公开(公告)号：US07989081B2

公开(公告)日：2011-08-02

申请号：US11657529

申请日：2007-01-25

Applicant: Mitsuru Nozaki ,  Morio Gaku ,  Yasuo Tanaka ,  Eiji Nagata ,  Yasuo Kikuchi ,  Masashi Yano

Inventor： Mitsuru Nozaki ,  Morio Gaku ,  Yasuo Tanaka ,  Eiji Nagata ,  Yasuo Kikuchi ,  Masashi Yano

IPC: B32B15/08 ,  B32B27/06 ,  C23C18/54

CPC classification number: B32B27/281 ,  B32B7/06 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  C08G73/1042 ,  C08G73/12 ,  H05K3/181 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/1152 ,  Y10S428/901 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.

Abstract translation: 一种树脂复合铜箔，其包含铜箔和含有嵌段共聚物聚酰亚胺和马来酰亚胺化合物的树脂层，所述树脂层形成在所述铜箔的一个表面上，其制造方法，使用所述树脂复合材料的覆铜层压板 铜箔，使用覆铜层压板的印刷电路板的制造方法，以及通过上述方法得到的印刷电路板。

公开(公告)号：US20110073798A1

公开(公告)日：2011-03-31

申请号：US12567296

申请日：2009-09-25

Applicant: Yun-Chao YEH ,  Chung-Hao CHANG ,  Cheng-Nan YEN ,  Li-Hung LIU

Inventor： Yun-Chao YEH ,  Chung-Hao CHANG ,  Cheng-Nan YEN ,  Li-Hung LIU

IPC: C09K5/00

CPC classification number: C08G59/56 ,  C08K3/00 ,  C08L63/00 ,  C08L2205/02 ,  C09J163/00 ,  H05K1/0353 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0358

Abstract: A high thermal conductivity and low dissipation factor adhesive varnish for (build-up) combining additional insulation layers is disclosed to be used for high-density interconnected printed circuit boards or IC-package substrates and to be formed by well mixing an epoxy resin precursor, a bi-hardener mixture, a catalyst, a flow modifier, an inorganic filler with high thermal conductivity, and a solvent. The epoxy resin precursor is formed by mixing at least two epoxy resins with a certain ratio, where the at least two epoxy resins are selected from a group including a tri-functional epoxy resin, a rubber-modified or Dimmer-acid-modified epoxy resin, a bromide-contained epoxy resin, a halogen-free/phosphorus-contained epoxy resin, a halogen-free/phosphorus-free epoxy resin, a long-chain/halogen-free epoxy resin, and a bisphenol A (BPA) epoxy resin.

Abstract translation: 公开了高密度互连印刷电路板或IC封装基板的高导热性和低耗散因数粘合剂清漆（积聚）组合附加绝缘层，并且通过将环氧树脂前体， 双硬化剂混合物，催化剂，流动改性剂，具有高导热性的无机填料和溶剂。 环氧树脂前体是通过混合至少两种一定比例的环氧树脂形成的，其中至少两种环氧树脂选自三官能环氧树脂，橡胶改性或二聚酸改性环氧树脂 ，含溴化物的环氧树脂，无卤素/含磷环氧树脂，无卤素/无磷环氧树脂，长链/无卤环氧树脂和双酚A（BPA）环氧树脂 。

公开(公告)号：US20110059326A1

公开(公告)日：2011-03-10

申请号：US12863313

申请日：2009-01-15

Applicant: Akira Tachibana ,  Toshiyuki Inukai ,  Chikahito Sugahara ,  Akira Morii

Inventor： Akira Tachibana ,  Toshiyuki Inukai ,  Chikahito Sugahara ,  Akira Morii

IPC: B32B15/08 ,  B05D3/02

CPC classification number: H05K1/0346 ,  H01L23/142 ,  H01L2924/0002 ,  H05K1/056 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/0783 ,  Y10T428/31678 ,  Y10T428/31681 ,  H01L2924/00

Abstract: Disclosed is a composite material for electrical/electronic component, having a resin coating film formed on at least a part of a metal base, and the residual solvent quantity in the resin coating film being controlled to be 1-30% by mass. The resin coating film is preferably composed of a polyimide or a polyamide-imide.

Abstract translation: 公开了一种用于电气/电子部件的复合材料，其具有形成在金属基体的至少一部分上的树脂涂膜，并将树脂涂膜中的残留溶剂量控制在1-30质量％。 树脂涂膜优选由聚酰亚胺或聚酰胺 - 酰亚胺组成。

公开(公告)号：US07888174B2

公开(公告)日：2011-02-15

申请号：US12234702

申请日：2008-09-21

Applicant: David C. H. Cheng

Inventor： David C. H. Cheng

IPC: H01L21/00 ,  H01L21/44 ,  H01L21/4763

CPC classification number: H01L23/5389 ,  H01L23/5384 ,  H01L24/24 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4602 ,  H05K2201/0358 ,  H05K2201/10674

Abstract: An embedded chip package process is disclosed. First, a first substrate having a first patterned circuit layer thereon is provided. Then, a first chip is disposed on the first patterned circuit layer and electrically connected to the first patterned circuit layer. A second substrate having a second patterned circuit layer thereon is provided. A second chip is disposed on the second patterned circuit layer and electrically connected to the second patterned circuit layer. Afterwards, a dielectric material layer is formed and covers the first chip and the first patterned circuit layer. Then, a compression process is performed to cover the second substrate over the dielectric material layer so that the second patterned circuit layer and the second chip on the second substrate are embedded into the dielectric material layer.

Abstract translation: 公开了一种嵌入式芯片封装工艺。 首先，提供其上具有第一图案化电路层的第一基板。 然后，第一芯片设置在第一图案化电路层上并电连接到第一图案化电路层。 提供其上具有第二图案化电路层的第二基板。 第二芯片设置在第二图案化电路层上并电连接到第二图案化电路层。 之后，形成介电材料层并覆盖第一芯片和第一图案化电路层。 然后，执行压缩处理以覆盖电介质材料层上的第二衬底，使得第二图案化电路层和第二衬底上的第二芯片被嵌入电介质材料层中。

公开(公告)号：US07862889B2

公开(公告)日：2011-01-04

申请号：US12613222

申请日：2009-11-05

Applicant: Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

Inventor： Kenji Takai ,  Norio Moriike ,  Kenichi Kamiyama ,  Takako Watanabe ,  Shin Takanezawa ,  Koji Morita ,  Katsuyuki Masuda ,  Kiyoshi Hasegawa

IPC: B32B15/04 ,  H05K1/02

CPC classification number: H05K3/4655 ,  H05K3/108 ,  H05K3/28 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/31681

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract translation: 本发明涉及一种粘合促进剂金属箔，其包含含有环氧树脂作为金属上不可或缺的成分的粘合助剂层，其中粘合助剂层的厚度为0.1〜10μm。 本发明还涉及作为具有多层的多层布线基板的印刷布线板，其中在绝缘层之间形成粘附辅助剂层。

公开(公告)号：US20100196703A1

公开(公告)日：2010-08-05

申请号：US12597197

申请日：2008-04-24

Applicant: Yoshitsugu Matsuura ,  Kazuhito Obata ,  Masaki Takeuchi

Inventor： Yoshitsugu Matsuura ,  Kazuhito Obata ,  Masaki Takeuchi

IPC: C09J7/02 ,  B32B15/08

CPC classification number: H05K3/4655 ,  C08G59/4085 ,  C09J7/29 ,  C09J163/00 ,  C09J2467/006 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4635 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/28 ,  Y10T428/2804

Abstract: An adhesive sheet comprising a base 3 and an adhesive resin layer 4 formed on one side of the base 3, wherein the adhesive resin layer 4 has a glass transition temperature of 170-200° C. and a post-curing elastic modulus of 100-500 MPa.

Abstract translation: 一种粘合片，其包括基底3和形成在基底3的一侧上的粘合树脂层4，其中粘合性树脂层4的玻璃化转变温度为170-200℃，后固化弹性模量为100〜 500 MPa。

公开(公告)号：US20100190029A1

公开(公告)日：2010-07-29

申请号：US12666807

申请日：2008-06-09

Applicant: Shiki Ueki

Inventor： Shiki Ueki

IPC: B32B5/00 ,  C25D5/56 ,  B05D5/12

CPC classification number: C23C2/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/32 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/704 ,  B32B2457/08 ,  C23C28/00 ,  H05K3/181 ,  H05K3/384 ,  H05K3/386 ,  H05K2201/0179 ,  H05K2201/0358 ,  H05K2203/072 ,  Y10T428/12993

Abstract: Provided are a metal layer laminate that includes a roughened metal surface layer having a surface profile capable of strongly adhering to resin materials even when the surface roughness is small, and a simple method for producing a metal layer laminate having good adhesion to resin materials such as a resin substrate for a metal layer and an insulating resin film formed on the surface of a metal wiring portion. The metal layer laminate includes a metal layer, a resin thin film, and a roughened metal surface layer, wherein the resin thin film and the roughened metal surface layer are formed on the surface of the metal layer, a fractal-shaped interface structure appears between the resin thin film and the roughened metal surface layer, when the metal layer laminate is cut in a normal direction, and the interface structure has a fractal dimension of 1.05 to 1.50 as calculated using a box counting method with the measurement object region being set to from 50 nm to 5 μm and the box size (pixel size) being set to 1/100 or less of the measurement object region. The metal layer laminate is obtained by a production method including the steps of forming a resin thin film on the surface of a metal layer and subjecting the resin thin film-carrying metal layer to a plating process.

Abstract translation: 提供一种金属层叠体，其具有即使在表面粗糙度小的情况下也具有能够强烈地附着在树脂材料上的表面轮廓的粗糙金属表面层，以及与树脂材料（例如， 用于金属层的树脂基板和形成在金属布线部分的表面上的绝缘树脂膜。 金属层层叠体包括金属层，树脂薄膜和粗糙化的金属表面层，其中树脂薄膜和粗糙金属表面层形成在金属层的表面上，分形形状的界面结构出现在 树脂薄膜和粗糙金属表面层，当金属层层压板沿正向切割时，并且界面结构的分形维数为1.05至1.50，使用盒计数方法计算，其中测量对象区域设置为 从50nm到5μm，并且盒尺寸（像素尺寸）被设置为测量对象区域的1/100或更小。 通过包括以下步骤的制造方法获得金属层层叠体：在金属层的表面上形成树脂薄膜，对树脂薄膜负载金属层进行电镀处理。

公开(公告)号：US20100119853A1

公开(公告)日：2010-05-13

申请号：US12688276

申请日：2010-01-15

Applicant: Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

Inventor： Kenji Tanaka ,  Kazumasa Takeuchi ,  Nobuyuki Ogawa ,  Katsuyuki Masuda

IPC: B32B15/08 ,  B32B27/34 ,  C09J133/24 ,  C08G73/10 ,  C08G18/00

CPC classification number: B32B27/36 ,  B32B7/04 ,  B32B15/08 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/281 ,  B32B27/322 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/748 ,  B32B2457/00 ,  C08G73/14 ,  H05K3/386 ,  H05K2201/0358 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

Abstract translation: 本发明的目的是提供一种树脂底漆，其可以将绝缘体层粘附到具有足够的粘合力的表面不被粗糙化的导体箔上，具有树脂的导体箔，层压片及其制造方法。 本发明的树脂底漆包括具有成膜能力和断裂能为0.15J以上的树脂。 本发明的具有树脂的导体箔包括由导体箔和上述树脂底漆构成的树脂层。 此外，本发明的层压片包括导体箔，与导体箔相对设置的绝缘层，以及包含设置在导体箔与绝缘层之间的上述树脂底漆的树脂层，使其与其接触。 该层叠片材可以通过用树脂对包含上述导体箔的层压体进行加热加压，并将该层压在该树脂层上的预浸料坯来制造。

公开(公告)号：US20100000675A1

公开(公告)日：2010-01-07

申请号：US12465871

申请日：2009-05-14

Applicant: Deok-heung Kim ,  Dong-kwan Won ,  Sang-min Lee ,  Min-woo Lee ,  Youn-kwon Jung

Inventor： Deok-heung Kim ,  Dong-kwan Won ,  Sang-min Lee ,  Min-woo Lee ,  Youn-kwon Jung

IPC: B29C65/02

CPC classification number: H05K3/4652 ,  B32B37/06 ,  B32B37/08 ,  B32B37/226 ,  B32B2309/68 ,  B32B2310/0825 ,  B32B2457/00 ,  H05K3/281 ,  H05K2201/0358 ,  H05K2203/0143 ,  H05K2203/068 ,  H05K2203/085 ,  H05K2203/1121 ,  H05K2203/1545

Abstract: Provided are a method and apparatus for manufacturing a multi-layer substrate. The method includes: rolling out a base substrate that is rolled up into a substrate supply roll and delivering the base substrate to a compression roller system; compressing and laminating a laminating material on the base substrate in a vacuum state using the compression roller system; and cooling the base substrate on which the laminating material is laminated.

Abstract translation: 提供一种制造多层基板的方法和装置。 该方法包括：将卷成基材供给辊的基底基材卷出，将基材输送到压缩辊系统; 使用压缩辊系统在真空状态下将层压材料压缩并层压在基底基板上; 并冷却层压材料层叠的基底基板。

公开(公告)号：US07615256B2

公开(公告)日：2009-11-10

申请号：US11575973

申请日：2005-09-21

Applicant: Christoph Rickert ,  Jurgen Kress ,  Michel Probst

Inventor： Christoph Rickert ,  Jurgen Kress ,  Michel Probst

IPC: B05D1/04

CPC classification number: H05K3/4626 ,  B05D1/24 ,  B05D1/28 ,  B05D3/0254 ,  B05D3/14 ,  B05D2252/02 ,  H05K2201/0358 ,  H05K2201/083 ,  H05K2203/105 ,  H05K2203/1355

Abstract: Disclosed is a process for mixing and gentle transport and transfer of powders to substrates.

Abstract translation: 公开了一种将粉末混合并缓和输送和转移至基底的方法。