Abstract:
A socket may be formed with socket pins that include two spring biased arms biased to extend away from one another. The arms may be provided with tapered upper surfaces that engage contact holes on a pin guide 18 of an integrated circuit package, camming the socket pin arms together. The pin guide may have a tapered via structure that expands as it extends into the package. Thus, as the spring arms spread apart inside the pin guide, they may rotate through an angle which causes contacting surfaces on the spring arms and the pin guide to be parallel, creating good surface contact.
Abstract:
A terminal (10) has two high-rigidity portions (14) for resiliently contacting the inner surface of a through hole (23). A low-rigidity portion (17) spans between the high-rigidity portions (14) and is compressively deformable along its spanning direction. The low-rigidity portion (17) has an easily breakable portion (19) that breaks when a stress acting during the insertion of the terminal (10) into the through hole (23) exceeds a resiliency limit. Thus, the terminal (10) is held resiliently in contact with a large diameter through hole (23) by resilient forces of the two high-rigidity portions (14) and a resilient force of the low-rigidity portion (17). However, the terminal (10) is held resiliently in contact with a small diameter through hole (23) only by the resilient forces of the two high-rigidity portions (14).
Abstract:
The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.
Abstract:
A self-centering press-fit pin that is typically used to secure components to a printed circuit board (PCB). The device includes more than one leg, the legs providing connection points for the component on which the pins are installed. The pin is formed so that the legs act as leaf springs to securely hold the connector in place in the proper installation hole in the board on which the component is installed. The pins are stamped from sheet metal with a progressive die process. By changing the amount of flexion in the legs of the pin, the pressure required to insert the pin into, and remove the pin from, a connection hole can be varied.
Abstract:
A press-fit pin for use with a printed circuit board assembly consisting of two opposed printed circuit boards, the press-fit pin having an upper first press-fit section and a lower second press-fit section. The first press-fit section and the second press-fit section are disposed so that the first press-fit section enters the first through-hole in the first printed circuit board before the second press-fit section enters the second through-hole in the second printed circuit board. As a result, the peaks of the forces required to press the first press-fit section and second press-fit section into place are staggered and do not coincide, resulting in a reduction in peak total force required and thus reducing the danger of bending the press-fit pin during insertion in the printed circuit boards.
Abstract:
A component lead tip protruding from a hole of a circuit board is split and displaced in order to attach the component to the circuit board. Trimming of the lead to a preferred length generally simultaneously with the splitting is also possible.
Abstract:
A thru-hole insertable terminal (10, 50, 60) includes an upper shank portion (12, 52, 66) preferably adapted for soldered securement to an end electrode (24) of a component (20), such as a capacitor. A lower shank portion (14, 54, 68) is dimensioned and adapted for minimal initial contact insertion into, and the temporary securement thereafter within, an oversized thru-hole (26, 58, 62) of a supporting substrate, such as a circuit board (28, 59, 64). At least one upwardly extending free-ended tab (32, 56, 72, 74) is formed in the lower terminal shank portion (14, 54, 68), and is oriented in the major plane thereof until after the insertion thereof within an associated substrate-formed thru-hole (26, 58, 62). Stop means (14b, 14c, 54b, 54c, 68b, 68c) also formed in the lower terminal shank portion is adapted to position the upper free end of the tab at an elevation preferably below the upper open end of a confining thru-hole. The tab (32, 56, 72, 74) is also dimensioned such that, when thusly positioned, the lower integral end thereof extends at least to the lower open end of the thru-hole. This results in the upper free end of the tab being pivoted against the sidewall of the confining thru-hole in response to a then downwardly protruding end region (14d, 54d, 68d) of the lower terminal shank portion being clinched against the underside of the supporting substrate (28, 59, 64). The thusly pivoted tab advantageously not only facilitates the temporary securement of the terminal within the associated thru-hole, but the establishment thereafter of a reliable, permanent soldered connection therebetween.
Abstract:
An electrical terminal includes a mounting portion for insertion in a hole in a circuit board, a rectangular seating portion joining the mounting portion including a pair of shoulders for engaging a surface of a circuit board when the mounting portion is inserted in a hole in a circuit board. The seating portion includes a hole transverse to the mounting portion, and a cold-formed solder element extending through the hole. Each end of the solder element is cold formed to provide a mass of solder on each surface of the seating portion.