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    Porous power and ground planes for reduced PCB delamination and better reliability
    192.
    发明申请
    Porous power and ground planes for reduced PCB delamination and better reliability 失效
    多功能电源和接地平面可降低PCB分层和更好的可靠性

    公开(公告)号：US20030196749A1

    公开(公告)日：2003-10-23

    申请号：US10430989

    申请日：2003-05-06

    Inventor： Robert M. Japp ,  Mark D. Poliks

    IPC: B32B031/00

    CPC classification number: H05K3/38 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0769 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2203/1131 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1052 ,  Y10T428/24273 ,  Y10T428/24917

    Abstract: Power and ground planes that are used in Printed Circuit Boards (PCBs) and that comprise porous, conductive materials are disclosed. Using porous power and ground plane materials in PCBs allows liquids (e.g., water and/or other solvents) to pass through the power and ground planes, thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filament growth and delamination of insulators. Porous conductive materials suitable for use in PCBs may be formed by using metal-coated organic cloths (such as polyester or liquid crystal polymers) or fabrics (such as those made from carbon/graphite or glass fibers), using metal wire mesh instead of metal sheets, using sintered metal, or making metal sheets porous by forming an array of holes in the metal sheets. Fabrics and mesh may be woven or random. If an array of holes is formed in a metal sheet, such an array may be formed with no additional processing steps than are performed using conventional PCB assembly methods.

    Abstract translation: 公开了在印刷电路板（PCB）中使用并且包含多孔导电材料的电源和接地层。 在PCB中使用多孔电源和接地平面材料可以使液体（例如水和/或其他溶剂）通过电源和接地层，从而减少由阴极/阳极细丝引起的PCB（或PCBs用作层压芯片载体）的故障 绝缘子的生长和分层。 适用于PCB的多孔导电材料可以通过使用金属涂布的有机布（例如聚酯或液晶聚合物）或织物（例如由碳/石墨或玻璃纤维制成的那些）形成，使用金属丝网代替金属 使用烧结金属，或者通过在金属板中形成孔阵列来制造多孔的金属片。 织物和网可以编织或随机。 如果在金属板中形成孔阵列，则可以形成这样的阵列，而不需要使用常规PCB组装方法执行的附加处理步骤。

    Method for manufacturing a printed circuit board substrate
    193.
    发明授权
    Method for manufacturing a printed circuit board substrate 失效
    印刷电路板基板的制造方法

    公开(公告)号：US06599561B2

    公开(公告)日：2003-07-29

    申请号：US10010675

    申请日：2001-11-30

    Applicant: Richard Dow ,  Tim W. Ellis ,  David T. Beatson ,  Michael Hillebrand

    Inventor： Richard Dow ,  Tim W. Ellis ,  David T. Beatson ,  Michael Hillebrand

    IPC: B05D512

    CPC classification number: D03D15/0011 ,  D03D1/0082 ,  D03D15/00 ,  D03D15/0066 ,  D03D15/02 ,  D10B2101/06 ,  D10B2101/20 ,  D10B2321/042 ,  D10B2331/021 ,  D10B2331/04 ,  D10B2401/16 ,  H05K1/0366 ,  H05K3/045 ,  H05K3/4038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49162 ,  Y10T29/49215 ,  Y10T428/24917

    Abstract: An inexpensive and high throughput process for manufacturing a printed circuit board (PCB) substrate includes first weaving a plurality of electrically non-conductive strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric with an upper surface and a lower surface. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planed. The planing step segments the electrically conductive strand(s) and forms a PCB substrate that includes a planarized cured fabric with upper and lower planed surfaces and a plurality of electrically conductive strand segments extending from the upper planed surface to the lower planed surface. Since each of the electrically conductive strand segments extends from the upper planed surface to the lower planed surface, the segments function as electrically conductive vias of the PCB substrate. Also, a PCB substrate that includes a planarized woven fabric with a cured resin material impregnated therein. The planarized woven fabric includes planed upper and lower surfaces and a plurality of integrally formed electrically conductive strand segments (e.g., copper wire segments) extending from the upper planed surface to the lower planed surface. Since the electrically conductive strand segments were formed integrally with the remainder of the planarized woven fabric, PCB substrates are of high mechanical stability.

    Abstract translation: 用于制造印刷电路板（PCB）基板的廉价且高通量的方法包括首先编织多根非导电线（例如，玻璃纤维纱线）和至少一根导电线（例如铜线），以形成 具有上表面和下表面的无纺织物。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 固化织物的上表面和下表面随后被平面化。 所述刨削步骤分段所述导电线并形成PCB衬底，所述PCB衬底包括具有上和下平面表面的平坦化固化织物以及从所述上平面表面延伸到所述下平面表面的多个导电线段。 由于每个导电线段从上平面表面延伸到下平面表面，所以这些段用作PCB基板的导电通孔。 此外，PCB基板包括其中浸渍有固化的树脂材料的平面化织物。 平面织造织物包括平面的上表面和下表面以及从上平面表面延伸到下平面表面的多个整体形成的导电线段（例如，铜线段）。 由于导电线段与平面化织物的其余部分一体形成，所以PCB基板具有高机械稳定性。

    METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD SUBSTRATE
    194.
    发明申请
    METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD SUBSTRATE 失效
    制造印刷电路板基板的方法

    公开(公告)号：US20030104182A1

    公开(公告)日：2003-06-05

    申请号：US10010675

    申请日：2001-11-30

    Inventor： Richard Dow ,  Tim W. Ellis ,  David T. Beatson ,  Michael Hillebrand

    IPC: B32B003/00

    CPC classification number: D03D15/0011 ,  D03D1/0082 ,  D03D15/00 ,  D03D15/0066 ,  D03D15/02 ,  D10B2101/06 ,  D10B2101/20 ,  D10B2321/042 ,  D10B2331/021 ,  D10B2331/04 ,  D10B2401/16 ,  H05K1/0366 ,  H05K3/045 ,  H05K3/4038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49162 ,  Y10T29/49215 ,  Y10T428/24917

    Abstract: An inexpensive and high throughput process for manufacturing a printed circuit board (PCB) substrate includes first weaving a plurality of electrically non-conductive strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric with an upper surface and a lower surface. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planed. The planing step segments the electrically conductive strand(s) and forms a PCB substrate that includes a planarized cured fabric with upper and lower planed surfaces and a plurality of electrically conductive strand segments extending from the upper planed surface to the lower planed surface. Since each of the electrically conductive strand segments extends from the upper planed surface to the lower planed surface, the segments function as electrically conductive vias of the PCB substrate. Also, a PCB substrate that includes a planarized woven fabric with a cured resin material impregnated therein. The planarized woven fabric includes planed upper and lower surfaces and a plurality of integrally formed electrically conductive strand segments (e.g., copper wire segments) extending from the upper planed surface to the lower planed surface. Since the electrically conductive strand segments were formed integrally with the remainder of the planarized woven fabric, PCB substrates are of high mechanical stability.

    Abstract translation: 用于制造印刷电路板（PCB）基板的廉价且高通量的方法包括首先编织多根非导电线（例如，玻璃纤维纱线）和至少一根导电线（例如铜线），以形成 具有上表面和下表面的无纺织物。 接下来，用树脂材料浸渍织物以形成浸渍织物，然后将其固化以形成固化织物。 固化织物的上表面和下表面随后被平面化。 所述刨削步骤分段所述导电线并形成PCB衬底，所述PCB衬底包括具有上和下平面表面的平坦化固化织物以及从所述上平面表面延伸到所述下平面表面的多个导电线段。 由于每个导电线段从上平面表面延伸到下平面表面，所以这些段用作PCB基板的导电通孔。 此外，PCB基板包括其中浸渍有固化的树脂材料的平面化织物。 平面织造织物包括平面的上表面和下表面以及从上平面表面延伸到下平面表面的多个整体形成的导电线段（例如，铜线段）。 由于导电线段与平面化织物的其余部分一体形成，所以PCB基板具有高机械稳定性。

    Multiple layer thin flexible circuit board
    195.
    发明授权
    Multiple layer thin flexible circuit board 有权
    多层薄柔性电路板

    公开(公告)号：US06477052B1

    公开(公告)日：2002-11-05

    申请号：US09630221

    申请日：2000-08-01

    Applicant: Tina Barcley

    Inventor： Tina Barcley

    IPC: H05K720

    CPC classification number: H05K1/0278 ,  H05K1/0206 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/429 ,  H05K2201/0281 ,  H05K2201/09063 ,  H05K2201/09572 ,  H05K2201/0969 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/302

    Abstract: A printed circuit board, containing thermal pads, is adhered to a rigidizer plate whereupon the entire unit can then be bent over itself to create a compact assembly which can be substantially smaller, but contain the same number of traces and electrical components, as an unbent printed circuit board of the same surface area. Further, a complete housing assembly is formed which is sealed on each edge of the rigidizer by inserting the edge into a panel with a groove. This assembly provides a secure fit that provides great stability with a relatively low weight and volume. The assembly also provides a better RF non-mechanical connection and much better thermal performance.

    Abstract translation: 包含热垫的印刷电路板被粘附到刚性板上，随后整个单元可以自身弯曲，以形成一个紧凑的组件，其可以显着地更小，但是包含相同数量的迹线和电气部件 印刷电路板的表面积相同。 此外，通过将边缘插入具有凹槽的面板中，形成完整的壳体组件，其被密封在刚性化器的每个边缘上。 该组件提供了具有相对较低重量和体积的极好稳定性的安全配合。 该组件还提供更好的RF非机械连接和更好的热性能。

    Electroplated conductive carbon fibers with adhesive
    196.
    发明授权
    Electroplated conductive carbon fibers with adhesive 有权
    带有粘合剂的电镀导电碳纤维

    公开(公告)号：US06246012B1

    公开(公告)日：2001-06-12

    申请号：US09275114

    申请日：1999-03-24

    Applicant: Stanley J. Wallace

    Inventor： Stanley J. Wallace

    IPC: H05K116

    CPC classification number: H01R12/58 ,  H01R13/02 ,  H01R13/03 ,  H05K3/321 ,  H05K3/3447 ,  H05K2201/0281 ,  H05K2201/0323

    Abstract: An electrical component has at least one end adapted to be electrically connected to another component. The electrical component includes a support with a plurality of electrically conductive fibers having at least a portion thereof extending outwardly therefrom. The free end of the conductive fibers has a metal electroplated thereon to facilitate soldering of the electrical component to a printed circuit board. The other ends of the fibers have conductive adhesive bonded thereto.

    Abstract translation: 电气部件具有适于电连接到另一部件的至少一个端部。 电气部件包括具有多个导电纤维的支撑件，该导电纤维的至少一部分从其向外延伸。 导电纤维的自由端具有电镀在其上的金属，以便于将电气部件焊接到印刷电路板。 纤维的另一端具有粘合到其上的导电粘合剂。

    Woven mesh interconnect
    197.
    发明授权
    Woven mesh interconnect 失效
    编织网状互连

    公开(公告)号：US06222126B1

    公开(公告)日：2001-04-24

    申请号：US09145089

    申请日：1998-09-01

    Applicant: Andrew H. Strange ,  Arthur Millay ,  Leonard S. Buchoff ,  Steven K. Mac Innes ,  Daniel W. Rassier

    Inventor： Andrew H. Strange ,  Arthur Millay ,  Leonard S. Buchoff ,  Steven K. Mac Innes ,  Daniel W. Rassier

    IPC: H02G300

    CPC classification number: H01R13/2492 ,  H05K1/038 ,  H05K2201/0281 ,  H05K2201/029 ,  Y10T442/107 ,  Y10T442/109 ,  Y10T442/131

    Abstract: An electrical interconnect includes a woven mesh in which an array of parallel wires is retained in spaced relation by a transverse array of nonconducting strands, the mesh being enclosed or encased within a resilient matrix. The conductive wires are on a close pitch to yield greater current carrying capacity and achieve a lower more stable resistance. With this construction a great number of wires are in contact with each contact pad to yield greater current carrying capacity and corresponding lower resistance. The closer pitch wires also provide greater redundancy of contact points. This structure can be custom configured in as many layers or in a variety of shapes as is desirable to achieve a given electrical performance. The woven mesh can be wrapped around a shaped substrate to provide electrical connections in a desired shape. The woven mesh interconnect can be integrated as part of a boot, wherein the boot receives an electrical device therein and the woven mesh interconnect provides electrical connection from the device within the boot to outside the boot. The woven mesh interconnect can be layered and shaped to form an interconnect which not only provides electrical interconnection but also provides a biasing force due to the shape of the device.

    Abstract translation: 电互连包括编织网，其中平行线的阵列由非导体股的横向阵列以间隔的关系保持，网被包围或包裹在弹性矩阵内。 导线处于紧密的间距处，以产生更大的载流能力并实现更低的更稳定的电阻。 利用这种结构，大量的电线与每个接触垫接触以产生更大的载流能力和相应的较低电阻。 更靠近的节距线还提供更大的接触点冗余度。 这种结构可以按照实现给定的电气性能所需的多层或多种形状来定制配置。 编织网可以缠绕成形的基底以提供所需形状的电连接。 机织网状互连可以被集成为靴子的一部分，其中靴子在其中容纳电气装置，并且编织网状互连提供从靴子内的装置到靴子外部的电连接。 机织网状互连可以被层叠和成形以形成互连，其不仅提供电互连，而且还由于器件的形状而提供偏置力。

    Printed wiring board structure having continuous graphite fibers
    198.
    发明授权
    Printed wiring board structure having continuous graphite fibers 有权
    具有连续石墨纤维的印刷线路板结构

    公开(公告)号：US06207904B1

    公开(公告)日：2001-03-27

    申请号：US09324255

    申请日：1999-06-02

    Applicant: Jesse J. Kramer ,  Jeffrey R. Madura ,  Carl Richard Smith

    Inventor： Jesse J. Kramer ,  Jeffrey R. Madura ,  Carl Richard Smith

    IPC: H05K103

    CPC classification number: H05K1/056 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

    Abstract: A printed wiring board structure having at least one chip-carrying layer adjacent a core fabricated of an organic matrix having disposed therein continuous pitch based graphite fibers. The chip carrying layers and the core have an interface therebetween and are integrally connected to each other through vias plated with an electrically and thermally conductive material to thereby provide a plurality of connection sites along this interface. An organic matrix is preferably fabricated of a polymer material such as an epoxy resin. Preferred fibers are fabricated of pitch based graphite. A typically preferred present printed wiring board structure has several circuit layers and two chip-carrying layers each on opposite sides of the core, with each of the layers and the core having respective interfaces therebetween wherein each layer is integrally connected to the core at a plurality of connection sites, as required by circuit design, along the respective interfaces.

    Abstract translation: 一种印刷线路板结构，其具有至少一个芯片承载层，邻近由有机基体制成的芯，其中设置有连续的基于沥青的石墨纤维。 芯片承载层和芯在它们之间具有界面，并且通过电镀和导热材料的通孔彼此一体地连接，从而沿着该界面提供多个连接位置。 有机基质优选由聚合物材料如环氧树脂制成。 优选的纤维由沥青基石墨制成。 通常优选的本发明印刷线路板结构在芯的相对侧上具有几个电路层和两个芯片承载层，其中每个层和芯具有各自的界面，其中每个层以多个整体连接到芯 的连接站点，按照电路设计的要求，沿着相应的接口。

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