公开(公告)号：US20020011349A1

公开(公告)日：2002-01-31

申请号：US09854779

申请日：2001-05-14

Inventor： Hans Kragl ,  Rolf Hohmann

IPC: H05K001/03

CPC classification number: G02B6/43 ,  G02B6/42 ,  H01L23/13 ,  H01L23/5385 ,  H01L2224/48091 ,  H05K1/0272 ,  H05K1/0274 ,  H05K3/045 ,  H05K3/107 ,  H05K3/4614 ,  H05K3/4638 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/167 ,  H01L2924/00014

Abstract: A circuit board (5) is described, consisting of at least two individual circuit board layers (10) made of plastics and produced by formation technique, which each have first and second functional sides and at least one microstructured positioning formation (16) on each of the first and second functional sides and at least one microstructured conductor trench (12) on one of the functional sides, the conductor trench (12) being provided with a metallization (18). This allows a low expenditure production of circuit boards having a high packing density.

Abstract translation: 描述了由至少两个单独的由塑料制成的电路板层（10）和由地层技术制成的电路板（5），它们各自具有第一和第二功能侧以及在每个上具有至少一个微结构定位结构（16） 的第一和第二功能侧以及在功能侧之一上的至少一个微结构导体沟槽（12），所述导体沟槽（12）设有金属化层（18）。 这使得生产具有高填充密度的电路板的低成本。

公开(公告)号：US20010050570A1

公开(公告)日：2001-12-13

申请号：US09808879

申请日：2001-03-14

Inventor： Warren M. Farnworth ,  Malcolm Grief ,  Gurtej S. Sandhu

IPC: G01R031/02

CPC classification number: G01R1/07314 ,  H01L2924/00013 ,  H05K1/0306 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  Y10S438/978 ,  Y10T29/49117 ,  Y10T29/49204 ,  H01L2224/29099

Abstract: A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate; b) engaging the grouping of apexes with the single test pad on the semiconductor substrate; and c) sending an electric signal between the grouping of apexes and test pad to evaluate operability of integrated circuitry on the semiconductor substrate. Constructions and methods are disclosed for forming testing apparatus comprising an engagement probe having an outer surface comprising a grouping of a plurality of electrically conducive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate.

Abstract translation: 一种在具有用于其可操作性测试的集成电路的半导体衬底上接合导电测试焊盘的方法包括：a）提供具有外表面的接合探针，该外表面包括彼此靠近定位的多个导电突出顶点的组， 半导体衬底上的单个测试焊盘; b）使顶点的分组与半导体衬底上的单个测试焊盘接合; 以及c）在顶点组和测试垫之间发送电信号，以评估半导体衬底上的集成电路的可操作性。 公开了用于形成测试装置的结构和方法，所述测试装置包括具有外表面的接合探针，所述接合探针包括彼此靠近地定位的多个导电突出顶点的组，以接合半导体衬底上的单个测试焊盘。

公开(公告)号：US20010015012A1

公开(公告)日：2001-08-23

申请号：US09079857

申请日：1998-05-15

Inventor： ETSUJI SUZUKI ,  AKIRA YONEZAWA ,  TOSHIO OKUNO

IPC: H01B017/22 ,  H05K001/00 ,  H01R043/20

CPC classification number: H01R12/57 ,  H01L21/4853 ,  H01L23/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15173 ,  H05K1/0284 ,  H05K3/025 ,  H05K3/205 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/09045 ,  H05K2203/0113 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49208 ,  H01L2224/05599

Abstract: A structure of a conductive bump in a wiring board having a wiring pattern on a surface of an insulating base, characterized in that a local portion of the insulating base is raised from the surface of the insulating base to form a projection and a surface of the projection is covered with a part of a lead forming the wiring pattern to form a conductive bump.

Abstract translation: 一种在绝缘基底表面上具有布线图形的布线板中的导电凸块的结构，其特征在于，绝缘基底的局部部分从绝缘基底的表面升高以形成凸起和 突起被形成布线图案的导线的一部分覆盖以形成导电凸块。

公开(公告)号：US06221229B1

公开(公告)日：2001-04-24

申请号：US09380862

申请日：1999-09-09

Applicant: Marcel Heerman ,  Hubert de Steur

Inventor： Marcel Heerman ,  Hubert de Steur

IPC: H05K300

CPC classification number: H01L21/4846 ,  H01L21/4853 ,  H01L2924/15159 ,  H05K3/0032 ,  H05K3/0052 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/135 ,  H05K2203/175

Abstract: In order to form metallic conductor patterns having connection regions that can be soldered and/or bonded on electrically insulating substrates, firstly a metalization is applied to the substrate and is then removed again, at least in those regions adjoining the desired conductor pattern. There then follows the electrolytic deposition of a final surface which can be soldered and/or bonded to the connection regions. Clean-room conditions are not necessary.

Abstract translation: 为了形成具有可以在电绝缘基板上焊接和/或结合的连接区域的金属导体图案，首先将金属化施加到基板上，然后再次移除，至少在与所需导体图案相邻的那些区域中。 然后，电解沉积可以焊接和/或结合到连接区域的最终表面。 洁净室条件不是必需的。

公开(公告)号：US06193568B1

公开(公告)日：2001-02-27

申请号：US09316049

申请日：1999-05-21

Applicant: Martin Dörr

Inventor： Martin Dörr

IPC: H01R402

CPC classification number: H05K3/326 ,  H01R4/02 ,  H01R12/57 ,  H01R13/03 ,  H01R43/24 ,  H05K1/119 ,  H05K3/182 ,  H05K2201/0187 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/1059 ,  Y10S439/931

Abstract: A connector comprising: at least one contact, said contact being formed by a first and a second part, said first part being made of material adapted to be metallized, such that said contact forms soldering surfaces for termination purposes, and wherein between surfaces of the first part, which can be metallized, insulating material is provided by means of said second part so as to achieve an extension of the creeping paths.

Abstract translation: 一种连接器，包括：至少一个触点，所述触点由第一和第二部分形成，所述第一部分由适于金属化的材料制成，使得所述触点形成用于端接目的的焊接表面，并且其中在 能够金属化的第一部分，通过所述第二部分提供绝缘材料，以实现爬坡路径的延伸。

公开(公告)号：US6159045A

公开(公告)日：2000-12-12

申请号：US173377

申请日：1998-10-15

Applicant: Brian R. Vicich

Inventor： Brian R. Vicich

IPC: H01R12/55 ,  H01R13/73 ,  H05K3/34 ,  H02B1/01

CPC classification number: H05K3/3447 ,  H01R12/707 ,  H05K2201/09045 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10598 ,  H05K2201/10772

Abstract: A method and apparatus for engaging electrical components to a circuit board. The body of the component has at least one fastener integrally formed therewith. The at least one fastener includes a neck portion engaged to the body of the component and extending to a hook portion. The fastener is configured to reside substantially within a through-hole formed in a circuit board. The through-hole in the circuit board has a solder lining, and the fastener is placed into the through-hole. The solder is reflowed via known soldering techniques so that the hook portion of the fastener is engaged by the reflowed solder, thus engaging the component to the circuit board.

Abstract translation: 一种用于将电气部件接合到电路板的方法和装置。 该部件的主体具有与其一体形成的至少一个紧固件。 所述至少一个紧固件包括接合到所述部件的主体并延伸到钩部的颈部。 紧固件构造成基本上位于形成在电路板中的通孔内。 电路板中的通孔具有焊接衬垫，并且紧固件被放置在通孔中。 焊料通过已知的焊接技术回流，使得紧固件的钩部分被回流的焊料接合，从而将部件接合到电路板。

公开(公告)号：US6127195A

公开(公告)日：2000-10-03

申请号：US895764

申请日：1997-07-17

Applicant: Warren M. Farnworth ,  Malcolm Grief ,  Gurtej S. Sandhu

Inventor： Warren M. Farnworth ,  Malcolm Grief ,  Gurtej S. Sandhu

IPC: G01R31/26 ,  G01R1/073 ,  G01R31/02 ,  H01L21/66 ,  H01R43/00 ,  H05K1/03 ,  H05K3/32

CPC classification number: G01R1/07314 ,  H01L2924/00013 ,  H05K1/0306 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K3/325 ,  Y10S438/978 ,  Y10T29/49117 ,  Y10T29/49204

Abstract: A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate; b) engaging the grouping of apexes with the single test pad on the semiconductor substrate; and c) sending an electric signal between the grouping of apexes and test pad to evaluate operability of integrated circuitry on the semiconductor substrate. Constructions and methods are disclosed for forming testing apparatus comprising an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate.

Abstract translation: 一种在具有用于其可操作性测试的集成电路的半导体衬底上接合导电测试焊盘的方法包括：a）提供具有外表面的接合探针，该外表面包括彼此靠近定位的多个导电突出顶点的组， 半导体衬底上的单个测试焊盘; b）使顶点的分组与半导体衬底上的单个测试焊盘接合; 以及c）在顶点组和测试垫之间发送电信号，以评估半导体衬底上的集成电路的可操作性。 公开了用于形成测试装置的结构和方法，所述测试装置包括具有外表面的接合探针，所述外表面包括彼此靠近地定位的多个导电突出顶点的组，以接合半导体衬底上的单个测试焊盘。

公开(公告)号：US6124721A

公开(公告)日：2000-09-26

申请号：US962229

申请日：1997-10-31

Applicant: Warren M. Farnworth ,  Malcolm Grief ,  Gurtej S. Sandhu

Inventor： Warren M. Farnworth ,  Malcolm Grief ,  Gurtej S. Sandhu

IPC: G01R31/26 ,  G01R1/073 ,  G01R31/02 ,  H01L21/66 ,  H01R43/00 ,  H05K1/03 ,  H05K3/32

CPC classification number: G01R1/07314 ,  H01L2924/00013 ,  H05K1/0306 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K3/325 ,  Y10S438/978 ,  Y10T29/49117 ,  Y10T29/49204

Abstract: A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a) providing an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate; b) engaging the grouping of apexes with the single test pad on the semiconductor substrate; and c) sending an electric signal between the grouping of apexes and test pad to evaluate operability of integrated circuitry on the semiconductor substrate. Constructions and methods are disclosed for forming testing apparatus comprising an engagement probe having an outer surface comprising a grouping of a plurality of electrically conductive projecting apexes positioned in proximity to one another to engage a single test pad on a semiconductor substrate.

Abstract translation: 一种在具有用于其可操作性测试的集成电路的半导体衬底上接合导电测试焊盘的方法包括：a）提供具有外表面的接合探针，该外表面包括彼此靠近定位的多个导电突出顶点的组， 半导体衬底上的单个测试焊盘; b）使顶点的分组与半导体衬底上的单个测试焊盘接合; 以及c）在顶点组和测试垫之间发送电信号，以评估半导体衬底上的集成电路的可操作性。 公开了用于形成测试装置的结构和方法，所述测试装置包括具有外表面的接合探针，所述外表面包括彼此靠近地定位的多个导电突出顶点的组，以接合半导体衬底上的单个测试焊盘。

公开(公告)号：US6072239A

公开(公告)日：2000-06-06

申请号：US744048

申请日：1996-11-06

Applicant: Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

Inventor： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

IPC: H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10 ,  H01L29/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/04

CPC classification number: H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H05K3/305 ,  H05K3/3442 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L24/45 ,  H01L24/49 ,  H01L24/78 ,  H01L29/0657 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  H05K3/303 ,  H05K3/3436 ,  Y02P70/613

Abstract: A device includes a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic films.

Abstract translation: 一种器件包括芯片和密封芯片的树脂封装，树脂封装具有位于树脂封装的安装侧表面上的树脂突起。 金属膜分别设置在树脂突起上。 连接部件电连接芯片的电极焊盘和金属膜。

公开(公告)号：US5931682A

公开(公告)日：1999-08-03

申请号：US893551

申请日：1997-07-11

Applicant: Shuji Takiguchi ,  Keizo Nishitani

Inventor： Shuji Takiguchi ,  Keizo Nishitani

IPC: B60J5/00 ,  B60R16/02 ,  H01R13/26 ,  H01R13/631 ,  H01R13/74 ,  H05K1/11 ,  H05K3/32 ,  H01R33/00

CPC classification number: H05K3/326 ,  B60R16/0207 ,  H01R13/26 ,  H01R13/6315 ,  H05K1/119 ,  H01R13/74 ,  H05K2201/0191 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: A connector connecting structure capable of smoothly connecting connectors, for example, on a vehicle door trim and on a door panel respectively, even in case of the door trim slantingly approaching the door panel. A projection having a terminal conductor is orthogonally arranged on a substrate and is rotatable about a flexible portion as a supporting point, while a slant guide corresponding to the projection is formed on a connector corresponding to the projection for enabling the projection to be inserted into the connector slidingly and rotatively along the slant guide. Practically, a vehicle door trim functions as a substrate and a connector is provided on a vehicle door panel for enabling a projection on the door trim to be inserted into the connector upon rotative assemblage of the door trim onto the door panel. Further, a projection is formed long into a rig and a connector has a rib insertion space having an opening from the front portion throughout the longitudinal ends and also a plurality of connectors are arranged in a line for enabling the plurality of connectors to be simultaneously connected with the projection.

Abstract translation: 一种连接器连接结构，即使在门饰件倾斜接近门板的情况下，也能够分别平滑地将连接器连接在车门装饰件和门板上。 具有端子导体的突起被正交地布置在基板上并且可以围绕作为支撑点的柔性部分旋转，而对应于突起的倾斜引导件形成在对应于突起的连接器上，以使突起能够插入到 连接器沿倾斜导轨滑动和旋转。 实际上，车门装饰件用作基板，并且在车门板上设置连接器，以便在门装饰件旋转组装到门板上时能使门装饰件上的突起插入连接器中。 此外，突起形成在钻机中，并且连接器具有肋部插入空间，该肋插入空间在整个纵向端部具有从前部开口的开口，并且多个连接器被布置成一条直线，以使多个连接器能够同时连接 与投影。