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    ALIGNMENT FRAME FOR RETAINING A MODULE ON A CIRCUIT BOARD
    231.
    发明申请
    ALIGNMENT FRAME FOR RETAINING A MODULE ON A CIRCUIT BOARD 失效
    用于在电路板上保留模块的对准框架

    公开(公告)号：US20110306219A1

    公开(公告)日：2011-12-15

    申请号：US12814239

    申请日：2010-06-11

    Applicant: NATHAN W. SWANGER ,  JUSTIN S. MCCLELLAN

    Inventor： NATHAN W. SWANGER ,  JUSTIN S. MCCLELLAN

    IPC: H01R13/64 ,  H01R12/14

    CPC classification number: H05K7/10 ,  H01L23/32 ,  H01L2924/0002 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/09063 ,  H05K2201/2018 ,  H05K2203/167 ,  Y10S439/903 ,  H01L2924/00

    Abstract: An alignment frame is provided. The frame includes a plurality of frame members coupled together to form a base. The base is configured to surround an electronic module to provide a protective cover for the electronic module. The base includes corners formed at intersections of the frame members. An alignment member is positioned on at least one corner of the base. The alignment member is configured to align an electronic module with respect to an electrical connector on a circuit board. A coupling member extends from at least one corner of the base. The coupling member is configured to be through-hole mounted to an aperture in the circuit board. The coupling member includes a retention feature configured to create a press-fit with an inner surface of the aperture.

    Abstract translation: 提供了对准框架。 该框架包括联接在一起以形成底座的多个框架构件。 基座被配置为围绕电子模块以提供电子模块的保护盖。 基部包括在框架构件的交叉处形成的角部。 对准构件位于基座的至少一个角上。 对准构件被配置为相对于电路板上的电连接器对准电子模块。 联接构件从基座的至少一个角延伸。 联接构件被配置为安装到电路板中的孔的通孔。 联接构件包括保持构件，其构造成与孔的内表面形成压配合。

    Electronic circuit substrate
    232.
    发明申请
    Electronic circuit substrate 审中-公开
    电子电路基板

    公开(公告)号：US20110305852A1

    公开(公告)日：2011-12-15

    申请号：US13110485

    申请日：2011-05-18

    Applicant: Hiroshi SUGAYA

    Inventor： Hiroshi SUGAYA

    IPC: H05K1/02

    CPC classification number: H05K3/0044 ,  H05K3/366 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2203/0228

    Abstract: In a method of machining an electronic circuit substrate in which a sub-substrate is attached to a main substrate, an electronic circuit substrate and a method of machining the same in which the sub-substrate can be attached to the main substrate with high degree of accuracy are provided without forming the arcuate portions at corners of the outline of the substrate and corners of an insertion hole even when a router is used for machining substrates.The sub-substrate 2 is machined using a router as a rotating tool so as to form a notch 5 from a position of a corner where a side surface of a projecting portion and one side of the sub-substrate 2 intersect along one side of the sub-substrate, and the main substrate 10 is machined using the router as a rotating tool so as to have an insertion bore 11 which allows insertion of the sub-substrate and the insertion bore includes a square hole corresponding to the length and the thickness of the projecting portion of the sub-substrate 2 and an incised portion 2 extending from the corner of the square hole along the long side of the square hole.

    Abstract translation: 在将基板安装在主基板上的电子电路基板的加工方法中，电子电路基板及其加工方法，其中副基板能以高度的方式附着在主基板上 即使在路由器用于加工基板时，也不会在基板轮廓的角部和插入孔的角部形成弓形部。 副基板2使用路由器作为旋转工具进行加工，以便从突出部分的侧表面和副基板2的一侧的一侧的一侧的角部的位置形成切口5， 副基板，并且使用路由器作为旋转工具来加工主基板10，以具有插入孔11，其允许插入子基板，并且插入孔包括对应于长度和厚度的方孔 副基板2的突出部分和沿着方孔的长边从方孔的角延伸的切口部分2。

    ELECTRICAL CONNECTOR WITH PRINTED CIRCUIT BOARD SUBASSEMBLY
    235.
    发明申请
    ELECTRICAL CONNECTOR WITH PRINTED CIRCUIT BOARD SUBASSEMBLY 有权
    带印刷电路板的电气连接器

    公开(公告)号：US20110275246A1

    公开(公告)日：2011-11-10

    申请号：US12774535

    申请日：2010-05-05

    Applicant: John Kooiman

    Inventor： John Kooiman

    IPC: H01R13/66 ,  H05K3/30 ,  H01R24/00

    CPC classification number: H01R13/6474 ,  H01R9/038 ,  H01R13/6593 ,  H01R13/6658 ,  H01R24/86 ,  H05K1/0227 ,  H05K1/0233 ,  H05K1/117 ,  H05K1/183 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/1034 ,  H05K2201/10356 ,  H05K2201/10674 ,  Y10T29/4913

    Abstract: An electrical connector and method of forming the same are provided, where the electrical connector includes a printed circuit board configured to exhibit a first length L, a first width W, a thickness T, and a slot of a slot-width approximately equal to T, the slot also exhibiting a slot-length at least approximately equal to one-half of L. The printed circuit board includes at least a first signal trace, a second signal trace, and a ground plane, where the printed circuit board is configured to electrically isolate the first signal trace and the second signal trace from the ground plane. The first signal trace is configured to make electrical contact with at least a first electrically conductive cable. The electrical connector also includes at least a first contact pin affixed to the printed circuit board and coupled to the second signal trace.

    Abstract translation: 提供一种电连接器及其形成方法，其中电连接器包括印刷电路板，该印刷电路板被配置为呈现出第一长度L，第一宽度W，厚度T和大约等于T的槽宽度的槽 该槽还具有至少近似等于L的一半的槽长度。印刷电路板至少包括第一信号迹线，第二信号迹线和接地平面，其中印刷电路板被配置为 将第一信号迹线和第二信号迹线与地平面电隔离。 第一信号迹线被配置为与至少第一导电电缆电接触。 电连接器还包括固定到印刷电路板并耦合到第二信号迹线的至少第一接触引脚。

    Light-emitting diode module
    236.
    发明授权
    Light-emitting diode module 有权
    发光二极管模块

    公开(公告)号：US08052302B2

    公开(公告)日：2011-11-08

    申请号：US12702300

    申请日：2010-02-09

    Applicant: Tzu-Hui Hsu ,  Yen-Po Yeh

    Inventor： Tzu-Hui Hsu ,  Yen-Po Yeh

    IPC: F21V21/00

    CPC classification number: H05K3/361 ,  H05K1/0271 ,  H05K2201/09063 ,  H05K2201/10106

    Abstract: An LED module including an LED light bar and a FPC is provided. The LED light bar includes a circuit board and a plurality of LED devices. The circuit board has a first surface, a second surface, first pins, second pins, and a slot. The LED devices are disposed on the first surface and electrically connected with the first pins. The FPC passes through the slot and is electrically connected with the second pins. The FPC includes a first bonding part, a second bonding part, and a bending part. The first bonding part has a plurality of third pins electrically connected with the second pins and is in contact with the first surface of the circuit board. The second bonding part has a plurality of fourth pins electrically connected with a control board. The bending part connects between the first part and the second part and passes through the slot.

    Abstract translation: 提供了包括LED灯条和FPC的LED模块。 LED灯条包括电路板和多个LED器件。 电路板具有第一表面，第二表面，第一销，第二销和槽。 LED器件设置在第一表面上并与第一引脚电连接。 FPC穿过狭槽并与第二针电连接。 FPC包括第一接合部分，第二接合部分和弯曲部分。 第一接合部具有与第二引脚电连接并与电路板的第一表面接触的多个第三引脚。 第二接合部具有与控制板电连接的多个第四引脚。 弯曲部分在第一部分和第二部分之间连接并穿过狭槽。

    Circuit board having holes to increase resonant frequency of via stubs
    237.
    发明申请
    Circuit board having holes to increase resonant frequency of via stubs 失效
    具有孔以增加通孔短路的谐振频率的电路板

    公开(公告)号：US20110267783A1

    公开(公告)日：2011-11-03

    申请号：US12770691

    申请日：2010-04-29

    Applicant: Bhyrav M. Mutnury ,  Nam H. Pham ,  Terence Rodrigues

    Inventor： Bhyrav M. Mutnury ,  Nam H. Pham ,  Terence Rodrigues

    IPC: H05K1/18 ,  H05K3/46 ,  H05K1/11

    CPC classification number: H05K3/42 ,  H05K1/024 ,  H05K1/0251 ,  H05K1/115 ,  H05K2201/0792 ,  H05K2201/09063 ,  Y10T29/49165

    Abstract: A circuit board includes layers, a pair of vias filled with a conductive material and extending through the layers, first and second pairs of conductive signal paths, and holes extending at least partially through the layers and located between the pair of vias. The first pair of conductive paths is connected to the pair of vias within a first layer; the second pair of conductive paths is connected to the pair of vias within a second layer. The pair of vias has a pair of via stubs defined between the second layer and a bottom layer. A differential signal is to be transmitted between the first and second pairs of conductive signal paths via the pair of vias. The holes have a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal.

    Abstract translation: 电路板包括层，填充有导电材料并延伸通过层的一对通孔，第一和第二对导电信号路径，以及至少部分延伸通过层并且位于该对通孔之间的孔。 第一对导电路径连接到第一层内的一对通孔; 第二对导电路径连接到第二层内的一对通孔。 一对通孔具有限定在第二层和底层之间的一对通孔短截线。 差分信号将经由一对通孔在第一和第二对导电信号路径之间传输。 这些孔具有比层更低的介电常数，以增加一对通孔短路的谐振频率超过差分信号的频率。

    ELECTRONIC DEVICE AND POWER CONVERTER
    239.
    发明申请
    ELECTRONIC DEVICE AND POWER CONVERTER 有权
    电子设备和电源转换器

    公开(公告)号：US20110226514A1

    公开(公告)日：2011-09-22

    申请号：US13048904

    申请日：2011-03-16

    Applicant: Yasunori YAMANAKA

    Inventor： Yasunori YAMANAKA

    IPC: H05K1/00 ,  H05K1/16

    CPC classification number: H05K3/306 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/0761 ,  H05K2201/09063 ,  H05K2203/1572

    Abstract: An electronic device includes an electronic component provided with leads. A printed circuit board has a front surface and a back surface and is provided with through holes and a groove hole. The through holes are capable of receiving the leads, respectively. The groove hole is formed so as to cross straight lines that connect the through holes. A first insulating spacer is provided on the groove hole between the leads so as to isolate the leads from each other and is positioned between the electronic component and the front surface of the printed circuit board. A second insulating spacer is inserted through the groove hole from the back surface of the printed circuit board and engages with the first insulating spacer so as to isolate end portions of the leads from each other.

    Abstract translation: 电子设备包括具有引线的电子部件。 印刷电路板具有前表面和后表面，并且设置有通孔和凹槽。 通孔能够分别接收引线。 凹槽形成为穿过连接通孔的直线。 在引线之间的槽孔中设置第一绝缘隔离物，以将引线彼此隔离并且位于电子部件和印刷电路板的前表面之间。 第二绝缘隔离物从印刷电路板的后表面穿过槽孔插入，并与第一绝缘垫片接合，以使导线的端部彼此隔离。

    DISPLAY DEVICE
    240.
    发明申请
    DISPLAY DEVICE 审中-公开
    显示设备

    公开(公告)号：US20110211139A1

    公开(公告)日：2011-09-01

    申请号：US13126996

    申请日：2009-08-03

    Applicant: Motomitsu Itoh

    Inventor： Motomitsu Itoh

    IPC: G02F1/1333 ,  H05K1/14

    CPC classification number: H05K1/147 ,  G02F1/13452 ,  H05K1/0271 ,  H05K3/0058 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/10409 ,  H05K2203/167

    Abstract: A liquid crystal display device 1 includes a liquid crystal panel (display unit) 2 having a plurality of pixels P to display information on the liquid crystal panel 2. The liquid crystal display device 1 is provided with printed circuit boards 10, and flexible printed circuit boards 9 connected electrically with the printed circuit boards 10. The printed circuit boards 10 are mounted on a frame (mounting member) 13 at the substantially central portion on a longer side (one side) to which the flexible printed circuit boards 9 are connected in the vicinity of the flexible printed circuit boards 9.

    Abstract translation: 液晶显示装置1包括具有多个像素P以在液晶面板2上显示信息的液晶面板（显示单元）2。液晶显示装置1设置有印刷电路板10和柔性印刷电路 板9与印刷电路板10电连接。印刷电路板10在柔性印刷电路板9连接的较长侧（一侧）上的大致中央部分处安装在框架（安装构件）13上 柔性印刷电路板9附近。

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