公开(公告)号：US08238113B2

公开(公告)日：2012-08-07

申请号：US12842052

申请日：2010-07-23

Applicant: Antti Iihola ,  Petteri Palm

Inventor： Antti Iihola ,  Petteri Palm

IPC: H05K1/18 ,  H05K7/00

CPC classification number: H05K3/4046 ,  H01L21/4828 ,  H01L21/568 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/73267 ,  H05K1/188 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/2018

Abstract: The present invention generally relates to a new structure to be used with electronic modules such as printed circuit boards and semiconductor package substrates. Furthermore there are presented herein methods for manufacturing the same. According to an aspect of the invention, the aspect ratio of through holes is significantly improved. Aspect ratio measures a relationship of a through hole or a micro via conductor in the direction of height divided width. According to the aspect of the invention, the aspect ratio can be increased over that of the prior art solution by a factor of ten or more.

Abstract translation: 本发明一般涉及一种与电子模块如印刷电路板和半导体封装基板一起使用的新结构。 此外，在此提出了制造该方法。 根据本发明的一个方面，通孔的纵横比显着提高。 长宽比测量通孔或微通孔导体在高度分割宽度方向上的关系。 根据本发明的方面，可以将现有技术方案的纵横比提高10倍以上。

公开(公告)号：US08208270B2

公开(公告)日：2012-06-26

申请号：US12280434

申请日：2007-04-23

Applicant: Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

Inventor： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

IPC: H05K1/11

CPC classification number: H05K1/144 ,  B23K1/0016 ,  B23K2101/42 ,  H05K3/368 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/1572

Abstract: Three-dimensional structure (40) of the present invention includes first module board (28), second module board (37), and substrate joining member (10) that unifies board (28) and board (37) into one body, thereby electrically connecting these two elements together. The unification is done by molding the outer wall of housing (12) of substrate joining member (10) with resin (29). Substrate joining member (10) used in the three-dimensional structure (40) includes multiple lead terminals (14) made of conductive material, and a frame-shaped and insulating housing (12) to which frame the lead terminals (14) are fixed vertically in a predetermined array. Housing (12) includes projections (18) on at least two outer wall faces of its frame shape.

Abstract translation: 本发明的三维结构（40）包括将板（28）和板（37）一体化成一体的第一模块板（28），第二模块板（37）和基板接合构件（10），由此电 将这两个元素连接在一起。 通过用树脂（29）将衬底接合构件（10）的壳体（12）的外壁模制成一体。 在三维结构（40）中使用的基板接合构件（10）包括由导电材料制成的多个引线端子（14）和框架形绝缘壳体（12），引线端子（14）固定到框架形绝缘壳体 垂直于预定的阵列。 壳体（12）在其框架形状的至少两个外壁面上包括突起（18）。

公开(公告)号：US08199510B2

公开(公告)日：2012-06-12

申请号：US12685723

申请日：2010-01-12

Applicant: Chun-Ming Huang ,  Chien-Ming Wu ,  Chih-Chyau Yang ,  Shih-Lun Chen ,  Chin-Long Wey ,  Chi-Shi Chen ,  Chi-Sheng Lin

Inventor： Chun-Ming Huang ,  Chien-Ming Wu ,  Chih-Chyau Yang ,  Shih-Lun Chen ,  Chin-Long Wey ,  Chi-Shi Chen ,  Chi-Sheng Lin

IPC: H05K7/20

CPC classification number: H05K7/20 ,  H01L23/49833 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2225/1094 ,  H05K1/0272 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/1572

Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.

Abstract translation: 提供了多层片上系统（SoC）模块结构。 多层SoC模块结构包括至少两个电路板模块层和至少一个连接器模块层。 每个连接器模块层夹在两个电路板模块层之间并由此电连接，使得SoC模块结构通过堆叠形成。 每个电路板模块层由至少一个电路板模块组成，而每个连接器模块层由至少一个连接器模块组成。 因此，SoC模块结构可以制造为三维结构，从而允许SoC模块结构内的高度灵活的连接。

公开(公告)号：US20120120614A1

公开(公告)日：2012-05-17

申请号：US13294763

申请日：2011-11-11

Applicant: Seigo UENO

Inventor： Seigo UENO

IPC: H05K7/00

CPC classification number: H05K1/183 ,  H01L23/49833 ,  H01L2224/16225 ,  H05K1/0231 ,  H05K1/162 ,  H05K1/181 ,  H05K3/4614 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2201/2018

Abstract: There is provided a wiring board including a multilayer substrate and a reinforcing member. The multilayer substrate has a first main substrate surface formed with a chip mounting area to which an electronic chip is mounted and a second main substrate surface opposed to the first main substrate surface. The reinforcing member is fixed to either an area of the first main substrate surface other than the chip mounting area or the second main substrate surface and has a body predominantly formed of ceramic material and incorporating therein at least one capacitor.

Abstract translation: 提供了一种包括多层基板和加强件的布线板。 多层基板具有形成有安装有电子芯片的芯片安装区域的第一主基板表面和与第一主基板表面相对的第二主基板表面。 加强构件固定在除了芯片安装区域或第二主基板表面之外的第一主基板表面的区域中，并且具有主要由陶瓷材料形成并且内置有至少一个电容器的主体。

公开(公告)号：US08134082B2

公开(公告)日：2012-03-13

申请号：US12377134

申请日：2008-05-28

Applicant: Tadashi Nakamura ,  Fumio Echigo ,  Takayuki Kita ,  Kota Fukasawa ,  Shogo Hirai

Inventor： Tadashi Nakamura ,  Fumio Echigo ,  Takayuki Kita ,  Kota Fukasawa ,  Shogo Hirai

IPC: H05K3/02 ,  H05K3/10 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/4697 ,  H05K1/183 ,  H05K1/189 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/09909 ,  H05K2201/09972 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/061 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.

Abstract translation: 通过粘接具有不同形状的上下印刷电路板并且在其表面上形成布线来制造实心印刷电路板。 接合层由含有分散在其中的热固性树脂和无机填料的绝缘材料制成，并且具有填充在接合层的预定位置穿孔的通孔的由导电膏制成的通孔导体。 该电路板提供了实现小尺寸和厚度的三维安装，适用于高性能和多引脚结构半导体的封装结构。

公开(公告)号：US08107242B2

公开(公告)日：2012-01-31

申请号：US12601839

申请日：2008-05-29

Applicant: Akio Yoshimoto ,  Mitsuhiro Tanaka

Inventor： Akio Yoshimoto ,  Mitsuhiro Tanaka

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K5/0034 ,  H05K3/284 ,  H05K5/006 ,  H05K5/061 ,  H05K5/065 ,  H05K7/1417 ,  H05K7/142 ,  H05K7/20418 ,  H05K2201/2018 ,  H05K2203/1316 ,  H05K2203/1581

Abstract: A substrate includes a pair of surfaces opposing to each other in a direction. First electronic components are provided on one surface. Second electronic components lower than a maximum value of the height of the first electronic components in a direction are provided on the other surface. Insulating resin includes a covering part adhering and covering the second electronic components and the other surface, and side surface part extending from the periphery of the substrate to a side of the second electronic components along the direction. A lid covers the first electronic components from an opposite side of the substrate, and is fixed to the side surface part from the opposite side of the substrate.

Abstract translation: 衬底包括在一个方向上彼此相对的一对表面。 在一个表面上提供第一电子部件。 在另一个表面上设置有低于第一电子部件在一个方向上的高度的最大值的第二电子部件。 绝缘树脂包括粘附并覆盖第二电子部件和另一表面的覆盖部分，以及沿着该方向从基板的周边延伸到第二电子部件的侧面的侧表面部分。 盖子从基板的相对侧覆盖第一电子元件，并且从基板的相对侧固定到侧表面部分。

公开(公告)号：US08054641B2

公开(公告)日：2011-11-08

申请号：US12397062

申请日：2009-03-03

Applicant: Hiroyuki Onishi ,  Toshiaki Nagase ,  Jun Ishikawa ,  Naohito Kanie ,  Kazuyoshi Kontani

Inventor： Hiroyuki Onishi ,  Toshiaki Nagase ,  Jun Ishikawa ,  Naohito Kanie ,  Kazuyoshi Kontani

IPC: H05K5/00

CPC classification number: H02M7/003 ,  H01L25/162 ,  H01L25/165 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0061 ,  H05K3/3405 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10424 ,  H05K2201/2018 ,  H01L2924/00

Abstract: An electronic unit includes a first circuit board having a power semiconductor device and an electrolytic capacitor and a second circuit board having an electronic component to control the power semiconductor device. The second circuit board is arranged perpendicular to the first circuit board and along the surface of the electrolytic capacitor. The electronic unit further includes a connecting member being jointed at one end thereof to the first circuit board and jointed at the other end thereof to the second circuit board for electrical connection between the first and second circuit boards.

Abstract translation: 电子单元包括具有功率半导体器件和电解电容器的第一电路板和具有用于控制功率半导体器件的电子元件的第二电路板。 第二电路板垂直于第一电路板并且沿着电解电容器的表面布置。 电子单元还包括连接构件，其一端连接到第一电路板，并在另一端连接到第二电路板，用于第一和第二电路板之间的电连接。

公开(公告)号：US08031481B2

公开(公告)日：2011-10-04

申请号：US11818447

申请日：2007-06-13

Applicant: Takahiro Shimoirisa ,  Atsumi Kawata ,  Fusaaki Kozawa

Inventor： Takahiro Shimoirisa ,  Atsumi Kawata ,  Fusaaki Kozawa

IPC: H05K7/14

CPC classification number: H05K1/14 ,  H05K7/1408 ,  H05K9/0062 ,  H05K2201/044 ,  H05K2201/2018

Abstract: The present invention is provided a structure for mounting a printed board in which each connector that is attached to each of a plurality of sub printed boards, which are juxtaposed to one another with respect to a main printed board secured to a metal backboard, is inserted into each of a plurality of connectors that are juxtaposed to one another on the main printed board so that the sub printed boards are mounted on the main printed board by the connector connections. Parts of both ends of an area in proximity to a semiconductor-device mounted area on each of the sub printed boards ate pinched between a first metal frame and a second metal frame so that each of the sub printed boards are secured.

Abstract translation: 本发明提供了一种用于安装印刷电路板的结构，其中插入相对于固定到金属背板的主印刷板彼此并列的多个次印刷电路板中的每一个附接的每个连接器被插入 在主印刷电路板上彼此并置的多个连接器中的每一个连接器中，通过连接器连接将副印刷电路板安装在主印刷电路板上。 在每个副印刷电路板上靠近半导体器件安装区域的区域的两端的部分被夹在第一金属框架和第二金属框架之间，使得每个副印刷电路板被固定。

公开(公告)号：US20110229709A1

公开(公告)日：2011-09-22

申请号：US13053417

申请日：2011-03-22

Applicant: Michael S. Kuszaj

Inventor： Michael S. Kuszaj

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/07 ,  H05K3/42 ,  B32B5/18 ,  B32B7/12

CPC classification number: H05K1/0313 ,  H05K2201/0116 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/249953 ,  Y10T428/249982

Abstract: A method of making a supported foam circuit laminate comprises fitting a dielectric foam substrate having a shape defined by edges to a support frame having a thickness, an inner rim and an outer rim, wherein the edges of the dielectric foam substrate are flush with the inner rim of the support frame, and the dielectric foam substrate has a thickness that is greater than the thickness of the support frame; disposing an electrically conductive layer onto a side of the dielectric foam substrate and the support frame, wherein the edges of the electrically conductive layer overlap the inner rim of the support frame; and co-laminating the electrically conductive layer to the dielectric foam substrate and the overlapped support frame under heat and pressure to provide a supported foam circuit laminate.

Abstract translation: 制造支撑泡沫电路层压体的方法包括将具有由边缘限定的形状的电介质泡沫基材装配到具有厚度，内缘和外缘的支撑框架，其中电介质泡沫基底的边缘与内部 支撑框架的边缘，并且电介质泡沫基板具有大于支撑框架的厚度的厚度; 将导电层设置在电介质泡沫衬底和支撑框架的侧面上，其中导电层的边缘与支撑框架的内边缘重叠; 并且在热和压力下将导电层共同层叠到电介质泡沫衬底和重叠的支撑框架，以提供支撑的泡沫电路层压体。

公开(公告)号：US07983054B2

公开(公告)日：2011-07-19

申请号：US12311983

申请日：2007-10-16

Applicant: Markus Eglinger ,  Joachim Buhl ,  Matthias Gramann ,  Steffen Fueller

Inventor： Markus Eglinger ,  Joachim Buhl ,  Matthias Gramann ,  Steffen Fueller

IPC: H05K5/00

CPC classification number: B60R16/0239 ,  H01L2224/48091 ,  H05K1/142 ,  H05K1/147 ,  H05K3/0058 ,  H05K5/0082 ,  H05K5/069 ,  H05K2201/2018 ,  H05K2203/049 ,  H05K2203/1147 ,  Y10T29/5313 ,  Y10T29/532 ,  H01L2924/00014

Abstract: A motor vehicle control device includes a housing lid and a base plate that are connected with each other in an oil-tight manner via a frame. An interconnect device with at least one electronic component and/or at least one electrical contact area is arranged on the base plate. Respectively in the area of an electronic component and/or an electrical contact area, the base plate includes a foil conductor strip, of which an end section facing the interconnect device in turn includes an electrical contact area. The frame completely surrounds the interconnect device and includes one opening respectively in the area of an electrical contact area of the foil strip. Via connection lines, the electronics on the interconnect device are electrically connected with the contact area in the opening, and thus with the electronic components outside the control device.

Abstract translation: 机动车辆控制装置包括通过框架以不透油的方式彼此连接的壳体盖和基板。 具有至少一个电子部件和/或至少一个电接触区域的互连装置设置在基板上。 分别在电子部件和/或电接触区域的区域中，基板包括箔导体条，其中面向互连装置的端部部分又包括电接触区域。 框架完全围绕互连装置，并且在箔条的电接触区域的区域中分别包括一个开口。 通过连接线，互连装置上的电子器件与开口中的接触区域电连接，因此与电子部件在控制装置外部电连接。