Patent search cpc:"H05K2201/10878" Page 2

11.

发明申请
Press-fit pin and board structure 审中-公开
Title translation: 压配销和板结构

公开(公告)号：US20080207015A1

公开(公告)日：2008-08-28

申请号：US12003996

申请日：2008-01-04

Applicant: Junya Sueyoshi

Inventor： Junya Sueyoshi

IPC: H01R12/00

CPC classification number: H05K3/308 , H01R12/585 , H05K3/325 , H05K2201/092 , H05K2201/10189 , H05K2201/10303 , H05K2201/1059 , H05K2201/10878

Abstract: Provided is a printed wiring board formed with a through-hole into which a press-fit pin is press-fitted. The printed wiring board includes at least one signal transmission layer, a signal transmission wiring pattern formed in the signal transmission layer, and an electrode portion of the signal transmission wiring pattern exposed at an inner circumferential surface of the through-hole. The electrode portion is not formed covering the entire inner circumferential surface of the through-hole but at a part of the inner circumferential surface of the through-hole.

Abstract translation: 提供了一种形成有压配合销的通孔的印刷线路板。印刷布线板包括至少一个信号传输层，形成在信号传输层中的信号传输布线图案，以及在通孔的内周表面处暴露的信号传输布线图案的电极部分。电极部不形成为覆盖通孔的整个内周面，而是形成在通孔的内周面的一部分。

12.

发明申请
PROBE CARD ASSEMBLY AND KIT 失效
Title translation: 探针卡大会和工具包

公开(公告)号：US20080180121A1

公开(公告)日：2008-07-31

申请号：US12060753

申请日：2008-04-01

Applicant: Igor Y. Khandros , A. Nicholas Sporck , Benjamin N. Eldrdge

Inventor： Igor Y. Khandros , A. Nicholas Sporck , Benjamin N. Eldrdge

IPC: G01R1/073

CPC classification number: H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/07342 , G01R1/07364 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45014 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract translation: 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。硅空间变压器可以以非常紧的间距以与半导体器件的间距相当的主要触点阵列制造。一个优选的主要接触是弹性弹簧接触。空间变压器中的导电元件以更放松的间距被路由到第二触点。在一个优选实施例中，第二触头适于直接连接带状电缆，带状电缆又可连接以提供与每个主触点的选择性连接。硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

13.

发明授权
Contact carriers (tiles) for populating larger substrates with spring contacts 失效
Title translation: 接触托架（瓷砖），用于通过弹簧触点填充较大的基板

公开(公告)号：US07347702B2

公开(公告)日：2008-03-25

申请号：US11561297

申请日：2006-11-17

Applicant: Benjamin N. Eldridge , Thomas H. Dozier, II , Igor Y. Khandros , Gaetan L. Mathieu , William D. Smith

Inventor： Benjamin N. Eldridge , Thomas H. Dozier, II , Igor Y. Khandros , Gaetan L. Mathieu , William D. Smith

IPC: H01R12/00

CPC classification number: H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49126 , Y10T29/49208 , Y10T29/49222 , H01L2924/00 , H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。接触结构附着在第一基底上或形成在第一基底上。第一衬底附接到比第一衬底大的第二衬底。可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

14.

发明申请
Lead terminal leadout type electronic component, manufacturing method therefor and electronic equipment 审中-公开
Title translation: 引线端子引出型电子元件及其制造方法和电子设备

公开(公告)号：US20070138373A1

公开(公告)日：2007-06-21

申请号：US11604839

申请日：2006-11-28

Applicant: Hiroshi Yoshida

Inventor： Hiroshi Yoshida

IPC: G01J1/32

CPC classification number: G01J1/02 , G01J1/0271 , H01L2224/05554 , H01L2224/32245 , H01L2224/45144 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/3025 , H05K3/308 , H05K3/3447 , H05K2201/10121 , H05K2201/10454 , H05K2201/10878 , H01L2924/00

Abstract: The lead terminal leadout type electronic component of the present invention has a component main body and a plurality of lead terminals led out of the component main body and is mounted on a mount board in a floating state in which the lead terminals are inserted into corresponding insertion holes of the mount board partway along lengths thereof. At least two lead terminals of the plurality of lead terminals are more largely deformed than opening dimensions of the corresponding insertion holes mutually oppositely in a direction along a surface of the mount board in a natural state. When the plurality of lead terminals are inserted into the corresponding insertion holes, the electronic component stands upright with respect to the mount board due to spring forces of said at least two lead terminals which is going to return to the natural state.

Abstract translation: 本发明的引线端子引出型电子部件具有从部件主体引出的部件主体和多个引线端子，并且以浮置状态安装在安装基板上，其中引线端子插入相应的插入件安装板的沿着其长度的一部分的孔。多个引线端子的至少两个引线端子在自然状态下比沿着安装板的表面的方向相对地相对地插入孔的开口尺寸更大程度上变形。当多个引线端子插入到相应的插入孔中时，由于将要返回到自然状态的所述至少两个引线端子的弹簧力，电子部件相对于安装板立起。

15.

发明申请
Contact Carriers (Tiles) For Populating Larger Substrates With Spring Contacts 失效
Title translation: 联系承运人（瓷砖）用于填充较大的基板与弹簧触点

公开(公告)号：US20070075715A1

公开(公告)日：2007-04-05

申请号：US11561297

申请日：2006-11-17

Applicant: Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Thomas Dozier , William Smith

Inventor： Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Thomas Dozier , William Smith

IPC: G01R31/02

CPC classification number: H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49126 , Y10T29/49208 , Y10T29/49222 , H01L2924/00 , H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。接触结构附着在第一基底上或形成在第一基底上。第一衬底附接到比第一衬底大的第二衬底。可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

16.

发明申请
Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology 审中-公开
Title translation: 在半导体器件上安装弹簧元件和晶圆级测试方法

公开(公告)号：US20070046313A1

公开(公告)日：2007-03-01

申请号：US11552856

申请日：2006-10-25

Applicant: Benjamin Eldridge , Gary Grube , Igor Khandros , Ga tan Mathieu

Inventor： Benjamin Eldridge , Gary Grube , Igor Khandros , Ga tan Mathieu

IPC: G01R31/26

CPC classification number: H05K7/1069 , B23K1/0008 , B23K20/004 , B23K2101/40 , C23C18/1605 , C23C18/165 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/07342 , G01R31/2856 , G01R31/2863 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/6835 , H01L22/20 , H01L23/49811 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/94 , H01L25/0652 , H01L25/16 , H01L2223/54453 , H01L2224/02311 , H01L2224/03912 , H01L2224/0401 , H01L2224/04042 , H01L2224/0558 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/1184 , H01L2224/13022 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13582 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45572 , H01L2224/45599 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48844 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/83851 , H01L2224/85201 , H01L2224/85205 , H01L2224/90 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/20104 , H01L2924/20105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10S977/712 , Y10S977/723 , Y10T29/49004 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , Y10T29/49171 , Y10T29/49204 , Y10T29/49208 , Y10T29/4922 , Y10T29/49812 , Y10T428/12396 , Y10T428/12528 , H01L2224/13099 , H01L2924/00 , H01L2224/48824 , H01L2224/48744 , H01L2224/29099 , H01L2224/29075 , H01L2224/85399 , H01L2924/206

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

17.

发明授权
Mounting spring elements on semiconductor devices, and wafer-level testing methodology 失效
Title translation: 在半导体器件上安装弹簧元件，以及晶圆级测试方法

公开(公告)号：US07142000B2

公开(公告)日：2006-11-28

申请号：US10673686

申请日：2003-09-29

Applicant: Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu

IPC: G01R31/28 , G01R1/073

CPC classification number: H05K7/1069 , B23K1/0008 , B23K20/004 , B23K2101/40 , C23C18/1605 , C23C18/165 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/07342 , G01R31/2856 , G01R31/2863 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/6835 , H01L22/20 , H01L23/49811 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/94 , H01L25/0652 , H01L25/16 , H01L2223/54453 , H01L2224/02311 , H01L2224/03912 , H01L2224/0401 , H01L2224/04042 , H01L2224/0558 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/1184 , H01L2224/13022 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13582 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45572 , H01L2224/45599 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48844 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/83851 , H01L2224/85201 , H01L2224/85205 , H01L2224/90 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/20104 , H01L2924/20105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10S977/712 , Y10S977/723 , Y10T29/49004 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , Y10T29/49171 , Y10T29/49204 , Y10T29/49208 , Y10T29/4922 , Y10T29/49812 , Y10T428/12396 , Y10T428/12528 , H01L2224/13099 , H01L2924/00 , H01L2224/48824 , H01L2224/48744 , H01L2224/29099 , H01L2224/29075 , H01L2224/85399

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

18.

发明申请
Probe card assembly 失效
Title translation: 探头卡组合

公开(公告)号：US20050035347A1

公开(公告)日：2005-02-17

申请号：US10889334

申请日：2004-07-12

Applicant: Igor Khandros , A. Sporck , Benjamin Eldridge

Inventor： Igor Khandros , A. Sporck , Benjamin Eldridge

IPC: B23K1/00 , B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10 , H01L23/58

CPC classification number: H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/07342 , G01R1/07364 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45014 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4092 , H05K7/1069 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract translation: 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。一个优选的主要接触是弹性弹簧接触。空间变压器中的导电元件以更放松的间距被路由到第二触点。在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。