10757 , H05K2201/1078 , H05K2201/10787 , H05K2201/10795 , Y02P70/611
Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.
Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部位置上，并且每个这样的电子部件通过覆盖并与其接触的夹具保持就位 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。
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公开(公告)号：US20140328561A1
公开(公告)日：2014-11-06
申请号：US14293548
申请日：2014-06-02
Applicant: FUJIKURA LTD.
Inventor： Takayuki TANAKA , Sawako YAMAI , Osamu KIKUCHI , SUSUMU OKABE
IPC: G02B6/42
CPC classification number: G02B6/4292 , G02B6/42 , G02B6/4206 , G02B6/4214 , G02B6/423 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4259 , G02B6/4269 , G02B6/4284 , G02B6/43 , H05K1/0274 , H05K1/141 , H05K2201/09063 , H05K2201/10121 , H05K2201/10189 , H05K2201/10393 , H05K2201/10598
Abstract: An optical module includes: a transparent substrate through which light can pass; a photoelectric conversion element mounted on the transparent substrate and emitting light toward the transparent substrate or receiving light having passed through the transparent substrate; and a support member supporting an optical fiber for transmitting light, the support member and the transparent substrate forming an optical path between the photoelectric conversion element and the optical fiber. A positioning hole is formed in the transparent substrate. A positioning pin having a tapered surface is formed on the support member. The transparent substrate and the support member are positioned with respect to one another by inserting the positioning pin into the positioning hole along the optical axis direction of light between the transparent substrate and the support member and by making the tapered surface of the positioning pin contact the edge of the positioning hole without leaving any space therebetween.
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Patent Agency Ranking
公开(公告)号：US20140140018A1
公开(公告)日：2014-05-22
申请号：US13682402
申请日：2012-11-20
Applicant: APPLE INC.
Inventor： Shayan Malek , Michael B. Wittenberg , Warren Z. Jones
CPC classification number: H05K1/147 , H04M1/0277 , H04M1/185 , H05K1/118 , H05K3/363 , H05K2201/055 , H05K2201/09445 , H05K2201/10378 , H05K2201/10393 , H05K2201/10409
Abstract: Protection structures may be provided to protect connectors, printed circuits, and other internal device components from damage. Components may shift within a device if the device is unexpectedly dropped. Protection structures can shield printed circuit connectors and other structures so that component movement during a drop event does not dislodge a printed circuit connector or otherwise damage a device. A cowling can be used to hold a board-to-board connector or other connector together. The cowling may have a protruding portion that is bent to form a protective wall. Plastic structures may be molded onto the cowling to form protective walls. Protection structures for printed circuit connectors and other internal device components may be formed from spring-based structures that clip onto the edge of a printed circuit board.
Abstract translation: 可以提供保护结构以保护连接器，印刷电路和其他内部装置部件免受损坏。 如果设备意外掉落，组件可能在设备内移动。 保护结构可以屏蔽印刷电路连接器和其他结构，使得在跌落事件期间的部件移动不会移除印刷电路连接器或以其他方式损坏设备。 整流罩可用于将板对板连接器或其他连接器固定在一起。 整流罩可以具有弯曲以形成保护壁的突出部分。 塑料结构可以模塑到整流罩上以形成保护壁。 印刷电路连接器和其他内部器件部件的保护结构可以由夹在印刷电路板的边缘上的基于弹簧的结构形成。
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公开(公告)号：US20140071630A1
公开(公告)日：2014-03-13
申请号：US13958628
申请日：2013-08-05
Applicant: Jia-Yu Hung , Chang-Yuan Wu , I-Feng Hsu , Ting-Wei Hsu
Inventor： Jia-Yu Hung , Chang-Yuan Wu , I-Feng Hsu , Ting-Wei Hsu
IPC: H05K1/02
CPC classification number: H05K1/0203 , H01L23/367 , H01L23/40 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H05K1/0209 , H05K2201/10393 , H01L2924/00
Abstract: A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.
Abstract translation: 提供了一种适于从布置在电路板上的加热元件去除热量的散热模块。 散热模块包括导热结构，粘合剂层和弹性构件。 导热结构适于设置在加热元件上。 粘合剂层适合于布置在电路板上并与加热元件相邻。 弹性部件通过粘合剂层胶合到电路板上，并且弹性部件施加力以使导热结构附着到加热元件。
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公开(公告)号：US20140064675A1
公开(公告)日：2014-03-06
申请号：US13974232
申请日：2013-08-23
Applicant: FUJIKURA LTD.
Inventor： Takayuki TANAKA , Sawako YAMAI , Osamu KIKUCHI , Susumu OKABE
CPC classification number: G02B6/4292 , G02B6/42 , G02B6/4206 , G02B6/4214 , G02B6/423 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4259 , G02B6/4269 , G02B6/4284 , G02B6/43 , H05K1/0274 , H05K1/141 , H05K2201/09063 , H05K2201/10121 , H05K2201/10189 , H05K2201/10393 , H05K2201/10598
Abstract: An optical module includes: a transparent substrate through which light can pass; a photoelectric conversion element mounted on the transparent substrate and emitting light toward the transparent substrate or receiving light having passed through the transparent substrate; and a support member supporting an optical fiber for transmitting light, the support member and the transparent substrate forming an optical path between the photoelectric conversion element and the optical fiber. A positioning hole is formed in the transparent substrate. A positioning pin having a tapered surface is formed on the support member. The transparent substrate and the support member are positioned with respect to one another by inserting the positioning pin into the positioning hole along the optical axis direction of light between the transparent substrate and the support member and by making the tapered surface of the positioning pin contact the edge of the positioning hole without leaving any space therebetween.
Abstract translation: 光学模块包括：光可通过的透明基板; 安装在透明基板上的光电转换元件，朝向透明基板发射光，或接收透过透明基板的光; 以及支撑部件，其支撑用于透光的光纤，所述支撑部件和所述透明基板在所述光电转换元件与所述光纤之间形成光路。 在透明基板中形成定位孔。 具有锥形表面的定位销形成在支撑构件上。 通过将透明基板和支撑部件之间的光轴方向的定位销插入定位孔，并且通过使定位销的锥形表面接触定位销，透明基板和支撑部件相对于彼此定位 定位孔的边缘，而不在其间留下任何空间。
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公开(公告)号：US20130003292A1
公开(公告)日：2013-01-03
申请号：US13223224
申请日：2011-08-31
Applicant: Brett W. DEGNER , Gregory Tice
Inventor： Brett W. DEGNER , Gregory Tice
CPC classification number: G06F1/20 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K3/301 , H05K7/12 , H05K7/20 , H05K7/20254 , H05K2201/064 , H05K2201/10265 , H05K2201/10325 , H05K2201/10393 , H05K2201/10704 , H05K2203/0278 , Y10T29/49124 , Y10T29/49826 , Y10T29/53113 , H01L2924/00
Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
Abstract translation: 公开了一种适用于去除在紧凑的计算环境中工作的集成电路产生的多余热量的低轮廓散热系统。
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20.发明授权Method for fixing an electrical or an electronic component, particularly a printed-circuit board, in a housing and fixing element therefor 有权将电气或电子部件特别是印刷电路板固定在其壳体和固定元件中的方法公开(公告)号：US08331099B2
公开(公告)日：2012-12-11
申请号：US12305187
申请日：2007-06-12
Applicant: Alexander Geissler , Udo Hennel
Inventor： Alexander Geissler , Udo Hennel
IPC: H05K5/00
CPC classification number: H05K1/18 , H05K1/181 , H05K7/142 , H05K2201/0133 , H05K2201/10393 , Y02P70/611 , Y10T29/49947 , Y10T29/49954 , Y10T29/5327
Abstract: In a method for fixing an electrical or an electronic component, particularly a printed-circuit board, in a housing used to accommodate the component, and a fixing element for fixing the component by clamping it in place, the component is fitted with at least one fixing element, which includes an elastically yielding press-on part which, during the clamping in place of the component in the housing, is brought to lie against a part of the housing and is pressed against it while being deformed.
Abstract translation: 在用于将电气或电子部件特别是印刷电路板固定在用于容纳部件的壳体中的方法中，以及用于通过将其固定在适当位置来固定部件的固定元件，该部件装配有至少一个 固定元件，其包括弹性屈服压制部件，其在夹紧期间将壳体中的部件置于壳体的一部分上并在其变形的同时被压靠在其上。
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