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公开(公告)号：US20160299098A1
公开(公告)日：2016-10-13
申请号：US15093174
申请日：2016-04-07
Applicant: Johnson Electric S.A.
Inventor： Steven Eric DEAN
CPC classification number: B29C45/14639 , B29C45/14065 , B29C45/14336 , B29C2045/14122 , H05K3/0014 , H05K3/281 , H05K2201/10151 , H05K2201/10681 , H05K2203/1327 , H05K2203/1545
Abstract: A bio-sensor circuit for detecting characteristics of a substance placed thereupon, the bio-sensor circuit has: a printed circuit having at least one electrically conductive contact sensor on a surface of the printed circuit, the electrically conductive contact sensor including a biochemical agent; and an electrically insulative coating affixed to the surface of the printed circuit, the electrically insulative coating having a well associated with the electrically conductive contact sensor, thereby leaving the electrically conductive contact sensor exposed through the electrically insulative coating, the electrically insulative coating being a resinous compound formed by injection molding. An electrochemical change resulting from the interaction of the substance to be characterized and the biochemical agent creates a detectable electrical potential at the electrically conductive contact sensor. A system and method of creating such a circuit via injection molding is also provided.
Abstract translation: 一种生物传感器电路，用于检测放置在其上的物质的特性，所述生物传感器电路具有：在所述印刷电路的表面上具有至少一个导电接触传感器的印刷电路，所述导电接触传感器包括生物化学试剂; 以及固定在印刷电路表面上的电绝缘涂层，该电绝缘涂层具有与导电接触传感器相关联的良好的孔，从而使该导电接触传感器暴露在该电绝缘涂层中，该电绝缘涂层是一种树脂 化合物通过注射成型形成。 由待表征的物质与生化剂的相互作用产生的电化学变化在导电接触传感器处产生可检测的电位。 还提供了通过注射成型制造这种电路的系统和方法。
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公开(公告)号：US20160219354A1
公开(公告)日：2016-07-28
申请号：US15004669
申请日：2016-01-22
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Il Nam KIM , Won Sang PARK , Yi Joon AHN , Byeong-Hee WON
CPC classification number: H04R1/028 , G02B5/3033 , H04R1/025 , H04R2201/029 , H04R2499/15 , H05K1/147 , H05K2201/056 , H05K2201/10068 , H05K2201/10083 , H05K2201/10128 , H05K2201/10681
Abstract: Provided is a speaker and microphone integrated display panel including: a display panel having a display area and a non-display area surrounding the display area; and a simultaneously convertible film type speaker or film type microphone which is mounted to correspond to an air hole in the non-display area, in which the display panel and the film type speaker or the film type microphone are at least partially integrated so as to be drive-connected.
Abstract translation: 提供了一种扬声器和麦克风集成显示面板，包括：显示面板，具有显示区域和围绕显示区域的非显示区域; 以及安装成对应于非显示区域中的空气孔的同时可转换的薄膜型扬声器或薄膜式麦克风，其中显示面板和胶片型扬声器或薄膜式麦克风至少部分地被集成，以便 被驱动连接。
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公开(公告)号：US20160088726A1
公开(公告)日：2016-03-24
申请号：US14656837
申请日：2015-03-13
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Man Bok JEON
CPC classification number: H05K1/147 , G02F1/13452 , G09G2300/0408 , H01L27/3276 , H01L2251/5338 , H05K1/0281 , H05K2201/09018 , H05K2201/10128 , H05K2201/10136 , H05K2201/10681
Abstract: A curved display device includes a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and an output wire unit connected to the driving chips, a printed circuit board (PCB) connected to the input wire unit of the semiconductor chip package, and a display panel including a display unit and a pad unit connected to the output wire unit of the semiconductor chip package, wherein the display panel, the semiconductor chip package, and the PCB are bendable in a first direction, and the driving chips of the of the semiconductor chip package are separated from each other in the first direction.
Abstract translation: 一种弯曲显示装置包括：半导体芯片封装，包括基膜，基膜上的多个驱动芯片，以及连接到驱动芯片的输入线单元和输出线单元，连接到驱动芯片的印刷电路板 所述半导体芯片封装的输入线单元以及连接到所述半导体芯片封装的输出线单元的显示单元和焊盘单元的显示面板，其中所述显示面板，所述半导体芯片封装和所述PCB可弯曲成 第一方向，并且半导体芯片封装的驱动芯片在第一方向上彼此分离。
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公开(公告)号：US09277669B2
公开(公告)日：2016-03-01
申请号：US13938887
申请日：2013-07-10
Applicant: LG DISPLAY CO., LTD.
Inventor： ChungWan Oh , HoWon Son
IPC: H05K1/00 , H05K1/18 , H05K7/06 , G02F1/1345 , H05K3/36 , H05K1/11 , H05K7/12 , H05K7/00 , G02F1/167 , G02F1/13 , G02F1/1333
CPC classification number: H05K7/06 , G02F1/1309 , G02F1/133305 , G02F1/13452 , G02F1/13454 , G02F1/13458 , G02F1/167 , H05K1/118 , H05K1/147 , H05K1/189 , H05K3/361 , H05K2201/10128 , H05K2201/10681
Abstract: A plastic display panel and a flat panel displaying having the plastic display panel are discussed. The plastic display panel according to an embodiment a display area configured to display an image and including a plurality of panel electrodes, and a non-display area in which a plurality of link lines connected to the panel electrodes and a driving element are provided. The display area and the non-display area are provided in a plastic base substrate. A plurality of link pads, electrically connected to the respective link lines, are provided in a bonding part adhered to the driving element in the non-display area, and at least one via hole is provided in the bonding part for exposing a portion of the plastic base substrate.
Abstract translation: 讨论了具有塑料显示面板的塑料显示面板和平板显示器。 根据实施例的塑料显示面板，被配置为显示图像并且包括多个面板电极的显示区域以及设置有连接到面板电极和驱动元件的多个连接线的非显示区域。 显示区域和非显示区域设置在塑料基板中。 电连接到各个连接线的多个连接焊盘设置在粘附在非显示区域中的驱动元件的接合部分中，并且至少一个通孔设置在接合部分中，以暴露部分 塑料基底。
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公开(公告)号：US20150189768A1
公开(公告)日：2015-07-02
申请号：US14577946
申请日：2014-12-19
Applicant: LG Display Co., Ltd.
Inventor： Katsuhiko Kishida , Hongsik Kim , Seunghwan Shin , Chimyung Ahn , Daeyoung Seo
CPC classification number: H05K1/147 , H05K1/028 , H05K1/189 , H05K2201/09063 , H05K2201/10136 , H05K2201/10681
Abstract: Embodiment related to a curved display including a curved panel, a printed circuit board separated from the curved panel, and a plurality of flexible films electrically connecting the curved panel and the printed circuit board. The lengths of the flexible films is increased as the flexible films approach an edge of the curved panel.
Abstract translation: 与弯曲显示器相关的实施例，包括弯曲面板，与曲面板分离的印刷电路板，以及电连接弯曲面板和印刷电路板的多个柔性膜。 当柔性膜接近弯曲面板的边缘时，柔性膜的长度增加。
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Patent Agency Ranking
公开(公告)号：US20140306348A1
公开(公告)日：2014-10-16
申请号：US14021302
申请日：2013-09-09
Applicant: Samsung Display Co., Ltd.
Inventor： Hyeong-Cheol Ahn
IPC: H01L23/00
CPC classification number: H01L23/562 , G02F1/13452 , H01L23/4985 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K1/0281 , H05K1/189 , H05K3/3452 , H05K2201/10128 , H05K2201/10681 , H05K2201/2009 , H05K2203/0577 , H01L2924/00
Abstract: A flexible chip on film includes a base insulating layer, a metal layer disposed on an upper surface of the base insulating layer and including a circuit pattern, an integrated circuit chip disposed on an upper surface of the metal layer and electrically connected to the metal layer, a solder resist layer disposed on the metal layer and insulated from the integrated circuit chip, and a reinforcing layer disposed on an upper surface of the solder resist layer. When the chip on film COF is bent, a neutral surface, in which a vector sum of a tensile force and a compressive force becomes substantially zero, is placed in the metal layer.
Abstract translation: 膜上的柔性芯片包括基底绝缘层，设置在基底绝缘层的上表面上并包括电路图案的金属层，设置在金属层的上表面上并电连接到金属层的集成电路芯片 设置在金属层上并与集成电路芯片绝缘的阻焊层，以及设置在阻焊层的上表面上的加强层。 当膜COF上的芯片弯曲时，其中拉伸力和压缩力的矢量和变为基本为零的中性表面被放置在金属层中。
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公开(公告)号：US08792250B2
公开(公告)日：2014-07-29
申请号：US13718589
申请日：2012-12-18
Applicant: Cree, Inc.
Inventor： Gregory S. Bibee
CPC classification number: H05K1/18 , F21V19/005 , F21Y2115/10 , H01R12/7082 , H05K1/141 , H05K1/147 , H05K3/305 , H05K3/363 , H05K2201/10106 , H05K2201/10681
Abstract: A connector for connecting surface mount devices, such as light emitting diodes (LEDs), to printed circuit boards (PCBs). The connector may be prepackage with an LED assembly or on a PCB to which the LED assembly will be mounted. Connection complexity can be moved from the PCB to the connector, and LED assemblies may be customized differently for different customers. One to many and many to one connections are readily supported with variations on the connector.
Abstract translation: 用于将诸如发光二极管（LED）的表面贴装装置连接到印刷电路板（PCB）的连接器。 连接器可以预先包装LED组件或LED组件将被安装到的PCB上。 连接复杂性可以从PCB移动到连接器，并且LED组件可以针对不同的客户进行不同的定制。 通过连接器上的变化容易地支持一对多和多对一连接。
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公开(公告)号：US20140029219A1
公开(公告)日：2014-01-30
申请号：US13938887
申请日：2013-07-10
Applicant: LG DISPLAY CO., LTD.
Inventor： ChungWan OH , HoWon SON
IPC: H05K7/06
CPC classification number: H05K7/06 , G02F1/1309 , G02F1/133305 , G02F1/13452 , G02F1/13454 , G02F1/13458 , G02F1/167 , H05K1/118 , H05K1/147 , H05K1/189 , H05K3/361 , H05K2201/10128 , H05K2201/10681
Abstract: A plastic display panel and a flat panel displaying having the plastic display panel are discussed. The plastic display panel according to an embodiment a display area configured to display an image and including a plurality of panel electrodes, and a non-display area in which a plurality of link lines connected to the panel electrodes and a driving element are provided. The display area and the non-display area are provided in a plastic base substrate. A plurality of link pads, electrically connected to the respective link lines, are provided in a bonding part adhered to the driving element in the non-display area, and at least one via hole is provided in the bonding part for exposing a portion of the plastic base substrate.
Abstract translation: 讨论了具有塑料显示面板的塑料显示面板和平板显示器。 根据实施例的塑料显示面板，被配置为显示图像并且包括多个面板电极的显示区域以及设置有连接到面板电极和驱动元件的多个连接线的非显示区域。 显示区域和非显示区域设置在塑料基板中。 电连接到各个连接线的多个连接焊盘设置在粘附在非显示区域中的驱动元件的接合部分中，并且至少一个通孔设置在接合部分中，以暴露部分 塑料基底。
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公开(公告)号：US20130341597A1
公开(公告)日：2013-12-26
申请号：US13654317
申请日：2012-10-17
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Hak-Gyu Kim
IPC: H01L27/32
CPC classification number: H01L27/3225 , H01L27/3276 , H05K1/028 , H05K1/147 , H05K1/189 , H05K2201/056 , H05K2201/10128 , H05K2201/10681
Abstract: An organic light emitting diode (OLED) display including a display panel, a chip on film, and a printed circuit (PCB) is disclosed. In one embodiment, the display panel includes a display area having an OLED and a pixel circuit, and a pad area in an outer side of the display area. The chip on film is connected to the pad area, is bent toward a non-luminescent surface of the display panel, and include an integrated circuit chip. The PCB includes at least a part overlapping with the chip on film in an outer side of the non-luminescent surface of the display panel, and an opening for receiving the integrated circuit.
Abstract translation: 公开了一种有机发光二极管（OLED）显示器，包括显示面板，胶片芯片和印刷电路（PCB）。 在一个实施例中，显示面板包括具有OLED和像素电路的显示区域和在显示区域的外侧的焊盘区域。 薄膜上的芯片连接到焊盘区域，朝向显示面板的非发光表面弯曲，并且包括集成电路芯片。 PCB包括与显示面板的非发光面的外侧的膜上的芯片重叠的部分和用于接收集成电路的开口的至少一部分。
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20.发明申请Test Pad Structure, A Pad Structure For Inspecting A Semiconductor Chip And A Wiring Substrate For A Tape Package Having The Same 审中-公开测试垫结构，用于检查半导体芯片的焊盘结构和具有相同的带封装的接线基板公开(公告)号：US20130127486A1
公开(公告)日：2013-05-23
申请号：US13743855
申请日：2013-01-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： So-Young LIM , Sang-Heui LEE
IPC: G01R1/06
CPC classification number: G01R31/2884 , G01R1/06 , G09G3/006 , H01L22/32 , H01L23/4985 , H01L2924/0002 , H05K1/0268 , H05K1/189 , H05K3/0052 , H05K2201/10681 , H01L2924/00
Abstract: A test pad structure may include a plurality of test pads and a plurality of connection leads. A plurality of the test pads may be sequentially arranged from a wiring pattern on a substrate and arranged in rows parallel with one another. The plurality of the test pads may include a first group of test pads having at least one pad and a second group of test pads having at least two pads. A plurality of the connection leads may extend from end portions of the wiring pattern to be connected to the plurality of test pads. A plurality of the connection leads may include at least one inner lead passing between the at least two pads of the second group of the test pads and arranged in a first row closest to the first group of the test pads. The at least one inner lead may be connected to at least one pad of the at least two pads of the second group of the test pads arranged in a second row next to the first row.
Abstract translation: 测试焊盘结构可以包括多个测试焊盘和多个连接引线。 多个测试焊盘可以从衬底上的布线图形顺序地布置并且彼此平行布置。 多个测试焊盘可以包括具有至少一个焊盘的第一组测试焊盘和具有至少两个焊盘的第二组测试焊盘。 多个连接引线可以从要连接到多个测试焊盘的布线图案的端部延伸。 多个连接引线可以包括通过第二组测试焊盘的至少两个焊盘之间并且布置在最靠近第一组测试焊盘的第一行中的至少一个内引线。 所述至少一个内部引线可以连接到布置在第一行旁边的第二行中的第二组测试焊盘的至少两个焊盘中的至少一个焊盘。
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