公开(公告)号：US20060201697A1

公开(公告)日：2006-09-14

申请号：US11079505

申请日：2005-03-14

Applicant: Eric Chan ,  King Chu

Inventor： Eric Chan ,  King Chu

IPC: H02G3/00

CPC classification number: H05K3/306 ,  H05K1/0287 ,  H05K3/3447 ,  H05K3/42 ,  H05K13/00 ,  H05K2201/0116 ,  H05K2201/10401 ,  H05K2201/2018 ,  H05K2203/0191 ,  H05K2203/1189

Abstract: A composite support for fabricating a prototype electrical circuit has a rectangular planar board with a plurality of rows and columns of double sided annular toroidal connection eyelets. The planar board is mounted on a rectangular support tray having a well. The connection eyelets of the planar board have a diameter of from 1.30 mm to 1.80 mm. A high temperature sheet material adhered to the entire undersurface of the planar board, which is pierced by leads of electrical components inserted into the connection eyelets. A spongy retainer block or a breadboard may also be located in the support tray well.

Abstract translation: 用于制造原型电路的复合支撑件具有矩形平面板，其具有多个行和列的双面环形环形连接孔眼。 平面板安装在具有井的矩形支撑盘上。 平面板的连接孔眼的直径为1.30mm至1.80mm。 附着在平板的整个下表面的高温片材，其被插入连接孔眼中的电气部件的引线刺穿。 海绵保持块或面包板也可以位于支撑盘中。

公开(公告)号：US20040258500A1

公开(公告)日：2004-12-23

申请号：US10264366

申请日：2002-10-04

Applicant: Sanmina-SCI Corporation

Inventor： John A. Ireland

IPC: F16B039/00

CPC classification number: H05K3/325 ,  H05K3/341 ,  H05K3/3447 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/5313

Abstract: A circuit board threadplate for connection of a component to a circuit board is provided wherein such threadplate may be mechanically mounted to a circuit board without the use of manual labor. Specifically, the threadplate is compatible with present Surface Mount Technology robotic placement machines. Such circuit board threadplate comprises a hollow substantially cylindrical member forming an extruded neck having an elongated section and a substantially flat surface at a first end of the elongated section and a flange extending from a second end of the elongated section. The flange provides a substantially flat surface suitable for soldering onto a surface of a circuit board. Additionally, the threadplate comprises a cylindrical cavity positioned inside the substantially cylindrical member, extending in a direction aligned with the substantially cylindrical member. The cylindrical cavity may have a thread pattern suitable for receiving a screw-type fastener. Finally, the threadplate comprises an opening providing access to the cylindrical cavity.

Abstract translation: 提供了用于将部件连接到电路板的电路板螺纹板，其中这种螺纹板可以机械地安装到电路板而不使用体力劳动。 具体来说，螺纹板与现有的表面贴装技术机器人放置机器兼容。 这种电路板螺纹板包括中空的基本上圆柱形的构件，其形成挤压颈部，该挤压颈部具有在细长部分的第一端处的细长部分和基本平坦的表面，以及从细长部分的第二端延伸的凸缘。 凸缘提供适于焊接到电路板表面上的基本上平坦的表面。 此外，螺纹板包括位于基本上圆柱形构件内部的圆柱形空腔，其沿与大致圆柱形构件对准的方向延伸。 圆柱形腔可以具有适于接收螺旋型紧固件的螺纹图案。 最后，螺纹板包括提供进入圆柱形腔的开口。

公开(公告)号：US06291780B1

公开(公告)日：2001-09-18

申请号：US09206041

申请日：1998-12-04

Applicant: Bernd Schleife ,  Wulf Bramesfeld ,  Frank Schliep ,  Tarik Gunay

Inventor： Bernd Schleife ,  Wulf Bramesfeld ,  Frank Schliep ,  Tarik Gunay

IPC: H05K114

CPC classification number: H01R12/616 ,  H05K1/0393 ,  H05K3/0064 ,  H05K3/365 ,  H05K3/4046 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0382 ,  H05K2201/10401 ,  H05K2203/0195

Abstract: A method of, and device (10) for, connecting a plurality of flexible printed circuits (12) each comprising a layer (14) of electrically insulating material and a layer (16) of electrically conducting material. The method including the steps of forming a hole (18) through each flexible printed circuit; positioning first and second substantially rigid plates (20,22) of electrically insulating material on either side of the flexible printed circuits with the holes in the flexible printed circuits aligned with a corresponding hole (26,28) in each plate; extending a rivet (24) of electrically conducting material through the aligned holes to electrically connect with the layers of electrically conducting material on the flexible printed circuits; and enlarging the ends (30,32) of the rivet to secure the flexible printed circuits between the plates. Provides an improved electrical and mechanical connection between FPCs.

Abstract translation: 一种用于连接多个柔性印刷电路（12）的方法和装置（10），每个柔性印刷电路都包括电绝缘材料层（14）和导电材料层（16）。 该方法包括通过每个柔性印刷电路形成孔（18）的步骤; 在柔性印刷电路的任一侧上定位电绝缘材料的第一和第二基本上刚性的板（20,22），柔性印刷电路中的孔与每个板中的相应孔（26,28）对齐; 通过对准的孔延伸导电材料的铆钉（24），以与柔性印刷电路上的导电材料层电连接; 并且扩大铆钉的端部（30,32）以将柔性印刷电路固定在板之间。 在FPC之间提供改进的电气和机械连接。

公开(公告)号：US4760242A

公开(公告)日：1988-07-26

申请号：US926845

申请日：1986-11-03

Applicant: Frank Sylvia ,  Francis V. Bugg ,  John B. Holdway

Inventor： Frank Sylvia ,  Francis V. Bugg ,  John B. Holdway

IPC: B23K11/00 ,  H01R43/048 ,  H05K3/40 ,  B23K11/32 ,  H05B1/00

CPC classification number: H01R43/0484 ,  B23K11/0066 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/10401 ,  H05K2203/0195

Abstract: A machine for setting eyelets and the like in printed circuit boards includes a generally U-shaped frame having a pair of spaced-apart support arms defining a workpiece receiving zone therebetween, a first tool movably mounted in one of the support arms, and a second tool fixedly mounted in the other support arm and axially aligned with the first tool. An adjustable torque screw is connected to the first tool for moving the first tool into aligned contact with the second tool at a pre-determined eyelet setting pressure. The adjustable torque screw insures that the eyelet setting pressure does not exceed the pre-determined eyelet setting pressure despite continued rotation of the adjustable torque screw.

Abstract translation: 用于在印刷电路板中设置孔眼等的机器包括：大致U形框架，其具有限定其间的工件接收区域的一对间隔开的支撑臂，可移动地安装在一个支撑臂中的第一工具，以及第二 工具固定地安装在另一支撑臂中并与第一工具轴向对齐。 可调节的扭矩螺钉连接到第一工具，用于以预定的孔眼设定压力将第一工具移动到与第二工具对齐的接触中。 可调节的扭矩螺钉确保孔径设定压力不会超过预定的孔眼设定压力，尽管可调矩形螺丝继续旋转。

公开(公告)号：US4417297A

公开(公告)日：1983-11-22

申请号：US279687

申请日：1981-07-02

Applicant: Kohei Oyama ,  Hiroyuki Yokouchi

Inventor： Kohei Oyama ,  Hiroyuki Yokouchi

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K1/184 ,  H05K1/145 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2201/10401 ,  H05K2201/10636 ,  H05K2201/2036 ,  H05K3/4046 ,  Y02P70/611

Abstract: In a printed circuit board wherein chip components are mounted in aligned holes provided through two printed substrates stacked over one another, spacer members are interposed between the printed substrates so as to define spaces therebetween around the holes. Since the printed substrates and chip components are movable relative one another due to such spaces, thermal stresses in the joints between the chip components and the printed substrates can be relieved.

Abstract translation: 在其中芯片部件安装在通过彼此堆叠的两个印刷基板提供的对准孔中的印刷电路板中，间隔件被插入在印刷基板之间，以便在孔之间限定空间。 由于印刷基板和芯片部件由于这样的空间而相对移动，所以可以减轻芯片部件和印刷基板之间的接合处的热应力。

公开(公告)号：US4175816A

公开(公告)日：1979-11-27

申请号：US892199

申请日：1978-03-31

Applicant: Robert P. Burr ,  Ronald Morino ,  Raymond J. Keogh

Inventor： Robert P. Burr ,  Ronald Morino ,  Raymond J. Keogh

IPC: H01R9/20 ,  H05K3/10 ,  H05K3/40 ,  H01R5/06

CPC classification number: H01R9/20 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K3/103

Abstract: A multi-wire electrical interconnecting circuit member having a multi-wire matrix of insulated wires mechanically terminated on the multi-wire electrical interconnecting member. Wire retaining members positioned on the multi-wire electrical interconnecting member terminate the wires and establish a gas-tight electrical connection therewith. Each of the wire retaining members includes means for engaging a wire with sufficient force to penetrate any insulation thereon and establish and maintain a gas-tight electrical connection with the conductive core of the wire.

公开(公告)号：US4070077A

公开(公告)日：1978-01-24

申请号：US691765

申请日：1976-06-01

Applicant: Stephen Larry Clark

Inventor： Stephen Larry Clark

IPC: H05K1/11 ,  H01R12/58 ,  H05K3/34 ,  H05K3/40 ,  H05K1/02

CPC classification number: H01R12/526 ,  H05K3/4046 ,  H05K2201/10401 ,  H05K2203/304 ,  H05K3/3447 ,  H05K3/3452

Abstract: A circuit board eyelet is provided for flexibly interconnecting conductive patterns on opposite surfaces of a circuit board. The eyelet comprises a flanged end, an annular body and a plurality of staking legs. The annular body is double walled and has an annular solder flow channel between the walls. The solder flow channel communicates between the staking legs and the flanged end. A solder resist layer or an elastomeric plug in the interior of the body prevents the eyelet from filling with solder, and an annulet in the walls of the annular body provides for flexing of the eyelet connecting conductive patterns through a hole in the circuit board.

Abstract translation: 提供电路板孔眼，用于在电路板的相对表面上灵活地互连导电图案。 孔眼包括法兰端，环形体和多个铆钉腿。 环形体是双壁的，并且在壁之间具有环形焊料流动通道。 焊料流动通道在铆接腿和法兰端之间连通。 本体内部的阻焊层或弹性插塞防止孔眼填充焊料，并且环形体的壁中的环形部件使得通过电路板中的孔连接导电图案的孔眼弯曲。

公开(公告)号：US4015328A

公开(公告)日：1977-04-05

申请号：US582735

申请日：1975-06-02

Applicant: Cletus G. McDonough

Inventor： Cletus G. McDonough

IPC: H05K1/11 ,  H01R4/06 ,  H01R12/58 ,  H01R12/61 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H05K1/04

CPC classification number: H05K3/363 ,  H01R12/523 ,  H01R4/06 ,  H05K3/4046 ,  H05K2201/0305 ,  H05K2201/041 ,  H05K2201/096 ,  H05K2201/10295 ,  H05K2201/10401 ,  H05K3/3447 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4611 ,  Y10T29/49126 ,  Y10T29/49142

Abstract: A method of making a multilayered circuit assembly from a plurality of flat, flexible circuit elements, wherein each circuit element includes a substrate having conductive means to define an electrical path of travel which is formed between a base layer made of insulation material and a cover layer made of insulation material. Each circuit element has a connecting station associated with the conductive means. The method generally includes the steps of forming the conductive means on the base layer of each circuit element, punching a first opening through the conductive means and base layer at a connecting station of each circuit element, soldering the connecting station of each circuit element so that a solid solder pad fills the first opening whereby the solder electrically contacts the conductive means, punching a second opening through the cover layer of each circuit element, securing the cover layer of each circuit element over the base layer and conductive means so that the first opening is generally concentric with the second opening, punching a third opening in each circuit element through the solder pad, stacking a plurality of punched and soldered circuit elements on top of one another so that the third openings are generally concentric, inserting a terminal into the third openings of the stacked circuit elements so that a portion thereof contacts the solder, and staking the terminal so that the other surface thereof forms a cold weld interference fit against the solder.

Abstract translation: 一种从多个平面柔性电路元件制造多层电路组件的方法，其中每个电路元件包括具有导电装置的基板，该基板具有限定形成在由绝缘材料制成的基底层和覆盖层之间的行进电路径 由绝缘材料制成。 每个电路元件具有与导电装置相关联的连接站。 该方法通常包括以下步骤：在每个电路元件的基底层上形成导电装置，在每个电路元件的连接站处冲压通过导电装置和基底层的第一开口，焊接每个电路元件的连接站，使得 固体焊盘填充第一开口，由此焊料与导电装置电接触，冲穿通过每个电路元件的覆盖层的第二开口，将每个电路元件的覆盖层固定在基底层和导电装置上，使得第一开口 通常与第二开口同心，通过焊盘冲压每个电路元件中的第三开口，将多个冲压和焊接的电路元件堆叠在一起，使得第三开口大致同心，将端子插入第三开口 堆叠电路元件的开口，使得其一部分接触焊料，并铆接端子 使得其另一个表面形成与焊料的冷焊缝干涉配合。

公开(公告)号：US3722087A

公开(公告)日：1973-03-27

申请号：US3722087D

申请日：1971-10-15

Applicant: BERG ELECTRONICS INC

Inventor： BERG Q

IPC: H05K3/40 ,  H05K13/04

CPC classification number: H05K3/4046 ,  H05K13/0478 ,  H05K2201/0382 ,  H05K2201/10401 ,  H05K2203/0195 ,  Y10T29/49151 ,  Y10T29/53174

Abstract: Loose piece eyelets are wiped back and forth across the top of a tilted transfer plate having eyelet receiving holes therein. An air flow is maintained through the holes in the transfer plate to seat the eyelets in the holes. A circuit board is positioned in a press on top of an anvil plate and the loaded transfer plate is mounted on top of the circuit board. Closing of the press moves a punch plate toward the transfer plate to force the eyelets from the transfer plate into holes in the circuit board and bring the lead ends of the eyelets into engagement with anvils on the anvil plate to stake the eyelets to the circuit board. Eyelets can be staked to the circuit board in holes off center with respect to the staking tooling.

Abstract translation: 松散的小孔眼穿过其中具有孔眼接收孔的倾斜传递板的顶部来回擦拭。 通过转印板中的孔保持气流，以将孔眼安置在孔中。 电路板位于砧板顶部的压力机中，并且装载的转印板安装在电路板的顶部。 压板的关闭使冲压板朝向转印板移动，以将来自转印板的孔眼压入电路板中的孔中，并使孔眼的引线端部与砧座板上的砧座接合以将孔眼固定到电路板 。 孔可以相对于铆接工具在中心的孔中被铆接到电路板上。

公开(公告)号：US3573707A

公开(公告)日：1971-04-06

申请号：US3573707D

申请日：1969-09-05

Applicant: AMP INC

Inventor： REYNOLDS CHARLES EDWARD

IPC: H01R12/58 ,  H05K1/05 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K13/04 ,  H01B17/20 ,  H05K1/08

CPC classification number: H01R12/58 ,  H05K1/056 ,  H05K3/3447 ,  H05K3/4046 ,  H05K3/445 ,  H05K13/0478 ,  H05K2201/10401 ,  H05K2201/10916

Abstract: Component mounting system for metallic printed circuit boards having insulating coatings on their surfaces is disclosed in which the drilled hole in the metallic board is lined with a thin walled liner of plastic tubing. A metallic receptacle is positioned in the liner so that the liner electrically insulates the receptacle from the metallic portion of the printed circuit board. The lead wire from the component is inserted into the receptacle and the board is solder-dipped to electrically connect the lead wire to a connecting path on the board. The heat from the soldering operation causes the liner to radially expand so that it achieves a tight fit in the hole. The board acts as a heat sink for the components mounted thereon but the board is electrically isolated from the components excepting where it is used as a grounding plane.