公开(公告)号：US20190191565A1

公开(公告)日：2019-06-20

申请号：US16283858

申请日：2019-02-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro Oka ,  Yuki Takemori ,  Kazuo Kishida ,  Hiromichi Kawakami ,  Yukio Yamamoto ,  Kensuke Otake

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H05K1/11 ,  H05K1/03 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/4864 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13017 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/014 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/18 ,  H05K3/1216 ,  H05K3/26 ,  H05K3/34 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/10795 ,  H05K2201/1081

Abstract: An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.

公开(公告)号：US20180188290A1

公开(公告)日：2018-07-05

申请号：US15741213

申请日：2016-07-04

Applicant: OKINS ELECTRONICS CO.,LTD

Inventor： Sung Gye PARK ,  Jin Kook JUN

IPC: G01R3/00 ,  G01R1/04 ,  G01R31/28 ,  H05K3/10 ,  H05K3/28 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: G01R3/00 ,  G01R1/0433 ,  G01R31/2863 ,  G01R31/2896 ,  H05K1/0268 ,  H05K1/028 ,  H05K1/111 ,  H05K3/103 ,  H05K3/28 ,  H05K3/285 ,  H05K3/3484 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2201/10757 ,  H05K2201/10795 ,  H05K2201/10856 ,  H05K2203/041 ,  H05K2203/1327 ,  H05K2203/166

Abstract: A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.

公开(公告)号：US20130283608A1

公开(公告)日：2013-10-31

申请号：US13926069

申请日：2013-06-25

Applicant: Interplex Industries, Inc.

Inventor： Jack Seidler

IPC: H05K3/00

CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

Abstract translation: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长的可回流构件被推到多个触点的尾部。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。

公开(公告)号：US08379402B2

公开(公告)日：2013-02-19

申请号：US12633443

申请日：2009-12-08

Applicant: Kazuhiro Oshima ,  Yoshikazu Hirabayashi ,  Shigeo Nakajima ,  Yoshitaka Matsushita

Inventor： Kazuhiro Oshima ,  Yoshikazu Hirabayashi ,  Shigeo Nakajima ,  Yoshitaka Matsushita

IPC: H01R9/00

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.

Abstract translation: 提供具有引脚的布线板。 具有引线销的布线板包括形成在布线板上的连接焊盘，引导销通过导电材料接合到该连接焊盘。 引导销包括：轴部; 头部，其设置在所述轴部的一端; 形成在所述头部的与所述连接垫相对的表面侧的突出部; 以及形成在所述头部与所述轴部的基部之间的第一锥形部。

公开(公告)号：US20090317948A1

公开(公告)日：2009-12-24

申请号：US12432075

申请日：2009-04-29

Applicant: Hiroyuki NAKAMURA ,  Atsushi NISHIKIZAWA ,  Nobuya KOIKE

Inventor： Hiroyuki NAKAMURA ,  Atsushi NISHIKIZAWA ,  Nobuya KOIKE

IPC: H01L21/50 ,  H01L21/60

CPC classification number: H01L21/4835 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method is provided for manufacturing a QFN type semiconductor integrated circuit device using a multi-device lead frame having a tie bar for tying external end portions of plural leads, wherein sealing resin filled between an outer periphery of a mold cavity and the tie bar is removed by a laser and thereafter a surface treatment such as solder plating is performed.

Abstract translation: 提供一种使用具有用于捆扎多个引线的外端部的连接杆的多器件引线框架来制造QFN型半导体集成电路器件的方法，其中填充在模腔的外周和连接杆之间的密封树脂是 通过激光去除，然后进行诸如焊料镀覆的表面处理。

公开(公告)号：US20090008759A1

公开(公告)日：2009-01-08

申请号：US12215168

申请日：2008-06-25

Applicant: Tomoyuki Yoshino

Inventor： Tomoyuki Yoshino

IPC: H01L23/495 ,  H01L21/00

CPC classification number: H05K3/3426 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K2201/10689 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00

Abstract: Provided is a semiconductor device having an element covered with a resin mold and a metal lead protruding from the resin mold in which a lead-tip portion thereof is entirely covered by solder plating and in which a lead-tip end surface, which is not covered by solder plating, has an area less than half of a cross-sectional area of the metal lead, whereby solder wettability of the metal lead is improved and a bonding strength to a circuit board is also improved.

Abstract translation: 提供一种半导体器件，其具有被树脂模具覆盖的元件和从树脂模具突出的金属引线，其中引线顶端部分被焊接电镀完全覆盖，并且其中未覆盖的引线端面表面 通过焊料镀覆，具有小于金属引线横截面面积的一半的面积，从而提高了金属引线的焊料润湿性，并且还提高了与电路板的接合强度。

公开(公告)号：US07267558B1

公开(公告)日：2007-09-11

申请号：US11509535

申请日：2006-08-24

Applicant: Igor Polnyi

Inventor： Igor Polnyi

IPC: H01R12/00

CPC classification number: H05K3/325 ,  H05K2201/0969 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2203/167

Abstract: An electrical connector includes an insulative housing adapted to engage a conductive contact (20). The conductive contact has a tail end, wherein the tail end (22) is angled and has a generally dished shape such that at least a portion of the tail end terminates within a hole (10) in a contact pad (12) of a circuit board (1). The conductive contact tail end in a dished shape has the advantages of facilitating the guiding of the tail end into or out of the hole of the circuit board during wipe actions, without removing gold plated layer, and of achieving a reliable travel of the tail end across the hole of the contact pad of the circuit board.

Abstract translation: 电连接器包括适于接合导电触头（20）的绝缘外壳。 导电接触具有尾端，其中尾端（22）成角度并且具有大体上的碟形形状，使得尾端的至少一部分终止于电路的接触焊盘（12）内的孔（10）内 董事会（1）。 导电接触尾端呈碟形状的优点在于，在擦除动作期间，便于将尾端引入或移出电路板的孔，而无需去除镀金层，并且实现尾端的可靠行进 穿过电路板接触垫的孔。

公开(公告)号：US5654878A

公开(公告)日：1997-08-05

申请号：US489642

申请日：1995-06-12

Applicant: Masami Sasao ,  Hideyuki Hirata

Inventor： Masami Sasao ,  Hideyuki Hirata

IPC: H01R12/55 ,  H01R43/20 ,  H05K3/30 ,  H01L23/48

CPC classification number: H05K3/308 ,  H01R12/716 ,  H01R43/205 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10795 ,  H05K2201/10863 ,  H05K2203/167

Abstract: An improved connector terminal has a profile which facilitates insertion into engagement holes on a circuit board and increases resistance to deformation. The terminals may be part of an assembly which includes a series of terminals arranged in a spaced-apart array. Each has a solder tail portion defined by a straight edge (11) proximate to the centerline (9) and a slanted edge (12) which diagonally extends from the other side and which traverses the centerline (9) to intersect with the straight edge (11) to thereby form an acute angle at the tip (E) of the terminal near the centerline (9) to provide comparable positioning allowances on the opposite sides of the centerline (9) to facilitate mounting of the terminals on a circuit board. The acute angle point is advantageous to the optical measurement of terminal intervals for the quality control.

Abstract translation: 改进的连接器端子具有易于插入到电路板上的接合孔中并且增加抗变形性的轮廓。 端子可以是组件的一部分，其包括以间隔开的阵列布置的一系列端子。 每个具有由靠近中心线（9）的直边缘（11）限定的焊接尾部和从另一侧对角地延伸并且横过中心线（9）以与直边缘相交的倾斜边缘（12） 11），从而在靠近中心线（9）的端子的尖端（E）处形成锐角，以在中心线（9）的相对侧上提供相当的定位余量，以便于将端子安装在电路板上。 锐角点对质量控制的终端间隔的光学测量是有利的。

公开(公告)号：US11674977B2

公开(公告)日：2023-06-13

申请号：US17682769

申请日：2022-02-28

Applicant: JF MICROTECHNOLOGY SDN. BHD

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee ,  Grace Ann Nee Yee

IPC: H05K1/02 ,  G01R1/04 ,  G01R1/073

CPC classification number: G01R1/0466 ,  G01R1/0735 ,  G01R1/07364 ,  H05K1/0268 ,  H05K1/0283 ,  H05K1/0296 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10704 ,  H05K2201/10795

Abstract: An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped concave surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

公开(公告)号：US09775242B2

公开(公告)日：2017-09-26

申请号：US15005589

申请日：2016-01-25

Applicant: Intel Corporation

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H01L23/488 ,  H01L21/60 ,  H05K1/11 ,  H01L23/48 ,  H05K3/10 ,  H01L21/48 ,  H05K5/00 ,  H01R13/04 ,  H01L23/498 ,  H05K3/40 ,  H01L23/373 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.