公开(公告)号：US07034389B2

公开(公告)日：2006-04-25

申请号：US10839157

申请日：2004-05-06

Applicant: Kenji Morimoto ,  Hiroshi Ochi

Inventor： Kenji Morimoto ,  Hiroshi Ochi

IPC: H01L23/48

CPC classification number: H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/45144 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/3025 ,  H05K1/092 ,  H05K1/111 ,  H05K3/02 ,  H05K3/321 ,  H05K2201/0367 ,  H05K2201/098 ,  H05K2201/10674 ,  H05K2203/0514 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05599

Abstract: According to the present invention, when a semiconductor element having protruding electrodes formed thereon is connected to a circuit board via conductive resin, stable connection is made even when an electrode pitch is small on the semiconductor element. On semiconductor element package regions on the circuit board, a paste electrode material containing photopolymerizable materials is printed to form a film having a prescribed thickness, and this electrode material film is baked after exposure and development thereof so as to obtain circuit electrodes having edges warped in a direction of going apart from the circuit board surface. Then, the protruding electrodes and the concave surfaces of the circuit electrodes are brought in abutment with each other and connected via the conductive resin which surrounds the abutments between the respective electrodes and is held on the concave surfaces of the circuit electrodes. With this arrangement, the concave surfaces of the circuit electrodes act as saucers and prevent the conductive resin from being squeezed out, thereby eliminating possible occurrence of short circuits.

公开(公告)号：US07020961B2

公开(公告)日：2006-04-04

申请号：US10268722

申请日：2002-10-11

Applicant: Yutaka Kaneda ,  Keiichi Naito ,  Soichiro Kishimoto ,  Toshihiro Shinohara

Inventor： Yutaka Kaneda ,  Keiichi Naito ,  Soichiro Kishimoto ,  Toshihiro Shinohara

IPC: H01K3/10

CPC classification number: H05K3/06 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K3/20 ,  H05K3/202 ,  H05K3/388 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask (7) is formed on the bump formation side (3a) of a metal foil (3) having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit (1) and the height t2 of the bumps (2) to be formed on a wiring circuit (1), the bumps (2) are formed by half-etching the metal foil (3) from the bump formation etching mask (7) side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer (10) composed of a different metal from the metal foil (3) is formed on the bump formation side of the metal foil (3), thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract translation: 本发明的目的是制造具有稳定的凸点连接的凸块附接布线电路板，并且不需要电镀预处理等麻烦的操作。 在具有等于布线电路的厚度t 1之和（t 1 + t 2）的金属箔（3）的凸块形成侧（3a）上形成凸点形成蚀刻掩模（7） 1）和在布线电路（1）上形成的凸块（2）的高度t 2，通过从凸块形成蚀刻掩模（7）半蚀刻金属箔（3）形成凸块（2） 在金属箔（3）的凸点形成侧形成有与金属箔（3）不同的金属构成的金属薄膜层（10） 从而提供具有凸起连接的布线电路板，通过该布线电路板可以进行稳定的凸点连接，并且不需要麻烦的操作，例如电镀预处理。

公开(公告)号：US07019393B2

公开(公告)日：2006-03-28

申请号：US10920659

申请日：2004-08-18

Applicant: Shigetaka Toriyama

Inventor： Shigetaka Toriyama

IPC: H01L23/48 ,  G02F1/1345

CPC classification number: H01L24/83 ,  G02F1/13452 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0106 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/1189

Abstract: On a glass substrate of a liquid crystal display device, electrode parts to which metallic electrodes (bumps) of an IC circuit are connected from an upper part are formed. The electrode parts are formed by opening an interlayer dielectric film at parts corresponding to metal wiring and forming land shaped electrode pads in the opening parts. In this invention, the planar forms of the electrode pads are smaller than the opening parts of the interlayer dielectric film. Thus, the planarization of the peripheral surfaces around the electrode parts is improved. Accordingly, integrated circuit devices (IC) or semiconductor chips can be connected with high reliability.

Abstract translation: 在液晶显示装置的玻璃基板上，形成有IC电路的金属电极（凸块）从上部连接的电极部。 通过在对应于金属布线的部分打开层间电介质膜并在开口部分形成焊盘形电极焊盘来形成电极部分。 在本发明中，电极焊盘的平面形状小于层间绝缘膜的开口部分。 因此，提高了电极部周围的周边表面的平坦化。 因此，可以以高可靠性连接集成电路器件（IC）或半导体芯片。

公开(公告)号：US20060060968A1

公开(公告)日：2006-03-23

申请号：US11269053

申请日：2005-11-08

Applicant: James Wark ,  Salman Akram

Inventor： James Wark ,  Salman Akram

IPC: H01L23/48

CPC classification number: H01L24/10 ,  G01R1/06738 ,  H01L22/34 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10734 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may be provided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.

公开(公告)号：US07005751B2

公开(公告)日：2006-02-28

申请号：US10410948

申请日：2003-04-10

Applicant: Igor Y. Khandros ,  Charles A. Miller ,  Stuart W. Wenzel

Inventor： Igor Y. Khandros ,  Charles A. Miller ,  Stuart W. Wenzel

IPC: H01L23/48

CPC classification number: H05K3/4007 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73251 ,  H01L2224/81901 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01R12/57 ,  H01R43/007 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09909 ,  Y10T29/49147 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device over the compliant pad to its end area. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. A horizontal microelectronic spring contact and method of making the same are also disclosed. The horizontal spring contact has a rigid trace attached at a first end to a terminal of a substrate. The trace is free from attachment at its second end, and extends from the terminal in a direction substantially parallel to a surface of the substrate to the second end. At least a distal portion of the trace extending to the second end is spaced apart from the surface of the substrate. The spaced-apart distal portion is flexible in a plane parallel to the substrate.

Abstract translation: 公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。 弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。 柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。 迹线从器件的端子通过柔性焊盘延伸到其端部区域。 柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。 还公开了一种水平微电子弹簧触头及其制造方法。 水平弹簧触点具有在第一端附接到基板的端子的刚性迹线。 该迹线在其第二端处没有附着，并且从基板平行于基板的表面的方向从端子延伸到第二端。 至少延伸到第二端的迹线的远端部分与衬底的表面间隔开。 间隔开的远侧部分在平行于基底的平面中是柔性的。

公开(公告)号：US20060003648A1

公开(公告)日：2006-01-05

申请号：US10531494

申请日：2003-05-13

Applicant: Gareth Hougham ,  Keith Fogel ,  Paul Lauro ,  Joseph Zinter Jr

Inventor： Gareth Hougham ,  Keith Fogel ,  Paul Lauro ,  Joseph Zinter Jr

IPC: B32B5/02 ,  B32B27/12 ,  B32B27/04

CPC classification number: H01R13/2414 ,  H01R12/7082 ,  H01R12/714 ,  H01R43/007 ,  H05K3/4007 ,  H05K3/42 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0959 ,  H05K2201/10378 ,  Y10S439/931 ,  Y10T442/109 ,  Y10T442/172

Abstract: Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.

公开(公告)号：US06972966B1

公开(公告)日：2005-12-06

申请号：US09661187

申请日：2000-09-13

Applicant: Eiji Oishi ,  Kogo Endo

Inventor： Eiji Oishi ,  Kogo Endo

IPC: G02F1/1345 ,  G02F1/13 ,  G02F1/1333 ,  G09F9/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K1/141 ,  G02F1/13452 ,  H05K1/181 ,  H05K1/189 ,  H05K3/28 ,  H05K3/321 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0367 ,  H05K2201/10136

Abstract: A composite flexible wiring board comprises a first flexible wiring board and a second flexible wiring board on which a surface-mounted part is provided. The second flexible wiring board is disposed on the first flexible wiring board in its predetermined area. The first flexible wiring board and the second flexible wiring board are electrically connected to each other through an interlayer contact portion provided in a predetermined position. The first flexible wiring board has an input terminal region and an output terminal region with a power IC chip mounted on the first flexible wiring board.

Abstract translation: 复合柔性布线板包括第一柔性布线板和设置有表面安装部件的第二柔性布线板。 第二柔性布线板在其预定区域中设置在第一柔性布线板上。 第一柔性布线板和第二柔性布线板通过设置在预定位置的层间接触部分彼此电连接。 第一柔性布线板具有输入端子区域和具有安装在第一柔性布线板上的功率IC芯片的输出端子区域。

公开(公告)号：US20050253992A1

公开(公告)日：2005-11-17

申请号：US11124803

申请日：2005-05-09

Applicant: Shinichi Tomari ,  Futoshi Nakanishi

Inventor： Shinichi Tomari ,  Futoshi Nakanishi

IPC: G02F1/1345 ,  G02F1/13 ,  G02F1/1333 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40

CPC classification number: G02F1/13452 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4007 ,  H05K2201/0326 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09909

Abstract: A LCD device includes external terminals for metallic interconnects in a peripheral area on which TCPs are mounted. The external terminal includes a first ITO film connected to the metallic interconnect, a second ITO film formed on the first ITO film and a plurality of insulator islands sandwiched between the first ITO film and the second ITO film. The surface of the second ITO film has convex and concave portions whereby electric connection between the terminal of the TCP and the second ITO film is improved.

Abstract translation: LCD装置包括在安装有TCP的外围区域中的用于金属互连的外部端子。 外部端子包括连接到金属互连的第一ITO膜，形成在第一ITO膜上的第二ITO膜和夹在第一ITO膜和第二ITO膜之间的多个绝缘体岛。 第二ITO膜的表面具有凸部和凹部，从而提高了TCP端子与第二ITO膜之间的电连接。

公开(公告)号：US20050245059A1

公开(公告)日：2005-11-03

申请号：US10836152

申请日：2004-04-30

Applicant: Yuan Yuan ,  Burton Carpenter ,  Rung-Kuang Lo ,  Joachim Rayos

Inventor： Yuan Yuan ,  Burton Carpenter ,  Rung-Kuang Lo ,  Joachim Rayos

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/485 ,  H05K3/10 ,  H05K3/24 ,  H05K3/40

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2924/0001 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2203/0723 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An interconnect pad is made to have a convex shape which is a shape that has been found to useful in improving the reliability of solder joints. A seed pillar is formed by plating over a metal layer. This seed pillar is smaller than the intended size of the interconnect pad. After formation of this small seed pillar, a plating step is performed over the pillar that forms the desired convex shape for the interconnect pad.

Abstract translation: 互连焊盘被制成具有已被发现可用于提高焊点可靠性的形状的凸形状。 通过在金属层上电镀形成种子柱。 该种子柱小于互连焊盘的预期尺寸。 在形成这种小种子柱之后，在形成用于互连衬垫的所需凸形状的柱上执行电镀步骤。

公开(公告)号：US20050239229A1

公开(公告)日：2005-10-27

申请号：US11114977

申请日：2005-04-26

Applicant: Koji Imai ,  Yuji Shinkai

Inventor： Koji Imai ,  Yuji Shinkai

IPC: B41J2/16 ,  B23K3/06 ,  H01L21/00 ,  H05K3/36

CPC classification number: B23K3/0623 ,  B41J2002/14459 ,  H05K3/363 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2203/0278

Abstract: A method of electrically connecting a wiring member to a plurality of electrodes which respectively correspond to a plurality of recording elements of a recording head, the wiring member including a plurality of wire portions and a plurality of terminal portions each of which is connected to the corresponding wire portion, the method including: forming convex bumps by using a conductive solder, respectively on the plurality of terminal portions; and connecting the plurality of terminal portions and the plurality of electrodes respectively to one another via the respective convex bumps by heating and melting the convex bumps at a predetermined temperature with the convex bumps pressed respectively onto the plurality of electrodes with a predetermined load, wherein the connecting the plurality of terminal portions and the plurality of electrodes is carried out such that the predetermined load and the predetermined temperature are decreased with an increase in a height of the convex bumps.

Abstract translation: 一种将配线构件电连接到分别对应于记录头的多个记录元件的多个电极的方法，所述布线构件包括多个线部分和多个端子部分，每个端子部分连接到相应的 所述方法包括：分别在所述多个端子部分上使用导电焊料形成凸起凸起; 以及通过以预定的载荷将凸起凸起分别按压到所述多个电极上的凸起凸起在预定温度下加热和熔化所述凸起凸起，通过相应的凸起凸块将所述多个端子部分和所述多个电极分别彼此连接， 连接多个端子部分和多个电极被执行，使得预定负载和预定温度随着凸起凸块的高度的增加而减小。