公开(公告)号：US5372512A

公开(公告)日：1994-12-13

申请号：US56692

申请日：1993-04-30

Applicant: Arthur K. Wilson ,  Patricia S. Brown ,  Jason R. Arbeiter

Inventor： Arthur K. Wilson ,  Patricia S. Brown ,  Jason R. Arbeiter

IPC: H01R4/48 ,  B41J2/175 ,  H01R11/01 ,  H01R12/62 ,  H01R43/00 ,  H05K1/00 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  H01R9/09

CPC classification number: B41J2/17526 ,  B41J2/1752 ,  H01R12/62 ,  H05K3/365 ,  H05K1/0393 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2203/167 ,  H05K3/4007

Abstract: An improved electrical interconnect system for a flexible circuit which includes: a flexible first layer; at least one protrusion on the flexible first layer that has an electrical contact; a second layer having at least one electrical contact; and a spring apparatus coupled to the flexible first layer and to the second layer for pressing the electrical contact on the protrusion on the flexible first layer to the electrical contact on the second layer to electrically connect the electrical contact on the protrusion to the electrical contact on the second layer. In a specific embodiment the spring apparatus for pressing the electrical contact on the protrusion of the flexible first layer to the electrical contact on the second layer includes relief for allowing the flexible first layer to deform during assembly of the improved electrical interconnect system for a flexible circuit. In an alternate specific embodiment the electrical contacts on the protrusions on the flexible first layer and the corresponding electrical contacts on the second layer are coated with gold. In another alternate specific embodiment the improved electrical interconnect system includes an alignment apparatus coupled to the flexible first layer and the second layer and the spring apparatus for aligning the flexible first layer with the second layer and the spring apparatus. The improved electrical interconnect system for a flexible circuit provides higher interconnect density, reduced cost and increased reliability compared to conventional interconnect systems.

Abstract translation: 一种用于柔性电路的改进的电互连系统，包括：柔性第一层; 柔性第一层上的至少一个具有电接触的突起; 具有至少一个电接触的第二层; 以及弹簧装置，其耦合到柔性第一层和第二层，用于将柔性第一层上的突起上的电接触按压到第二层上的电接触，以将突起上的电接触电连接到电触点上 第二层。 在具体实施例中，用于将柔性第一层的突起上的电接触压到第二层上的电触点的弹簧装置包括浮动，以允许柔性第一层在用于柔性电路的改进的电互连系统的组装期间变形 。 在替代的具体实施例中，柔性第一层上的突起上的电接触和第二层上的对应的电触点涂覆有金。 在另一个具体实施例中，改进的电互连系统包括耦合到柔性第一层和第二层的对准装置和用于使柔性第一层与第二层和弹簧装置对准的弹簧装置。 与常规互连系统相比，用于柔性电路的改进的电互连系统提供更高的互连密度，降低的成本和增加的可靠性。

公开(公告)号：US5276964A

公开(公告)日：1994-01-11

申请号：US2159

申请日：1993-01-11

Applicant: Herbert R. Anderson, Jr. ,  Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  Donald E. Myers ,  Thomas J. Walsh

Inventor： Herbert R. Anderson, Jr. ,  Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  Donald E. Myers ,  Thomas J. Walsh

IPC: H01R4/02 ,  H01R12/52 ,  H01R43/02 ,  H01R43/16 ,  H05K3/40 ,  H05K3/20

CPC classification number: H01R12/526 ,  H05K3/4015 ,  H05K3/4046 ,  H01R4/02 ,  H01R43/02 ,  H01R43/16 ,  H05K2201/0129 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2203/1105 ,  H05K2203/1189 ,  H05K3/403 ,  Y10S29/044 ,  Y10S439/951 ,  Y10T29/49167 ,  Y10T29/49853 ,  Y10T29/53191

Abstract: There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system. A ball may contact conductive traces on two levels of the insulating body and thereby provide an electrical connection between conductive traces. A method of manufacture of the connector system includes the steps of heating the plastic body to an elevated temperature, and driving the small metal balls through or against a respective conductive trace and into the plastic body which thereby captivates it. The conductive traces may be solder plated. After a ball is seated in contact with a conductive trace, the solder plating may be reflowed.

Abstract translation: 公开了一种高密度电子连接器系统，其中塑料绝缘体在一个或多个层次上支撑多个导电电路迹线。 这些迹线的输出触点由小金属球提供。 金属球被驱动与相应的导电迹线紧密接触并被塑料体吸收。 球用金覆盖，并在连接器系统中提供微型，耐磨的紧密间隔的输出触点。 球可接触绝缘体两层的导电迹线，从而提供导电迹线之间的电连接。 制造连接器系统的方法包括以下步骤：将塑料体加热到升高的温度，并通过或抵靠相应的导电迹线驱动小金属球并进入塑料体，由此吸收它。 导电迹线可以是焊接电镀的。 在与导电迹线接触球后，可以回流焊接电镀。

公开(公告)号：US5161403A

公开(公告)日：1992-11-10

申请号：US720969

申请日：1991-06-25

Applicant: Keith G. Kitchens

Inventor： Keith G. Kitchens

IPC: B23P11/00 ,  H01R43/16 ,  H05K1/00 ,  H05K3/40

CPC classification number: B23P11/00 ,  H01R43/16 ,  H05K3/4007 ,  H05K1/0393 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2203/0113 ,  Y10T29/49155 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: Mechanical forming apparatus and method for manufacturing planar contact projections for a flexible circuit is disclosed. A forming die includes a punch assembly configured for mating with a die plate. The punch assembly comprises a pin plate coupled to a punch plate and configured to hold adjusting pins and forming punches, respectively. Each forming punch has a tail with a contoured tip that conforms to the geometry of a desired contact projection. The die plate has a plurality of cavities configured and dimensioned for receiving the tail tips of the punches. In operation, the punch assembly and die plate are placed in a die set and installed in an open position in a punch press with a flexible circuit positioned therein. When activated, the press closes the die set, causing the punch tails to push against the flexible circuit, while circuit material flows into the die plate cavities. As the cavities fill, any excess material is compressed into peripheral areas of the die plate surrounding the cavities. Accordingly, contact projections of a specific size and shape are formed.

Abstract translation: 公开了一种用于制造用于柔性电路的平面接触突起的机械成形装置和方法。 成型模具包括构造成与模板配合的冲头组件。 冲头组件包括联接到冲压板的销板，并且构造成分别保持调节销和成形冲头。 每个成形冲头具有尾部，其具有符合所需接触突起的几何形状的轮廓尖端。 模板具有多个空腔，其构造和尺寸适于接收冲头的尾端。 在操作中，将冲头组件和模具板放置在模具组中，并将其安装在冲压机中的打开位置，其中柔性电路位于其中。 当激活时，压力机关闭模具组，使得冲头向后推动柔性电路，同时电路材料流入模板腔。 当空腔填充时，任何多余的材料被压缩成围绕空腔的模具板的周边区域。 因此，形成具体尺寸和形状的接触突起。

公开(公告)号：US4894751A

公开(公告)日：1990-01-16

申请号：US197602

申请日：1988-05-20

Applicant: Ulrich Wehnelt

Inventor： Ulrich Wehnelt

IPC: B32B15/08 ,  H01L21/60 ,  H01L23/498 ,  H01L25/075 ,  H01L33/62 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K3/3442 ,  H01L23/4985 ,  H01L25/0753 ,  H05K1/184 ,  H05K3/326 ,  H01L2924/0002 ,  H01L33/62 ,  H05K1/183 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10454 ,  H05K2201/1059 ,  H05K2201/10643 ,  H05K2203/1105 ,  H05K2203/1189 ,  Y02P70/613

Abstract: An easily automated and heat-stable semiconductor contacting system for linear and planar SMD components, particularly LED arrangements. SMD components are applied to a carrier film coated with interconnects. The interconnects are entirely or partly formed of solderable material for simpler contacting through melting.

Abstract translation: 一种易于自动化和热稳定的用于线性和平面SMD元件的半导体接触系统，特别是LED布置。 将SMD组件应用于涂覆有互连件的载体膜。 互连件完全或部分地由可焊接材料形成，以通过熔化更简单地接触。

公开(公告)号：US4551914A

公开(公告)日：1985-11-12

申请号：US539345

申请日：1983-10-05

Applicant: William A. Stiggelbout

Inventor： William A. Stiggelbout

IPC: B23K1/00 ,  H01R4/02 ,  H01R43/02 ,  H05K1/11 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01R12/58 ,  H05K3/326 ,  H05K3/3447 ,  H01R4/028 ,  H01R43/02 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/1189 ,  H05K3/28 ,  H05K3/306 ,  H05K3/3468 ,  Y10T29/49139

Abstract: A method of providing electrical connections to a flexible circuit member having electrical contact pads of solderable material on one side. The contact pads and the flexible circuit are pierced with contact pins. Solder is caused to flow along the contact pins through the openings in the flexible circuit from the side opposite to that on which the contacts are disposed.

Abstract translation: 提供电连接到在一侧具有可焊接材料的电接触垫的柔性电路部件的方法。 接触垫和柔性电路用接触针刺穿。 使得焊料沿着接触销通过柔性电路中的开口从与触点设置的相反的一侧流动。

公开(公告)号：US4254448A

公开(公告)日：1981-03-03

申请号：US38742

申请日：1979-05-14

Applicant: Gerald J. Martyniak

Inventor： Gerald J. Martyniak

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K7/06

CPC classification number: H05K3/325 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/183 ,  H05K3/303 ,  H05K3/3421 ,  H05K1/111 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10393 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10598 ,  H05K2201/10651 ,  H05K2201/10689 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface of the board adjacent to positions where components are to be located. The component is placed on the board so that portions of the component are located adjacent to portions of the pins, following which portions of the pins are heated and formed about portions of the component to form plastic locking sections (22 or 37) that fasten the component to the board in a desired position. The mounting surface (16) of the board may be formed with a pocket (18 or 33) that receives and positions the component at the desired location, so that component leads (17 or 32) extend along the mounting surface to positions overlapping lead-contact areas (14, 34) of printed contact patterns deposited on the mounting surface, after which the leads are attached to the contact areas, as by reflow soldering.

Abstract translation: 电气部件（10或30）通过形成从板的安装表面突出的多个热塑性销（20,35）紧固到印刷电路板（11）的安装表面（16），邻近于部件的位置 被安置在。 部件被放置在板上，使得部件的一部分邻近销的部分定位，随后销的部分被加热并围绕部件的部分形成以形成塑料锁定部分（22或37） 组件到板的所需位置。 板的安装表面（16）可以形成有一个口袋（18或33），该口袋（18或33）将部件接收并定位在所需的位置，使得元件引线（17或32）沿着安装表面延伸， 接触区域（14,34），其沉积在安装表面上，之后通过回流焊接将引线附接到接触区域。

公开(公告)号：US4215387A

公开(公告)日：1980-07-29

申请号：US946916

申请日：1978-09-28

Applicant: Kiyoshi Negishi ,  Katsuhiko Miyata

Inventor： Kiyoshi Negishi ,  Katsuhiko Miyata

IPC: H05K1/02 ,  G03B17/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/36 ,  H05K3/46 ,  H02B1/04

CPC classification number: H05K1/147 ,  H05K1/189 ,  H05K1/142 ,  H05K2201/041 ,  H05K2201/091 ,  H05K2201/10151 ,  H05K2201/10689 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/361

Abstract: A multi-layer flexible printed circuit board assembly, having at least two flexible printed circuit boards with electrical conductive layers piled one on another. The conductive layers face in the same direction and a portion of the lower flexible printed circuit board is not covered with the upper flexible printed circuit board. Hence, some of the lead wires of an electronic component can be connected to the electrical conductive layer of the upper flexible printed circuit board, and the remaining lead wires can be connected to said electrical conductive layer of the lower flexible printed circuit board. The portion of the lower flexible printed circuit board which is not covered by the upper flexible printed circuit board is raised so that the surface of a copper foil layer on the upper flexible printed circuit board is substantially flush with the surface of a copper foil layer on the lower flexible printed circuit board.

Abstract translation: 一种多层柔性印刷电路板组件，其具有至少两个柔性印刷电路板，其中导电层彼此堆叠。 导电层面向相同的方向，并且下部柔性印刷电路板的一部分未被上部柔性印刷电路板覆盖。 因此，电子部件的一些引线可以连接到上部柔性印刷电路板的导电层，并且剩余的引线可以连接到下部柔性印刷电路板的所述导电层。 下柔性印刷电路板的未被上柔性印刷电路板覆盖的部分被升高，使得上柔性印刷电路板上的铜箔层的表面基本上与铜箔层的表面平齐 下柔性印刷电路板。

公开(公告)号：US3978375A

公开(公告)日：1976-08-31

申请号：US460886

申请日：1974-04-15

Applicant: Noriaki Fukui ,  Toyokiti Yamasita

Inventor： Noriaki Fukui ,  Toyokiti Yamasita

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H05K7/06 ,  H05K1/04

CPC classification number: H05K3/3447 ,  H05K3/202 ,  H05K7/06 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/0292 ,  H05K2201/0373 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/09681 ,  H05K2201/10583 ,  H05K2201/2072 ,  H05K2203/0723 ,  H05K2203/161 ,  H05K2203/175 ,  H05K3/301 ,  H05K3/3468 ,  H05K3/4092 ,  H05K3/4685

Abstract: A wiring unit of high reliability is obtained without the need for any chemical treatment. It is obtained by assembling a wiring means having a predetermined wiring pattern and made from a conductive plate into an insulating frame having a predetermined pattern and electrically connecting circuit elements to the wiring means.

公开(公告)号：US3843951A

公开(公告)日：1974-10-22

申请号：US32721073

申请日：1973-01-26

Applicant: BELL NORTHERN RESEARCH LTD

Inventor： MAHEUX P

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/36 ,  H05K7/10 ,  H05K1/04

CPC classification number: H05K3/326 ,  H05K1/182 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/365 ,  H05K3/366 ,  H05K7/1076 ,  H05K2201/09036 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/1059 ,  H05K2201/10689

Abstract: Method of connecting an electrical component to a flexible circuit in which the flexible circuit is positioned in, or over, a formation on a support member and the component has a cooperating formation which is pressed into engagement with the formation on the support member. Contact members on the components are held in electrical contact with the flexible circuit.

Abstract translation: 将电气部件连接到柔性电路的方法，其中柔性电路定位在支撑构件上的结构中或上方，并且该部件具有被压配合在支撑构件上的结构的配合结构。 部件上的接触件与柔性电路保持电接触。

公开(公告)号：US3501832A

公开(公告)日：1970-03-24

申请号：US3501832D

申请日：1967-02-20

Applicant: SONY CORP

Inventor： IWATA SABURO ,  MISAWA AKIRA

IPC: H01L21/60 ,  H01L23/057 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/34 ,  B23K31/02

CPC classification number: H01L24/75 ,  H01L23/057 ,  H01L23/49833 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0393 ,  H05K3/341 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2203/0173 ,  H05K2203/0278 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29099