公开(公告)号：US6154372A

公开(公告)日：2000-11-28

申请号：US723287

申请日：1996-09-30

Applicant: Vassilios Kalivas ,  Alois Nitsch ,  Heinz Peters

Inventor： Vassilios Kalivas ,  Alois Nitsch ,  Heinz Peters

IPC: H01L23/24 ,  H01L23/31 ,  H01L25/16 ,  H05K1/03 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H01L23/15 ,  H05K1/11

CPC classification number: H01L25/165 ,  H01L23/24 ,  H01L23/3121 ,  H01L25/16 ,  H01L25/162 ,  H05K1/141 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K2201/0317 ,  H05K2201/045 ,  H05K2201/10287 ,  H05K2201/10734 ,  H05K2203/049 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368

Abstract: A ceramic substrate secured with a flexible adhesive to a first side of a printed circuit board that belongs to a module and has circuit structures is provided. The ceramic substrate is contacted to the circuit structures with bond connections. The terminal elements are formed by approximately spherical accumulations of solder attached on the backside of the printed circuit board, these solder accumulations being connected to the circuit structures on the first side of the printed circuit board via through-contactings.

Abstract translation: 提供了一种用柔性粘合剂固定到属于模块并具有电路结构的印刷电路板的第一侧的陶瓷基板。 陶瓷衬底与具有接合连接的电路结构接触。 端子元件由附着在印刷电路板背面上的焊料的近似球形的积聚形成，这些焊料积聚通过通孔接触连接到印刷电路板的第一面上的电路结构。

公开(公告)号：US6081430A

公开(公告)日：2000-06-27

申请号：US072792

申请日：1998-05-05

Applicant: George Sterling La Rue

Inventor： George Sterling La Rue

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H05K7/14 ,  H01K12/16

CPC classification number: H05K1/025 ,  H05K1/141 ,  H05K7/1441 ,  H05K2201/0314 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/0792 ,  H05K2201/09236 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/10689 ,  H05K3/325 ,  H05K3/366 ,  H05K3/368

Abstract: A backplane consisting of segmented bus lines on a mother board with loop-through connections to active transceivers mounted on connectors to daughter boards. The transceivers isolate the interconnect to the daughter boards from the bus lines. The loop-through transmission line on the connectors preserves the impedance of the bus lines and allows the interconnect stub to the transceivers to be short, minimizing reflections and enabling high-speed backplane operation. The connectors are removable from the motherboard for repair.

Abstract translation: 一个背板，由主板上的分段总线线路组成，其中连接到与子板连接器上的主动收发器。 收发器将母线的互连与子板隔离。 连接器上的环通传输线保留总线的阻抗，并允许收发器的互连短路短路，最小化反射并实现高速背板操作。 连接器可从主板上拆下进行维修。

公开(公告)号：US6079620A

公开(公告)日：2000-06-27

申请号：US176662

申请日：1998-10-21

Applicant: Min-Fang Wu ,  Hung-Chi Yu ,  Yu-Ming Ho

Inventor： Min-Fang Wu ,  Hung-Chi Yu ,  Yu-Ming Ho

IPC: H01R12/50 ,  H01R12/72 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K5/02 ,  G06K7/06 ,  H05K7/02

CPC classification number: H05K5/0265 ,  H01R23/688 ,  H05K1/141 ,  H05K5/0286 ,  H01R12/721 ,  H05K1/0219 ,  H05K1/0262 ,  H05K1/117 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09954 ,  H05K2201/10189 ,  H05K3/3447 ,  H05K3/366

Abstract: A board adapter for electrically transmitting signals between an electrical card connector and a mother board, includes a plurality of signal traces formed on both faces of the board adapter for electrically connecting signal holes with corresponding conductive pads. The signal holes respectively receive the corresponding contacts of the card connector. The conductive pads electrically engage with corresponding contacts disposed within a receiving slot defined in a card edge connector when the board adapter is inserted therein and stabilizing means ensures proper engagement therebetween. The stabilizing means comprises a cutout defined on a bottom edge of the board adapter and a post formed in the receiving slot of the card edge connector. The engagement between the cutout and the post ensures that the conductive pads of the board adapter are properly aligned with the contacts of the card edge connector.

Abstract translation: 用于在电卡连接器和母板之间电传输信号的板适配器包括形成在板适配器的两个表面上的多个信号迹线，用于将信号孔与相应的导电焊盘电连接。 信号孔分别接收卡连接器的相应触点。 当板适配器插入其中时，导电垫与设置在卡边缘连接器中限定的接收槽内的相应触点电连接，并且稳定装置确保其间的适当接合。 稳定装置包括限定在板适配器的底部边缘上的切口和形成在卡缘连接器的接收槽中的柱。 切口和柱之间的接合确保了板适配器的导电垫与卡边缘连接器的触头正确对准。

公开(公告)号：US5953213A

公开(公告)日：1999-09-14

申请号：US51372

申请日：1998-04-08

Applicant: Dieter Napierala

Inventor： Dieter Napierala

IPC: H01L23/538 ,  H01L25/16 ,  H05K1/03 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K7/02

CPC classification number: H05K1/141 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K2201/045 ,  H05K2203/049 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368

Abstract: A multichip module having a carrier substrate, on whose component side an IC component and other electronic components are mounted which are interconnected by way of electrically conductive interconnects. Electrical through-lines are led from the component side to the bottom side of the carrier substrate and being joined to solder contacts arranged on the bottom side for the electrical connection of the multichip module to a card cage. To reduce the density of printed circuit traces on the top side of the multichip module, and to decrease the number of layers necessary in the carrier substrate, a carrier part is arranged between an IC component and the carrier substrate, the carrier part having printed circuit traces and components which are connected to the respective IC component by way of first terminal pads, and are connected to terminals on the carrier substrate by way of second terminal pads.

Abstract translation: PCT No.PCT / DE97 / 00856 Sec。 371日期：1998年4月8日 102（e）日期1998年4月8日PCT 1997年4月26日PCT PCT。 公开号WO98 / 07193 日期1998年2月19日具有载体基板的多芯片模块，其组件侧上安装有通过导电互连互连的IC部件和其他电子部件。 电气贯穿线从载体基板的部件侧引导到底侧，并且被连接到布置在底侧上的焊接触点，用于多芯片模块与卡笼的电连接。 为了降低多芯片模块顶面的印刷电路迹线的密度，并且为了减少载体基板所需的层数，载体部分布置在IC部件和载体基板之间，载体部分具有印刷电路 迹线和部件，其通过第一端子焊盘连接到相应的IC部件，并且通过第二端子焊盘连接到载体衬底上的端子。

公开(公告)号：US5895281A

公开(公告)日：1999-04-20

申请号：US918116

申请日：1997-08-27

Applicant: Richard Ellis Rothenberger

Inventor： Richard Ellis Rothenberger

IPC: H01R12/83 ,  H01R13/24 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01R13/62

CPC classification number: H01R12/83 ,  H05K1/141 ,  H01R13/24 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/0949 ,  H05K2201/10189 ,  H05K2201/10484 ,  H05K2201/10734 ,  H05K3/3436 ,  H05K3/368

Abstract: The invention is directed to an electrical connector comprising a housing having a plurality of contacts mounted therein to provide electrical connection from a daughter board to a circuit board. The contacts provide a linear array of first connection points to the circuit board. The circuit board converts the linear array of first connection points to an area array of second connection points and the area array of second connection points are connected to a mother board by way of a ball grid array. The housing provides an electrical connection between the daughter board and the mother board.

Abstract translation: 本发明涉及一种电连接器，其包括具有安装在其中的多个触点的壳体，以提供从子板到电路板的电连接。 触点提供与电路板的第一连接点的线性阵列。 电路板将第一连接点的线性阵列转换成第二连接点的区域阵列，并且第二连接点的区域阵列通过球栅阵列连接到母板。 外壳提供子板和母板之间的电气连接。

公开(公告)号：US5770300A

公开(公告)日：1998-06-23

申请号：US763707

申请日：1996-12-03

Applicant: Kenji Okamoto ,  Yukio Nakajima ,  Kazuhiko Imamura ,  Takao Ichihara

Inventor： Kenji Okamoto ,  Yukio Nakajima ,  Kazuhiko Imamura ,  Takao Ichihara

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/24 ,  H01L23/538 ,  H01L25/16 ,  H05K1/05 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  B32B3/00 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L25/165 ,  H01L23/24 ,  H01L23/5383 ,  H01L25/162 ,  H05K1/141 ,  H05K1/144 ,  H05K1/147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H05K1/056 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/045 ,  H05K2203/1316 ,  H05K2203/302 ,  H05K3/363 ,  H05K3/368 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A metallic printed board is formed by laminating an insulation layer on the surface of a metallic sheet as a base, and then electronic parts are mounted on the conductor pattern formed on the surface of the insulation layer. A double-sided printed board mounted thereon electronic parts is placed in parallel. Both the printed boards are supported and fixed monolithically by filling the space between the printed boards with an insulation resin and curing the resin. Furthermore, an insulation resin is laminated on the surface of the printed board in such a manner that the resin may cover the mounted electronic parts, and cured. The heat generated from the electronic parts can be efficiently transmitted to the insulation resins by using a resin having a high thermal conductivity for both of the insulation resins, and the heat is then emitted from the surfaces of the metallic sheet or the insulation resin.

Abstract translation: 通过在金属片的表面上层叠绝缘层作为基底而形成金属印刷电路板，然后将电子部件安装在形成在绝缘层的表面上的导体图案上。 将其上安装有电子部件的双面印刷电路平行放置。 通过用绝缘树脂填充印刷电路板之间的空间并固化树脂，两个印刷电路板被支撑和固定成一体。 此外，绝缘树脂层叠在印刷电路板的表面上，使得树脂可以覆盖所安装的电子部件并固化。 通过对两种绝缘树脂使用具有高导热性的树脂，从电子部件产生的热可以有效地传递到绝缘树脂，然后从金属片或绝缘树脂的表面发射热量。

公开(公告)号：US5710693A

公开(公告)日：1998-01-20

申请号：US439880

申请日：1995-05-12

Applicant: Katsumi Tsukada ,  Norio Nakamura ,  Minoru Nimura ,  Hiroyuki Suemori ,  Tomio Kamihata ,  Mutsuaki Yamazaki

Inventor： Katsumi Tsukada ,  Norio Nakamura ,  Minoru Nimura ,  Hiroyuki Suemori ,  Tomio Kamihata ,  Mutsuaki Yamazaki

IPC: G06K19/077 ,  G06F1/16 ,  G06F1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K5/02 ,  H01R13/64 ,  H05K7/10

CPC classification number: G06F1/1656 ,  G06F1/16 ,  G06F1/1626 ,  G06F1/18 ,  H05K1/141 ,  H05K1/148 ,  H05K5/0269 ,  G06F2200/1631 ,  H05K1/181 ,  H05K2201/045 ,  H05K2201/10159 ,  H05K2201/10689 ,  H05K3/36 ,  H05K3/361

Abstract: A thin and small computer system that can be used generally for control of equipment or the like, includes a CPU chip, peripheral control chips, and other components mounted in the form of a bare chip, whereby a computer system having a so-called hierarchy architecture can be incorporated in an IC card-like casing. Computer system components are affixedly attached to a double-sided printed wiring board. Electronic components may be attached to the printed wiring board in a bare form and then at least partially sealed with a resin. A system may further include a second printed board which is independent from the first printed board and adhesively attached to a inner surface of the casing and connected to the first printed board by a flexible member. In addition the second circuit board may include structure which enables it to connect to an apparatus for programming an electronic component attached thereto.

Abstract translation: 通常用于控制设备等的薄型和小型计算机系统包括CPU芯片，外围控制芯片和以裸芯片形式安装的其他组件，由此具有所谓层级的计算机系统 架构可以结合在IC卡状外壳中。 计算机系统部件固定地连接到双面印刷线路板。 电子部件可以以裸露形式附接到印刷线路板，然后至少部分地用树脂密封。 系统还可以包括第二印刷电路板，该第二印刷电路板独立于第一印刷电路板并且粘合地附接到壳体的内表面并通过柔性部件连接到第一印刷电路板。 此外，第二电路板可以包括使其能够连接到用于编程附接到其上的电子部件的装置的结构。

公开(公告)号：US4445274A

公开(公告)日：1984-05-01

申请号：US265848

申请日：1981-05-21

Applicant: Go Suzuki ,  Kazuo Michishita

Inventor： Go Suzuki ,  Kazuo Michishita

IPC: H01L21/48 ,  H01L23/13 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H05K1/00 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/30

CPC classification number: H05K1/147 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49861 ,  H01L23/5385 ,  H01L25/105 ,  H01L25/16 ,  H05K1/141 ,  H05K3/0014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/183 ,  H05K2201/045 ,  H05K2201/10477 ,  H05K2203/302 ,  H05K3/3442 ,  H05K3/368 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: A ceramic structural body having electronic components thereon comprises a ceramic package of a ceramic layer having substantially uniform thickness. The package comprises a ceramic element of dish-shaped or box-shaped configuration including a base portion, a sidewall portion extending from the base portion substantially at right angles thereto and a flange portion extending from the free end of the sidewall portion substantially at right angles thereto. The ceramic package is formed by press-forming a ceramic green sheet having substantially uniform thickness. A plurality of metal layers are provided on the surface of desired portions of the ceramic element.

Abstract translation: 其上具有电子部件的陶瓷结构体包括具有基本均匀厚度的陶瓷层的陶瓷封装。 该包装包括一种盘形或箱形结构的陶瓷元件，其包括基部，从基部大致直角延伸的侧壁部分和从侧壁部分的自由端基本直角延伸的凸缘部分 到此。 通过压制形成具有基本均匀厚度的陶瓷生片来形成陶瓷封装。 在陶瓷元件的所需部分的表面上设置多个金属层。